JP2016522278A5 - - Google Patents
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- Publication number
- JP2016522278A5 JP2016522278A5 JP2016509065A JP2016509065A JP2016522278A5 JP 2016522278 A5 JP2016522278 A5 JP 2016522278A5 JP 2016509065 A JP2016509065 A JP 2016509065A JP 2016509065 A JP2016509065 A JP 2016509065A JP 2016522278 A5 JP2016522278 A5 JP 2016522278A5
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- composition
- epoxy resin
- latent
- latent curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 14
- 239000003795 chemical substances by application Substances 0.000 claims 8
- 239000003822 epoxy resin Substances 0.000 claims 7
- 229920000647 polyepoxide Polymers 0.000 claims 7
- 239000004593 Epoxy Substances 0.000 claims 5
- 125000003700 epoxy group Chemical group 0.000 claims 5
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive Effects 0.000 claims 4
- 229920001187 thermosetting polymer Polymers 0.000 claims 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 2
- 235000013877 carbamide Nutrition 0.000 claims 2
- QGBSISYHAICWAH-UHFFFAOYSA-N cyanoguanidine Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 2
- 150000002460 imidazoles Chemical class 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 150000003672 ureas Chemical class 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bis(4-hydroxyphenyl)methane Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N Diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 1
Claims (5)
- ａ．熱硬化性エポキシ樹脂と、
ｂ．前記エポキシ樹脂を硬化させるために十分な量の潜在性硬化剤系と、を含む、一液型硬化性エポキシ組成物であって、
前記潜在性硬化剤系が、
（ｉ）ジシアンジアミドおよびその誘導体から選択される潜在性硬化剤を含む少なくとも１種のエポキシ樹脂混和性の第１の硬化剤、および
（ｉｉ）置換尿素、置換イミダゾール、およびそれらの組合せの少なくとも１種から選択される２以上の潜在性促進剤を含む、一液型硬化性エポキシ組成物。 - 前記熱硬化性エポキシ樹脂が、ビスフェノールＡのジグリシジルエーテル、ビスフェノールＦのジグリシジルエーテル、およびそれらの組合せの少なくとも１種から選択される、請求項１に記載の組成物。
- 請求項１に記載の一液型硬化性エポキシ組成物を含む、接着剤組成物。
- 硬化された請求項３に記載の接着剤組成物を含む、組成物。
- （ａ）２つの基材と、
（ｂ）前記２つの基材間に配置された接着剤組成物の層と、を備える物品であって、
前記接着剤組成物が、一液型硬化性エポキシ組成物を含み、
前記一液型硬化性エポキシ組成物が、
（ｉ）熱硬化性エポキシ樹脂、および
（ｉｉ）前記エポキシ樹脂を硬化させるために十分な量の潜在性硬化剤系を含み、
前記潜在性硬化剤系が、
（Ａ）ジシアンジアミドおよびその誘導体から選択される潜在性硬化剤を含む少なくとも１種のエポキシ樹脂混和性の第１の硬化剤と、
（Ｂ）置換尿素、置換イミダゾール、およびそれらの組合せの少なくとも１種から選択される２以上の潜在性促進剤と、を含む、物品。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361812837P | 2013-04-17 | 2013-04-17 | |
| US61/812,837 | 2013-04-17 | ||
| PCT/US2014/034339 WO2014172444A1 (en) | 2013-04-17 | 2014-04-16 | Multiple accelerator systems for epoxy adhesives |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016522278A JP2016522278A (ja) | 2016-07-28 |
| JP2016522278A5 true JP2016522278A5 (ja) | 2017-05-25 |
| JP6440686B2 JP6440686B2 (ja) | 2018-12-19 |
Family
ID=50771350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016509065A Expired - Fee Related JP6440686B2 (ja) | 2013-04-17 | 2014-04-16 | エポキシ接着剤のための多重促進剤系 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160053045A1 (ja) |
| EP (1) | EP2986656B1 (ja) |
| JP (1) | JP6440686B2 (ja) |
| KR (1) | KR20150143533A (ja) |
| CN (1) | CN105121498B (ja) |
| BR (1) | BR112015026361A8 (ja) |
| WO (1) | WO2014172444A1 (ja) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015102911A1 (en) * | 2013-12-30 | 2015-07-09 | Dow Global Technologies Llc | Toughening agents for epoxy systems |
