JPWO2023171572A1 - - Google Patents

Info

Publication number
JPWO2023171572A1
JPWO2023171572A1 JP2024506286A JP2024506286A JPWO2023171572A1 JP WO2023171572 A1 JPWO2023171572 A1 JP WO2023171572A1 JP 2024506286 A JP2024506286 A JP 2024506286A JP 2024506286 A JP2024506286 A JP 2024506286A JP WO2023171572 A1 JPWO2023171572 A1 JP WO2023171572A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024506286A
Other languages
Japanese (ja)
Other versions
JPWO2023171572A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023171572A1 publication Critical patent/JPWO2023171572A1/ja
Publication of JPWO2023171572A5 publication Critical patent/JPWO2023171572A5/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/223Di-epoxy compounds together with monoepoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00Compositions for adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
JP2024506286A 2022-03-09 2023-03-03 Pending JPWO2023171572A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022036282 2022-03-09
PCT/JP2023/008106 WO2023171572A1 (ja) 2022-03-09 2023-03-03 一液型エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2023171572A1 true JPWO2023171572A1 (https=) 2023-09-14
JPWO2023171572A5 JPWO2023171572A5 (https=) 2026-02-25

Family

ID=87935347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024506286A Pending JPWO2023171572A1 (https=) 2022-03-09 2023-03-03

Country Status (7)

Country Link
US (1) US20250109240A1 (https=)
EP (1) EP4491653A4 (https=)
JP (1) JPWO2023171572A1 (https=)
KR (1) KR20240157650A (https=)
CN (1) CN118679205A (https=)
TW (1) TW202346400A (https=)
WO (1) WO2023171572A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026063438A1 (ja) * 2024-09-19 2026-03-26 日油株式会社 硬化性樹脂組成物、封止材、および該硬化性樹脂組成物の硬化物で封止された電子部品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0304503B1 (en) 1987-08-26 1994-06-29 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
JP3146320B2 (ja) * 1991-11-18 2001-03-12 東都化成株式会社 エポキシ樹脂組成物
JP3579800B2 (ja) * 1994-12-14 2004-10-20 東都化成株式会社 低誘電性エポキシ樹脂組成物
JP2004231787A (ja) 2003-01-30 2004-08-19 Nippon Steel Chem Co Ltd エポキシ樹脂希釈剤、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP4405741B2 (ja) 2003-03-10 2010-01-27 旭化成イーマテリアルズ株式会社 マスターバッチ型硬化剤および一液性エポキシ樹脂組成物
JP4509715B2 (ja) 2004-09-16 2010-07-21 株式会社クラレ ジグリシジルエーテル、硬化性組成物および硬化物
JP5342200B2 (ja) * 2008-09-22 2013-11-13 三洋化成工業株式会社 エポキシ樹脂用反応性希釈剤および熱硬化性エポキシ樹脂組成物
DE102011015193A1 (de) * 2011-03-25 2012-09-27 Momentive Specialty Chemicals Gmbh Epoxidierte Arylalkylphenole

Also Published As

Publication number Publication date
EP4491653A4 (en) 2026-03-18
WO2023171572A1 (ja) 2023-09-14
KR20240157650A (ko) 2024-11-01
US20250109240A1 (en) 2025-04-03
EP4491653A1 (en) 2025-01-15
CN118679205A (zh) 2024-09-20
TW202346400A (zh) 2023-12-01

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Legal Events

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Effective date: 20260213

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