JPWO2023171572A5 - - Google Patents

Info

Publication number
JPWO2023171572A5
JPWO2023171572A5 JP2024506286A JP2024506286A JPWO2023171572A5 JP WO2023171572 A5 JPWO2023171572 A5 JP WO2023171572A5 JP 2024506286 A JP2024506286 A JP 2024506286A JP 2024506286 A JP2024506286 A JP 2024506286A JP WO2023171572 A5 JPWO2023171572 A5 JP WO2023171572A5
Authority
JP
Japan
Prior art keywords
component
epoxy resin
curing agent
resin composition
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024506286A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023171572A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/008106 external-priority patent/WO2023171572A1/ja
Publication of JPWO2023171572A1 publication Critical patent/JPWO2023171572A1/ja
Publication of JPWO2023171572A5 publication Critical patent/JPWO2023171572A5/ja
Pending legal-status Critical Current

Links

JP2024506286A 2022-03-09 2023-03-03 Pending JPWO2023171572A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022036282 2022-03-09
PCT/JP2023/008106 WO2023171572A1 (ja) 2022-03-09 2023-03-03 一液型エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2023171572A1 JPWO2023171572A1 (https=) 2023-09-14
JPWO2023171572A5 true JPWO2023171572A5 (https=) 2026-02-25

Family

ID=87935347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024506286A Pending JPWO2023171572A1 (https=) 2022-03-09 2023-03-03

Country Status (7)

Country Link
US (1) US20250109240A1 (https=)
EP (1) EP4491653A4 (https=)
JP (1) JPWO2023171572A1 (https=)
KR (1) KR20240157650A (https=)
CN (1) CN118679205A (https=)
TW (1) TW202346400A (https=)
WO (1) WO2023171572A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026063438A1 (ja) * 2024-09-19 2026-03-26 日油株式会社 硬化性樹脂組成物、封止材、および該硬化性樹脂組成物の硬化物で封止された電子部品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0304503B1 (en) 1987-08-26 1994-06-29 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
JP3146320B2 (ja) * 1991-11-18 2001-03-12 東都化成株式会社 エポキシ樹脂組成物
JP3579800B2 (ja) * 1994-12-14 2004-10-20 東都化成株式会社 低誘電性エポキシ樹脂組成物
JP2004231787A (ja) 2003-01-30 2004-08-19 Nippon Steel Chem Co Ltd エポキシ樹脂希釈剤、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP4405741B2 (ja) 2003-03-10 2010-01-27 旭化成イーマテリアルズ株式会社 マスターバッチ型硬化剤および一液性エポキシ樹脂組成物
JP4509715B2 (ja) 2004-09-16 2010-07-21 株式会社クラレ ジグリシジルエーテル、硬化性組成物および硬化物
JP5342200B2 (ja) * 2008-09-22 2013-11-13 三洋化成工業株式会社 エポキシ樹脂用反応性希釈剤および熱硬化性エポキシ樹脂組成物
DE102011015193A1 (de) * 2011-03-25 2012-09-27 Momentive Specialty Chemicals Gmbh Epoxidierte Arylalkylphenole

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