TW202346400A - 單液型環氧樹脂組合物 - Google Patents

單液型環氧樹脂組合物 Download PDF

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Publication number
TW202346400A
TW202346400A TW112108113A TW112108113A TW202346400A TW 202346400 A TW202346400 A TW 202346400A TW 112108113 A TW112108113 A TW 112108113A TW 112108113 A TW112108113 A TW 112108113A TW 202346400 A TW202346400 A TW 202346400A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
component
resin composition
hardener
general formula
Prior art date
Application number
TW112108113A
Other languages
English (en)
Chinese (zh)
Inventor
三輪琢哉
長谷川由依
玉祖健一
Original Assignee
日商艾迪科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商艾迪科股份有限公司 filed Critical 日商艾迪科股份有限公司
Publication of TW202346400A publication Critical patent/TW202346400A/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/223Di-epoxy compounds together with monoepoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00Compositions for adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
TW112108113A 2022-03-09 2023-03-06 單液型環氧樹脂組合物 TW202346400A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-036282 2022-03-09
JP2022036282 2022-03-09

Publications (1)

Publication Number Publication Date
TW202346400A true TW202346400A (zh) 2023-12-01

Family

ID=87935347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112108113A TW202346400A (zh) 2022-03-09 2023-03-06 單液型環氧樹脂組合物

Country Status (7)

Country Link
US (1) US20250109240A1 (https=)
EP (1) EP4491653A4 (https=)
JP (1) JPWO2023171572A1 (https=)
KR (1) KR20240157650A (https=)
CN (1) CN118679205A (https=)
TW (1) TW202346400A (https=)
WO (1) WO2023171572A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026063438A1 (ja) * 2024-09-19 2026-03-26 日油株式会社 硬化性樹脂組成物、封止材、および該硬化性樹脂組成物の硬化物で封止された電子部品

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0304503B1 (en) 1987-08-26 1994-06-29 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
JP3146320B2 (ja) * 1991-11-18 2001-03-12 東都化成株式会社 エポキシ樹脂組成物
JP3579800B2 (ja) * 1994-12-14 2004-10-20 東都化成株式会社 低誘電性エポキシ樹脂組成物
JP2004231787A (ja) 2003-01-30 2004-08-19 Nippon Steel Chem Co Ltd エポキシ樹脂希釈剤、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP4405741B2 (ja) 2003-03-10 2010-01-27 旭化成イーマテリアルズ株式会社 マスターバッチ型硬化剤および一液性エポキシ樹脂組成物
JP4509715B2 (ja) 2004-09-16 2010-07-21 株式会社クラレ ジグリシジルエーテル、硬化性組成物および硬化物
JP5342200B2 (ja) * 2008-09-22 2013-11-13 三洋化成工業株式会社 エポキシ樹脂用反応性希釈剤および熱硬化性エポキシ樹脂組成物
DE102011015193A1 (de) * 2011-03-25 2012-09-27 Momentive Specialty Chemicals Gmbh Epoxidierte Arylalkylphenole

Also Published As

Publication number Publication date
EP4491653A4 (en) 2026-03-18
WO2023171572A1 (ja) 2023-09-14
KR20240157650A (ko) 2024-11-01
US20250109240A1 (en) 2025-04-03
EP4491653A1 (en) 2025-01-15
JPWO2023171572A1 (https=) 2023-09-14
CN118679205A (zh) 2024-09-20

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