JPWO2022163335A5 - - Google Patents
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- Publication number
- JPWO2022163335A5 JPWO2022163335A5 JP2022502855A JP2022502855A JPWO2022163335A5 JP WO2022163335 A5 JPWO2022163335 A5 JP WO2022163335A5 JP 2022502855 A JP2022502855 A JP 2022502855A JP 2022502855 A JP2022502855 A JP 2022502855A JP WO2022163335 A5 JPWO2022163335 A5 JP WO2022163335A5
- Authority
- JP
- Japan
- Prior art keywords
- formula
- carbon
- antenna
- group
- single bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011203 carbon fibre reinforced carbon Chemical group 0.000 claims 16
- 229920005989 resin Polymers 0.000 claims 12
- 239000011347 resin Substances 0.000 claims 12
- 125000004432 carbon atom Chemical group C* 0.000 claims 10
- 125000000962 organic group Chemical group 0.000 claims 10
- 239000011342 resin composition Substances 0.000 claims 9
- 150000001875 compounds Chemical class 0.000 claims 8
- 239000004642 Polyimide Substances 0.000 claims 6
- 239000011230 binding agent Substances 0.000 claims 6
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims 6
- 229920002577 polybenzoxazole Polymers 0.000 claims 6
- 229920001721 polyimide Polymers 0.000 claims 6
- 239000002243 precursor Substances 0.000 claims 6
- 239000000178 monomer Substances 0.000 claims 5
- 229920001577 copolymer Polymers 0.000 claims 3
- 239000003431 cross linking reagent Substances 0.000 claims 3
- -1 polysiloxane Polymers 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- 239000003999 initiator Substances 0.000 claims 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims 2
- 239000011976 maleic acid Substances 0.000 claims 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 2
- 230000005404 monopole Effects 0.000 claims 2
- 229920001568 phenolic resin Polymers 0.000 claims 2
- 239000005011 phenolic resin Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 229920002396 Polyurea Polymers 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 239000000539 dimer Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 150000002921 oxetanes Chemical class 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 230000000379 polymerizing effect Effects 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021010013 | 2021-01-26 | ||
| PCT/JP2022/000472 WO2022163335A1 (ja) | 2021-01-26 | 2022-01-11 | 感光性樹脂組成物、硬化膜、電子部品、アンテナ素子、半導体パッケージおよび化合物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022163335A1 JPWO2022163335A1 (https=) | 2022-08-04 |
| JPWO2022163335A5 true JPWO2022163335A5 (https=) | 2025-01-06 |
Family
ID=82653251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022502855A Pending JPWO2022163335A1 (https=) | 2021-01-26 | 2022-01-11 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240045329A1 (https=) |
| JP (1) | JPWO2022163335A1 (https=) |
| KR (1) | KR20230137881A (https=) |
| CN (1) | CN116802559A (https=) |
| TW (1) | TW202244036A (https=) |
| WO (1) | WO2022163335A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2023162905A1 (https=) * | 2022-02-25 | 2023-08-31 | ||
| JP2024066347A (ja) * | 2022-11-01 | 2024-05-15 | 味の素株式会社 | 感光性樹脂組成物 |
| JP7786430B2 (ja) * | 2023-06-26 | 2025-12-16 | 味の素株式会社 | 樹脂組成物 |
| CN118915391B (zh) * | 2024-07-19 | 2025-04-01 | 波米科技有限公司 | 一种含氮杂环聚硅氧烷的感光性树脂组合物及其应用 |
| WO2026069942A1 (ja) * | 2024-09-27 | 2026-04-02 | 三菱瓦斯化学株式会社 | ポリイミド樹脂前駆体組成物及びポリイミドフィルム |
| WO2026074858A1 (ja) * | 2024-10-01 | 2026-04-09 | ナミックス株式会社 | 新規（メタ）アクリルアミド、それを含む組成物、硬化性組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53285A (en) * | 1976-06-24 | 1978-01-05 | Gen Electric | Curable composition and coated substances |
| US5436112A (en) * | 1994-04-01 | 1995-07-25 | Hoechst Celanese Corporation | Method for producing a negative image with color proofing element containing a urethane monomer |
| JPH11293146A (ja) * | 1998-04-10 | 1999-10-26 | Toagosei Co Ltd | 剥離剤 |
| US6281314B1 (en) * | 1998-07-02 | 2001-08-28 | National Starch And Chemical Investment Holding Corporation | Compositions for use in the fabrication of circuit components and printed wire boards |
| WO2005121190A2 (en) * | 2004-06-04 | 2005-12-22 | Designer Molecules Inc. | Free-radical curable polyesters and methods for use thereof |
| JP5211438B2 (ja) | 2005-06-09 | 2013-06-12 | 東レ株式会社 | 樹脂組成物およびそれを用いた表示装置 |
| JP5571990B2 (ja) | 2009-06-04 | 2014-08-13 | 旭化成イーマテリアルズ株式会社 | ネガ型感光性樹脂組成物、硬化レリーフパターン形成・製造方法、並びに半導体装置 |
| CN107925147B (zh) * | 2015-08-20 | 2021-07-16 | 东丽株式会社 | 带有布线和电极的天线基板及rfid器件的制造方法 |
| JP6926475B2 (ja) * | 2015-11-25 | 2021-08-25 | 東レ株式会社 | 強誘電体記憶素子、その製造方法、ならびにそれを用いたメモリセルおよびそれを用いた無線通信装置 |
| KR102380068B1 (ko) * | 2016-10-05 | 2022-03-31 | 도레이 카부시키가이샤 | 수지 조성물, 경화막, 반도체 장치 및 그들의 제조 방법 |
-
2022
- 2022-01-11 JP JP2022502855A patent/JPWO2022163335A1/ja active Pending
- 2022-01-11 KR KR1020237022200A patent/KR20230137881A/ko active Pending
- 2022-01-11 WO PCT/JP2022/000472 patent/WO2022163335A1/ja not_active Ceased
- 2022-01-11 CN CN202280010794.2A patent/CN116802559A/zh active Pending
- 2022-01-11 US US18/268,411 patent/US20240045329A1/en active Pending
- 2022-01-17 TW TW111101779A patent/TW202244036A/zh unknown
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