JPWO2023145592A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023145592A5
JPWO2023145592A5 JP2023576844A JP2023576844A JPWO2023145592A5 JP WO2023145592 A5 JPWO2023145592 A5 JP WO2023145592A5 JP 2023576844 A JP2023576844 A JP 2023576844A JP 2023576844 A JP2023576844 A JP 2023576844A JP WO2023145592 A5 JPWO2023145592 A5 JP WO2023145592A5
Authority
JP
Japan
Prior art keywords
region
metal
wiring board
board according
metal portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2023576844A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023145592A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/001462 external-priority patent/WO2023145592A1/ja
Publication of JPWO2023145592A1 publication Critical patent/JPWO2023145592A1/ja
Publication of JPWO2023145592A5 publication Critical patent/JPWO2023145592A5/ja
Withdrawn legal-status Critical Current

Links

JP2023576844A 2022-01-31 2023-01-19 Withdrawn JPWO2023145592A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022012537 2022-01-31
PCT/JP2023/001462 WO2023145592A1 (ja) 2022-01-31 2023-01-19 配線基板

Publications (2)

Publication Number Publication Date
JPWO2023145592A1 JPWO2023145592A1 (https=) 2023-08-03
JPWO2023145592A5 true JPWO2023145592A5 (https=) 2024-10-02

Family

ID=87471784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576844A Withdrawn JPWO2023145592A1 (https=) 2022-01-31 2023-01-19

Country Status (6)

Country Link
EP (1) EP4475178A1 (https=)
JP (1) JPWO2023145592A1 (https=)
KR (1) KR20240131389A (https=)
CN (1) CN118613908A (https=)
TW (1) TWI849704B (https=)
WO (1) WO2023145592A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013093405A (ja) * 2011-10-25 2013-05-16 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP6373716B2 (ja) 2014-04-21 2018-08-15 新光電気工業株式会社 配線基板及びその製造方法
JP6543559B2 (ja) * 2015-11-18 2019-07-10 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
KR102493591B1 (ko) * 2018-06-26 2023-01-31 교세라 가부시키가이샤 배선 기판
WO2020188923A1 (ja) * 2019-03-15 2020-09-24 京セラ株式会社 配線基板およびその製造方法
JP7330282B2 (ja) * 2019-09-30 2023-08-21 京セラ株式会社 配線基板

Similar Documents

Publication Publication Date Title
JP2022078438A5 (https=)
JP2023073270A5 (https=)
JP2001319946A5 (https=)
JP7538912B2 (ja) 配線回路基板、および配線回路基板の製造方法
JP2001165959A (ja) 耐磨耗性弾性接触子
JPH0440878B2 (https=)
JPWO2023145592A5 (https=)
JPH0249549B2 (https=)
JP2007056301A5 (ja) 装飾品およびその製造方法
TWI637664B (zh) 可伸縮電路板及其製作方法
JP2001074777A (ja) プローブカード用プローブ針
JP2008192938A5 (https=)
JP2508848B2 (ja) 銅配線セラミック基板の製造方法
JP2024024647A5 (https=)
JP2010171040A (ja) 配線回路基板およびその製造方法
JP2570459B2 (ja) ピン接続構造
JP3057832B2 (ja) 半導体装置
JP7179044B2 (ja) 配線回路基板
JPWO2020218218A5 (https=)
JP2596227B2 (ja) セラミック多層配線基板
US20240107664A1 (en) Method for producing wiring circuit board and wiring circuit board
JP2000299349A (ja) 半導体装置の製造方法
KR20240043101A (ko) 배선 회로 기판의 제조 방법, 및 배선 회로 기판
JP2004103784A (ja) 半導体ウェハのめっき方法
JP2025167412A (ja) 配線回路基板