JP2016522278A5 - - Google Patents
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- Publication number
- JP2016522278A5 JP2016522278A5 JP2016509065A JP2016509065A JP2016522278A5 JP 2016522278 A5 JP2016522278 A5 JP 2016522278A5 JP 2016509065 A JP2016509065 A JP 2016509065A JP 2016509065 A JP2016509065 A JP 2016509065A JP 2016522278 A5 JP2016522278 A5 JP 2016522278A5
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- composition
- epoxy resin
- latent
- latent curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 11
- 239000003795 chemical substances by application Substances 0.000 claims 8
- 239000003822 epoxy resin Substances 0.000 claims 7
- 229920000647 polyepoxide Polymers 0.000 claims 7
- 239000004593 Epoxy Substances 0.000 claims 5
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- 229920001187 thermosetting polymer Polymers 0.000 claims 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 235000013877 carbamide Nutrition 0.000 claims 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 2
- 150000002460 imidazoles Chemical class 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 150000003672 ureas Chemical class 0.000 claims 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361812837P | 2013-04-17 | 2013-04-17 | |
| US61/812,837 | 2013-04-17 | ||
| PCT/US2014/034339 WO2014172444A1 (en) | 2013-04-17 | 2014-04-16 | Multiple accelerator systems for epoxy adhesives |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016522278A JP2016522278A (ja) | 2016-07-28 |
| JP2016522278A5 true JP2016522278A5 (https=) | 2017-05-25 |
| JP6440686B2 JP6440686B2 (ja) | 2018-12-19 |
Family
ID=50771350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016509065A Expired - Fee Related JP6440686B2 (ja) | 2013-04-17 | 2014-04-16 | エポキシ接着剤のための多重促進剤系 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160053045A1 (https=) |
| EP (1) | EP2986656B1 (https=) |
| JP (1) | JP6440686B2 (https=) |
| KR (1) | KR20150143533A (https=) |
| CN (1) | CN105121498B (https=) |
| BR (1) | BR112015026361A8 (https=) |
| WO (1) | WO2014172444A1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015102911A1 (en) * | 2013-12-30 | 2015-07-09 | Dow Global Technologies Llc | Toughening agents for epoxy systems |
| JP2018500435A (ja) * | 2014-12-23 | 2018-01-11 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性及び硬化済みエポキシ樹脂組成物 |
| CN107108929B (zh) | 2014-12-24 | 2021-03-30 | 赫克赛尔控股有限责任公司 | 改善的快速固化环氧树脂及由其得到的预浸料 |
| EP3347398B1 (en) | 2015-09-10 | 2024-07-31 | DDP Specialty Electronic Materials US, LLC | One-component toughened epoxy adhesives with improved adhesion to oily surfaces and high wash-off resistance |
| JP6521090B2 (ja) * | 2016-08-29 | 2019-05-29 | 三菱ケミカル株式会社 | 熱硬化性樹脂組成物、プリプレグ、及び繊維強化プラスチック成形体とその製造方法 |
| EP3450479A1 (en) * | 2017-09-01 | 2019-03-06 | Henkel AG & Co. KGaA | A latent, fast curing composition, a use thereof and an article having a cured composition obtainable therefrom |
| WO2019164568A1 (en) | 2018-02-09 | 2019-08-29 | Ppg Industries Ohio, Inc. | Coating compositions |
| CN109616299B (zh) * | 2018-12-21 | 2021-04-13 | 江苏源通电气有限公司 | 一种半潜伏型环氧树脂浇注干式变压器 |
| KR102233685B1 (ko) * | 2019-02-28 | 2021-03-30 | (주)디씨티케이 | 고내구성을 가지는 디스플레이용 광학필름 부착패드 |
| DE102019113291A1 (de) * | 2019-05-20 | 2020-11-26 | Thyssenkrupp Steel Europe Ag | Blech für die Herstellung einer elektromagnetischen Komponente, insbesondere eines Statorpakets oder eines Rotorpakets, sowie Verfahren zur Herstellung einer elektromagnetischen Komponente |
| ES2973449T3 (es) * | 2019-12-13 | 2024-06-20 | Henkel Ag & Co Kgaa | Composición adhesiva curable de dos componentes (2K) |
| US20250145760A1 (en) * | 2022-03-01 | 2025-05-08 | 3M Innovative Properties Company | Epoxy resin compositions comprising dicyandiamid curing agent |
| CN119053656A (zh) * | 2022-04-21 | 2024-11-29 | 汉高股份有限及两合公司 | 可固化环氧组合物、由其得到的结构粘合剂、及其使用方法 |
| CN121816387A (zh) * | 2023-09-12 | 2026-04-07 | 汉高股份有限及两合公司 | 用于低温固化的可膨胀环氧组合物和由其得到的结构粘合剂及其使用方法 |
| CN117467242B (zh) * | 2023-11-01 | 2024-05-31 | 泰州市天润合成化工有限公司 | 一种增韧型环氧树脂组合物及其制备工艺 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5390344A (en) * | 1977-01-21 | 1978-08-09 | Hitachi Ltd | Adhesive composition |
| JPS54154448A (en) * | 1978-05-26 | 1979-12-05 | Shikoku Kasei Kougiyou Kk | Nonflammable epoxy resin composition |
| JPH06184511A (ja) * | 1991-11-14 | 1994-07-05 | Aisin Chem Co Ltd | 接着剤組成物 |
| JP2836710B2 (ja) * | 1991-12-20 | 1998-12-14 | 住友ベークライト 株式会社 | 半導体用導電性樹脂ペースト |
| US7217771B2 (en) * | 2001-07-31 | 2007-05-15 | Huntsman Advanced Materials Americas Inc. | Epoxy resin |
| US7094843B2 (en) * | 2002-08-19 | 2006-08-22 | 3M Innovative Properties Company | Epoxy compositions having improved shelf life and articles containing the same |
| CN102993915A (zh) * | 2012-12-25 | 2013-03-27 | 上海海隆赛能新材料有限公司 | 一种3pp防腐用环氧粉末底漆及其制备方法 |
-
2014
- 2014-04-16 JP JP2016509065A patent/JP6440686B2/ja not_active Expired - Fee Related
- 2014-04-16 US US14/783,444 patent/US20160053045A1/en not_active Abandoned
- 2014-04-16 KR KR1020157030877A patent/KR20150143533A/ko not_active Withdrawn
- 2014-04-16 WO PCT/US2014/034339 patent/WO2014172444A1/en not_active Ceased
- 2014-04-16 CN CN201480021849.5A patent/CN105121498B/zh active Active
- 2014-04-16 BR BR112015026361A patent/BR112015026361A8/pt not_active Application Discontinuation
- 2014-04-16 EP EP14725589.7A patent/EP2986656B1/en active Active
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