JPWO2022163335A5 - - Google Patents
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- Publication number
- JPWO2022163335A5 JPWO2022163335A5 JP2022502855A JP2022502855A JPWO2022163335A5 JP WO2022163335 A5 JPWO2022163335 A5 JP WO2022163335A5 JP 2022502855 A JP2022502855 A JP 2022502855A JP 2022502855 A JP2022502855 A JP 2022502855A JP WO2022163335 A5 JPWO2022163335 A5 JP WO2022163335A5
- Authority
- JP
- Japan
- Prior art keywords
- formula
- carbon
- antenna
- group
- single bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011203 carbon fibre reinforced carbon Chemical group 0.000 claims 16
- 229920005989 resin Polymers 0.000 claims 12
- 239000011347 resin Substances 0.000 claims 12
- 125000004432 carbon atom Chemical group C* 0.000 claims 10
- 125000000962 organic group Chemical group 0.000 claims 10
- 239000011342 resin composition Substances 0.000 claims 9
- 150000001875 compounds Chemical class 0.000 claims 8
- 239000004642 Polyimide Substances 0.000 claims 6
- 239000011230 binding agent Substances 0.000 claims 6
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims 6
- 229920002577 polybenzoxazole Polymers 0.000 claims 6
- 229920001721 polyimide Polymers 0.000 claims 6
- 239000002243 precursor Substances 0.000 claims 6
- 239000000178 monomer Substances 0.000 claims 5
- 229920001577 copolymer Polymers 0.000 claims 3
- 239000003431 cross linking reagent Substances 0.000 claims 3
- -1 polysiloxane Polymers 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- 239000003999 initiator Substances 0.000 claims 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims 2
- 239000011976 maleic acid Substances 0.000 claims 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 2
- 230000005404 monopole Effects 0.000 claims 2
- 229920001568 phenolic resin Polymers 0.000 claims 2
- 239000005011 phenolic resin Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 229920002396 Polyurea Polymers 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 239000000539 dimer Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 150000002921 oxetanes Chemical class 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 230000000379 polymerizing effect Effects 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021010013 | 2021-01-26 | ||
| PCT/JP2022/000472 WO2022163335A1 (ja) | 2021-01-26 | 2022-01-11 | 感光性樹脂組成物、硬化膜、電子部品、アンテナ素子、半導体パッケージおよび化合物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022163335A1 JPWO2022163335A1 (https=) | 2022-08-04 |
| JPWO2022163335A5 true JPWO2022163335A5 (https=) | 2025-01-06 |
Family
ID=82653251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022502855A Pending JPWO2022163335A1 (https=) | 2021-01-26 | 2022-01-11 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240045329A1 (https=) |
| JP (1) | JPWO2022163335A1 (https=) |
| KR (1) | KR20230137881A (https=) |
| CN (1) | CN116802559A (https=) |
| TW (1) | TW202244036A (https=) |
| WO (1) | WO2022163335A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2023162905A1 (https=) * | 2022-02-25 | 2023-08-31 | ||
| JP2024066347A (ja) * | 2022-11-01 | 2024-05-15 | 味の素株式会社 | 感光性樹脂組成物 |
| JP7786430B2 (ja) * | 2023-06-26 | 2025-12-16 | 味の素株式会社 | 樹脂組成物 |
| CN118915391B (zh) * | 2024-07-19 | 2025-04-01 | 波米科技有限公司 | 一种含氮杂环聚硅氧烷的感光性树脂组合物及其应用 |
| WO2026069942A1 (ja) * | 2024-09-27 | 2026-04-02 | 三菱瓦斯化学株式会社 | ポリイミド樹脂前駆体組成物及びポリイミドフィルム |
| WO2026074858A1 (ja) * | 2024-10-01 | 2026-04-09 | ナミックス株式会社 | 新規（メタ）アクリルアミド、それを含む組成物、硬化性組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53285A (en) * | 1976-06-24 | 1978-01-05 | Gen Electric | Curable composition and coated substances |
| US5436112A (en) * | 1994-04-01 | 1995-07-25 | Hoechst Celanese Corporation | Method for producing a negative image with color proofing element containing a urethane monomer |
| JPH11293146A (ja) * | 1998-04-10 | 1999-10-26 | Toagosei Co Ltd | 剥離剤 |
| US6281314B1 (en) * | 1998-07-02 | 2001-08-28 | National Starch And Chemical Investment Holding Corporation | Compositions for use in the fabrication of circuit components and printed wire boards |
| MXPA06014053A (es) * | 2004-06-04 | 2007-07-11 | Designer Molecules Inc | Poliesteres de radicales libres curables y metodos para uso de los mismos. |
| JP5211438B2 (ja) | 2005-06-09 | 2013-06-12 | 東レ株式会社 | 樹脂組成物およびそれを用いた表示装置 |
| JP5571990B2 (ja) | 2009-06-04 | 2014-08-13 | 旭化成イーマテリアルズ株式会社 | ネガ型感光性樹脂組成物、硬化レリーフパターン形成・製造方法、並びに半導体装置 |
| EP3340372A4 (en) * | 2015-08-20 | 2019-04-03 | Toray Industries, Inc. | MANUFACTURING METHOD FOR ANTENNA SUBSTRATE, MANUFACTURING METHOD FOR WIRING AND ELECTRODE ANTENNA SUBSTRATE, AND METHOD OF MANUFACTURING RFID ELEMENT |
| CN108292630B (zh) * | 2015-11-25 | 2023-04-25 | 东丽株式会社 | 铁电体存储元件、其制造方法、以及使用其的存储单元及使用其的无线通信装置 |
| CN109563342B (zh) * | 2016-10-05 | 2021-06-22 | 东丽株式会社 | 树脂组合物、固化膜、半导体器件及它们的制造方法 |
-
2022
- 2022-01-11 WO PCT/JP2022/000472 patent/WO2022163335A1/ja not_active Ceased
- 2022-01-11 KR KR1020237022200A patent/KR20230137881A/ko active Pending
- 2022-01-11 JP JP2022502855A patent/JPWO2022163335A1/ja active Pending
- 2022-01-11 US US18/268,411 patent/US20240045329A1/en active Pending
- 2022-01-11 CN CN202280010794.2A patent/CN116802559A/zh active Pending
- 2022-01-17 TW TW111101779A patent/TW202244036A/zh unknown
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