| KR20170097152A (ko) * | 2014-12-23 | 2017-08-25 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 경화성 및 경화된 에폭시 수지 조성물 |
| WO2016102282A1 (en) | 2014-12-24 | 2016-06-30 | Hexcel Holding Gmbh | Improved fast cure epoxy resins and prepregs obtained therefrom |
| EP3347398A1 (en) | 2015-09-10 | 2018-07-18 | Dow Global Technologies LLC | One-component toughened epoxy adhesives with improved adhesion to oily surfaces and high wash-off resistance |
| CN114621560A (zh) * | 2016-08-29 | 2022-06-14 | 三菱化学株式会社 | 热固性树脂组合物、预成型料、以及纤维增强塑料成型体及其制造方法 |
| EP3450479A1 (en) * | 2017-09-01 | 2019-03-06 | Henkel AG & Co. KGaA | A latent, fast curing composition, a use thereof and an article having a cured composition obtainable therefrom |
| CN111727211A (zh) * | 2018-02-09 | 2020-09-29 | Ppg工业俄亥俄公司 | 涂料组合物 |
| CN109616299B (zh) * | 2018-12-21 | 2021-04-13 | 江苏源通电气有限公司 | 一种半潜伏型环氧树脂浇注干式变压器 |
| KR102233685B1 (ko) * | 2019-02-28 | 2021-03-30 | (주)디씨티케이 | 고내구성을 가지는 디스플레이용 광학필름 부착패드 |
| DE102019113291A1 (de) * | 2019-05-20 | 2020-11-26 | Thyssenkrupp Steel Europe Ag | Blech für die Herstellung einer elektromagnetischen Komponente, insbesondere eines Statorpakets oder eines Rotorpakets, sowie Verfahren zur Herstellung einer elektromagnetischen Komponente |
| EP3835386B8 (en) * | 2019-12-13 | 2024-01-10 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
| WO2023166367A1 (en) * | 2022-03-01 | 2023-09-07 | 3M Innovative Properties Company | Epoxy resin compositions comprising dicyandiamid curing agent |
| WO2023201614A1 (en) * | 2022-04-21 | 2023-10-26 | Henkel Ag & Co. Kgaa | Curable epoxy compositions, structural adhesive therefrom, and methods of using same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5390344A (en) * | 1977-01-21 | 1978-08-09 | Hitachi Ltd | Adhesive composition |
| JPS54154448A (en) * | 1978-05-26 | 1979-12-05 | Shikoku Kasei Kougiyou Kk | Nonflammable epoxy resin composition |
| JPH06184511A (ja) * | 1991-11-14 | 1994-07-05 | Aisin Chem Co Ltd | 接着剤組成物 |
| JP2836710B2 (ja) * | 1991-12-20 | 1998-12-14 | 住友ベークライト 株式会社 | 半導体用導電性樹脂ペースト |
| ES2278949T3 (es) * | 2001-07-31 | 2007-08-16 | Huntsman Advanced Materials (Switzerland) Gmbh | Resina epoxidica. |
| US7094843B2 (en) * | 2002-08-19 | 2006-08-22 | 3M Innovative Properties Company | Epoxy compositions having improved shelf life and articles containing the same |
| CN102993915A (zh) * | 2012-12-25 | 2013-03-27 | 上海海隆赛能新材料有限公司 | 一种3pp防腐用环氧粉末底漆及其制备方法 |
-
2014
- 2014-04-16 BR BR112015026361A patent/BR112015026361A8/pt not_active Application Discontinuation
- 2014-04-16 EP EP14725589.7A patent/EP2986656B1/en active Active
- 2014-04-16 WO PCT/US2014/034339 patent/WO2014172444A1/en active Application Filing
- 2014-04-16 US US14/783,444 patent/US20160053045A1/en not_active Abandoned
- 2014-04-16 JP JP2016509065A patent/JP6440686B2/ja not_active Expired - Fee Related
- 2014-04-16 CN CN201480021849.5A patent/CN105121498B/zh active Active
- 2014-04-16 KR KR1020157030877A patent/KR20150143533A/ko not_active Application Discontinuation
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