JPWO2023166973A1 - - Google Patents

Info

Publication number
JPWO2023166973A1
JPWO2023166973A1 JP2024504595A JP2024504595A JPWO2023166973A1 JP WO2023166973 A1 JPWO2023166973 A1 JP WO2023166973A1 JP 2024504595 A JP2024504595 A JP 2024504595A JP 2024504595 A JP2024504595 A JP 2024504595A JP WO2023166973 A1 JPWO2023166973 A1 JP WO2023166973A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024504595A
Other languages
Japanese (ja)
Other versions
JPWO2023166973A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023166973A1 publication Critical patent/JPWO2023166973A1/ja
Publication of JPWO2023166973A5 publication Critical patent/JPWO2023166973A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2024504595A 2022-03-02 2023-02-14 Pending JPWO2023166973A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022031853 2022-03-02
PCT/JP2023/004933 WO2023166973A1 (ja) 2022-03-02 2023-02-14 硬化性樹脂組成物、接着剤、硬化物、カメラモジュール、及び電子機器

Publications (2)

Publication Number Publication Date
JPWO2023166973A1 true JPWO2023166973A1 (https=) 2023-09-07
JPWO2023166973A5 JPWO2023166973A5 (https=) 2025-09-03

Family

ID=87883397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024504595A Pending JPWO2023166973A1 (https=) 2022-03-02 2023-02-14

Country Status (4)

Country Link
JP (1) JPWO2023166973A1 (https=)
KR (1) KR20240154054A (https=)
TW (1) TW202336073A (https=)
WO (1) WO2023166973A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4546743B2 (ja) * 2004-02-13 2010-09-15 昭和高分子株式会社 引抜成形用樹脂組成物、繊維強化樹脂組成物、その成形方法及び成形品
KR101106068B1 (ko) * 2004-12-21 2012-01-18 에스케이케미칼주식회사 광누설 방지용 에폭시 수지 봉지재 조성물
WO2008016122A1 (en) * 2006-08-04 2008-02-07 Mitsui Chemicals, Inc. Liquid crystal sealing material, process for production of liquid crystal display panels with the same, and liquid crystal display panels
JP5101860B2 (ja) * 2006-10-26 2012-12-19 パナソニック株式会社 エポキシ樹脂組成物と半導体装置
JP5532582B2 (ja) 2008-11-04 2014-06-25 信越化学工業株式会社 フリップチップ型半導体装置を封止する方法、チップ・オン・チップ用アンダーフィル材の選定方法、及びフリップチップ型半導体装置
JP5441447B2 (ja) * 2009-03-06 2014-03-12 ソマール株式会社 電子部品用絶縁塗料およびこれを利用した電子部品
JP2014028911A (ja) * 2012-06-28 2014-02-13 Sekisui Chem Co Ltd 後硬化テープ及び接合部材の接合方法
KR20150109322A (ko) * 2013-01-17 2015-10-01 세키스이가가쿠 고교가부시키가이샤 전자 부품용 경화성 조성물, 접속 구조체 및 접속 구조체의 제조 방법
JP6071612B2 (ja) 2013-02-14 2017-02-01 ナミックス株式会社 液状樹脂組成物、フリップチップ実装体およびその製造方法
JP6608147B2 (ja) * 2015-02-23 2019-11-20 デクセリアルズ株式会社 多層接着フィルム、および接続構造体
CN114621560A (zh) * 2016-08-29 2022-06-14 三菱化学株式会社 热固性树脂组合物、预成型料、以及纤维增强塑料成型体及其制造方法
CN108102589B (zh) * 2017-11-27 2021-03-30 烟台德邦科技股份有限公司 一种低温固化低模量的环氧树脂封装导电胶及其制备方法
JP7386719B2 (ja) * 2020-01-21 2023-11-27 ソマール株式会社 熱硬化性粉体塗料、該塗料を用いて形成された塗膜、及び該塗膜を備えた被塗装体

Also Published As

Publication number Publication date
TW202336073A (zh) 2023-09-16
WO2023166973A1 (ja) 2023-09-07
KR20240154054A (ko) 2024-10-24

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