JPWO2023166973A5 - - Google Patents

Info

Publication number
JPWO2023166973A5
JPWO2023166973A5 JP2024504595A JP2024504595A JPWO2023166973A5 JP WO2023166973 A5 JPWO2023166973 A5 JP WO2023166973A5 JP 2024504595 A JP2024504595 A JP 2024504595A JP 2024504595 A JP2024504595 A JP 2024504595A JP WO2023166973 A5 JPWO2023166973 A5 JP WO2023166973A5
Authority
JP
Japan
Prior art keywords
resin composition
curable resin
melting point
imidazole derivative
camera module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024504595A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023166973A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/004933 external-priority patent/WO2023166973A1/ja
Publication of JPWO2023166973A1 publication Critical patent/JPWO2023166973A1/ja
Publication of JPWO2023166973A5 publication Critical patent/JPWO2023166973A5/ja
Pending legal-status Critical Current

Links

JP2024504595A 2022-03-02 2023-02-14 Pending JPWO2023166973A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022031853 2022-03-02
PCT/JP2023/004933 WO2023166973A1 (ja) 2022-03-02 2023-02-14 硬化性樹脂組成物、接着剤、硬化物、カメラモジュール、及び電子機器

Publications (2)

Publication Number Publication Date
JPWO2023166973A1 JPWO2023166973A1 (https=) 2023-09-07
JPWO2023166973A5 true JPWO2023166973A5 (https=) 2025-09-03

Family

ID=87883397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024504595A Pending JPWO2023166973A1 (https=) 2022-03-02 2023-02-14

Country Status (4)

Country Link
JP (1) JPWO2023166973A1 (https=)
KR (1) KR20240154054A (https=)
TW (1) TW202336073A (https=)
WO (1) WO2023166973A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4546743B2 (ja) * 2004-02-13 2010-09-15 昭和高分子株式会社 引抜成形用樹脂組成物、繊維強化樹脂組成物、その成形方法及び成形品
KR101106068B1 (ko) * 2004-12-21 2012-01-18 에스케이케미칼주식회사 광누설 방지용 에폭시 수지 봉지재 조성물
WO2008016122A1 (en) * 2006-08-04 2008-02-07 Mitsui Chemicals, Inc. Liquid crystal sealing material, process for production of liquid crystal display panels with the same, and liquid crystal display panels
JP5101860B2 (ja) * 2006-10-26 2012-12-19 パナソニック株式会社 エポキシ樹脂組成物と半導体装置
JP5532582B2 (ja) 2008-11-04 2014-06-25 信越化学工業株式会社 フリップチップ型半導体装置を封止する方法、チップ・オン・チップ用アンダーフィル材の選定方法、及びフリップチップ型半導体装置
JP5441447B2 (ja) * 2009-03-06 2014-03-12 ソマール株式会社 電子部品用絶縁塗料およびこれを利用した電子部品
JP2014028911A (ja) * 2012-06-28 2014-02-13 Sekisui Chem Co Ltd 後硬化テープ及び接合部材の接合方法
KR20150109322A (ko) * 2013-01-17 2015-10-01 세키스이가가쿠 고교가부시키가이샤 전자 부품용 경화성 조성물, 접속 구조체 및 접속 구조체의 제조 방법
JP6071612B2 (ja) 2013-02-14 2017-02-01 ナミックス株式会社 液状樹脂組成物、フリップチップ実装体およびその製造方法
JP6608147B2 (ja) * 2015-02-23 2019-11-20 デクセリアルズ株式会社 多層接着フィルム、および接続構造体
CN114621560A (zh) * 2016-08-29 2022-06-14 三菱化学株式会社 热固性树脂组合物、预成型料、以及纤维增强塑料成型体及其制造方法
CN108102589B (zh) * 2017-11-27 2021-03-30 烟台德邦科技股份有限公司 一种低温固化低模量的环氧树脂封装导电胶及其制备方法
JP7386719B2 (ja) * 2020-01-21 2023-11-27 ソマール株式会社 熱硬化性粉体塗料、該塗料を用いて形成された塗膜、及び該塗膜を備えた被塗装体

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