KR20240157650A - 1액형 에폭시 수지 조성물 - Google Patents

1액형 에폭시 수지 조성물 Download PDF

Info

Publication number
KR20240157650A
KR20240157650A KR1020247026250A KR20247026250A KR20240157650A KR 20240157650 A KR20240157650 A KR 20240157650A KR 1020247026250 A KR1020247026250 A KR 1020247026250A KR 20247026250 A KR20247026250 A KR 20247026250A KR 20240157650 A KR20240157650 A KR 20240157650A
Authority
KR
South Korea
Prior art keywords
component
epoxy resin
resin composition
curing agent
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247026250A
Other languages
English (en)
Korean (ko)
Inventor
타쿠야 미와
유이 하세가와
켄이치 타마소
Original Assignee
가부시키가이샤 아데카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 아데카 filed Critical 가부시키가이샤 아데카
Publication of KR20240157650A publication Critical patent/KR20240157650A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
KR1020247026250A 2022-03-09 2023-03-03 1액형 에폭시 수지 조성물 Pending KR20240157650A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022036282 2022-03-09
JPJP-P-2022-036282 2022-03-09
PCT/JP2023/008106 WO2023171572A1 (ja) 2022-03-09 2023-03-03 一液型エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
KR20240157650A true KR20240157650A (ko) 2024-11-01

Family

ID=87935347

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247026250A Pending KR20240157650A (ko) 2022-03-09 2023-03-03 1액형 에폭시 수지 조성물

Country Status (7)

Country Link
US (1) US20250109240A1 (https=)
EP (1) EP4491653A4 (https=)
JP (1) JPWO2023171572A1 (https=)
KR (1) KR20240157650A (https=)
CN (1) CN118679205A (https=)
TW (1) TW202346400A (https=)
WO (1) WO2023171572A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026063438A1 (ja) * 2024-09-19 2026-03-26 日油株式会社 硬化性樹脂組成物、封止材、および該硬化性樹脂組成物の硬化物で封止された電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004231787A (ja) 2003-01-30 2004-08-19 Nippon Steel Chem Co Ltd エポキシ樹脂希釈剤、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP2006083306A (ja) 2004-09-16 2006-03-30 Kuraray Co Ltd ジグリシジルエーテル、硬化性組成物および硬化物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0304503B1 (en) 1987-08-26 1994-06-29 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system
JP3146320B2 (ja) * 1991-11-18 2001-03-12 東都化成株式会社 エポキシ樹脂組成物
JP3579800B2 (ja) * 1994-12-14 2004-10-20 東都化成株式会社 低誘電性エポキシ樹脂組成物
JP4405741B2 (ja) 2003-03-10 2010-01-27 旭化成イーマテリアルズ株式会社 マスターバッチ型硬化剤および一液性エポキシ樹脂組成物
JP5342200B2 (ja) * 2008-09-22 2013-11-13 三洋化成工業株式会社 エポキシ樹脂用反応性希釈剤および熱硬化性エポキシ樹脂組成物
DE102011015193A1 (de) * 2011-03-25 2012-09-27 Momentive Specialty Chemicals Gmbh Epoxidierte Arylalkylphenole

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004231787A (ja) 2003-01-30 2004-08-19 Nippon Steel Chem Co Ltd エポキシ樹脂希釈剤、エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP2006083306A (ja) 2004-09-16 2006-03-30 Kuraray Co Ltd ジグリシジルエーテル、硬化性組成物および硬化物

Also Published As

Publication number Publication date
EP4491653A4 (en) 2026-03-18
WO2023171572A1 (ja) 2023-09-14
US20250109240A1 (en) 2025-04-03
EP4491653A1 (en) 2025-01-15
JPWO2023171572A1 (https=) 2023-09-14
CN118679205A (zh) 2024-09-20
TW202346400A (zh) 2023-12-01

Similar Documents

Publication Publication Date Title
KR102107366B1 (ko) 수지 조성물, 프리프레그 및 적층판
JP6073284B2 (ja) ポリオキサゾリドン樹脂
EP2909250B1 (en) Toughened, curable epoxy compositions for high temperature applications
KR102423320B1 (ko) 옥사졸리돈 고리 함유 에폭시 수지 조성물, 그 제조 방법, 경화성 수지 조성물, 및 경화물
KR20160110175A (ko) 옥사졸리돈 고리 함유 에폭시 수지, 그 제조 방법, 에폭시 수지 조성물 및 그 경화물
EP1852451A1 (en) Epoxy resin, hardenable resin composition containing the same and use thereof
JP2017206641A (ja) エポキシ樹脂組成物及びその硬化物
WO2008020594A1 (fr) Résine époxy liquide modifiée, composition de résine époxy contenant celle-ci et produit cuit dérivé
KR20130108280A (ko) 잠재성 경화제 조성물 및 일액 경화성 에폭시 수지 조성물
KR20240157650A (ko) 1액형 에폭시 수지 조성물
JP7325207B2 (ja) 樹脂組成物
WO2007083715A1 (ja) 液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物
TW202128813A (zh) 樹脂組合物
JP2020200389A (ja) 硬化性樹脂組成物
JP7699104B2 (ja) 硬化性樹脂組成物、及び硬化性樹脂組成物の硬化収縮を抑制する方法
JP4142155B2 (ja) エポキシ樹脂及びその製造方法
EP4306566B1 (en) Curable resin composition, cured product and adhesive
EP4029896A1 (en) Curable resin composition
JP2845410B2 (ja) 新規エポキシ樹脂、樹脂組成物及びその硬化物
JPH11302508A (ja) エポキシ樹脂組成物
JP2025132266A (ja) 化合物、化合物の製造方法、エポキシ樹脂組成物及び硬化性組成物
WO2021112091A1 (ja) 樹脂組成物
HK1178186A (en) Resin composition, prepreg, and laminated sheet

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000