JPWO2023162718A5 - - Google Patents
Info
- Publication number
- JPWO2023162718A5 JPWO2023162718A5 JP2023512093A JP2023512093A JPWO2023162718A5 JP WO2023162718 A5 JPWO2023162718 A5 JP WO2023162718A5 JP 2023512093 A JP2023512093 A JP 2023512093A JP 2023512093 A JP2023512093 A JP 2023512093A JP WO2023162718 A5 JPWO2023162718 A5 JP WO2023162718A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- resin composition
- general formula
- semiconductor device
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022026410 | 2022-02-24 | ||
| PCT/JP2023/004533 WO2023162718A1 (ja) | 2022-02-24 | 2023-02-10 | 樹脂組成物、樹脂組成物被膜、樹脂組成物フィルム、硬化膜、およびこれらを用いた半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162718A1 JPWO2023162718A1 (https=) | 2023-08-31 |
| JPWO2023162718A5 true JPWO2023162718A5 (https=) | 2026-02-06 |
Family
ID=87765747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023512093A Pending JPWO2023162718A1 (https=) | 2022-02-24 | 2023-02-10 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250164880A1 (https=) |
| EP (1) | EP4484462A4 (https=) |
| JP (1) | JPWO2023162718A1 (https=) |
| KR (1) | KR20240155861A (https=) |
| CN (1) | CN118613525A (https=) |
| TW (1) | TW202336095A (https=) |
| WO (1) | WO2023162718A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5114854B2 (ja) * | 2005-04-05 | 2013-01-09 | 東レ株式会社 | 熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品 |
| JP4913142B2 (ja) | 2006-07-14 | 2012-04-11 | 日本化薬株式会社 | 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法（３） |
| JP5321781B2 (ja) * | 2007-01-09 | 2013-10-23 | Ｊｓｒ株式会社 | 液晶配向剤および液晶表示素子 |
| JP2010132793A (ja) * | 2008-12-05 | 2010-06-17 | Toray Ind Inc | 熱硬化性樹脂組成物、それを用いたアンダーフィル剤および半導体装置 |
| US9134608B2 (en) * | 2010-01-21 | 2015-09-15 | Hitachi Chemical Dupont Microsystems, Ltd. | Positive photosensitive resin composition, method for producing patterned cured film and electronic component |
| JP2013015701A (ja) * | 2011-07-05 | 2013-01-24 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品 |
| JP5848154B2 (ja) * | 2012-02-17 | 2016-01-27 | 富士フイルム株式会社 | ガス分離複合膜、その製造方法、それを用いたガス分離モジュール、及びガス分離装置、並びにガス分離方法 |
| JP2019038964A (ja) | 2017-08-28 | 2019-03-14 | 住友ベークライト株式会社 | 感光性樹脂組成物および電子装置 |
| JP7533048B2 (ja) | 2019-09-24 | 2024-08-14 | 東レ株式会社 | 樹脂組成物、樹脂組成物フィルム、硬化膜、およびこれらを用いた半導体装置 |
| EP4036144A4 (en) * | 2019-09-24 | 2023-06-28 | Toray Industries, Inc. | Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device |
-
2023
- 2023-02-10 JP JP2023512093A patent/JPWO2023162718A1/ja active Pending
- 2023-02-10 CN CN202380016208.XA patent/CN118613525A/zh active Pending
- 2023-02-10 US US18/730,411 patent/US20250164880A1/en active Pending
- 2023-02-10 KR KR1020247026821A patent/KR20240155861A/ko active Pending
- 2023-02-10 WO PCT/JP2023/004533 patent/WO2023162718A1/ja not_active Ceased
- 2023-02-10 EP EP23759722.4A patent/EP4484462A4/en active Pending
- 2023-02-20 TW TW112106012A patent/TW202336095A/zh unknown
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