JPWO2023068121A5 - - Google Patents
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- Publication number
- JPWO2023068121A5 JPWO2023068121A5 JP2023512795A JP2023512795A JPWO2023068121A5 JP WO2023068121 A5 JPWO2023068121 A5 JP WO2023068121A5 JP 2023512795 A JP2023512795 A JP 2023512795A JP 2023512795 A JP2023512795 A JP 2023512795A JP WO2023068121 A5 JPWO2023068121 A5 JP WO2023068121A5
- Authority
- JP
- Japan
- Prior art keywords
- polyamide film
- film laminate
- carbon atoms
- polyamide
- laminate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004952 Polyamide Substances 0.000 claims 32
- 229920002647 polyamide Polymers 0.000 claims 32
- 125000004432 carbon atom Chemical group C* 0.000 claims 15
- 229910052751 metal Inorganic materials 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 8
- -1 aliphatic diamine Chemical class 0.000 claims 7
- 239000000178 monomer Substances 0.000 claims 6
- 125000001931 aliphatic group Chemical group 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 4
- 238000002844 melting Methods 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 2
- 239000000539 dimer Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910000851 Alloy steel Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 claims 1
- 150000004985 diamines Chemical class 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000011084 recovery Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021171033 | 2021-10-19 | ||
| JP2021171033 | 2021-10-19 | ||
| JP2021194789 | 2021-11-30 | ||
| JP2021194789 | 2021-11-30 | ||
| JP2022035425 | 2022-03-08 | ||
| JP2022035425 | 2022-03-08 | ||
| PCT/JP2022/037978 WO2023068121A1 (ja) | 2021-10-19 | 2022-10-12 | ポリアミドフィルム積層体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023068121A1 JPWO2023068121A1 (https=) | 2023-04-27 |
| JP7274246B1 JP7274246B1 (ja) | 2023-05-16 |
| JPWO2023068121A5 true JPWO2023068121A5 (https=) | 2023-09-21 |
Family
ID=86058187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023512795A Active JP7274246B1 (ja) | 2021-10-19 | 2022-10-12 | ポリアミドフィルム積層体 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7274246B1 (https=) |
| KR (1) | KR20240087700A (https=) |
| TW (1) | TW202333947A (https=) |
| WO (1) | WO2023068121A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6274641A (ja) * | 1985-09-30 | 1987-04-06 | 東レ株式会社 | ポリアミドエラストマ含有積層構造体 |
| JP2000186141A (ja) | 1998-12-22 | 2000-07-04 | Kuraray Co Ltd | ポリアミドおよびそれからなるポリアミドフィルム |
| JP2012234849A (ja) * | 2011-04-28 | 2012-11-29 | Unitika Ltd | フレキシブルプリント配線板用の銅張積層板およびフレキシブルプリント配線板 |
| JP6000084B2 (ja) | 2011-11-17 | 2016-09-28 | ユニチカ株式会社 | 半芳香族ポリアミド樹脂組成物 |
| EP3600880B1 (de) * | 2017-03-20 | 2021-01-27 | Basf Se | Laminate enthaltend ein metall und eine polyamidzusammensetzung |
| US12180339B2 (en) * | 2018-10-25 | 2024-12-31 | Unitika Ltd. | Flexible polyamide |
| JP6585273B1 (ja) | 2018-12-28 | 2019-10-02 | 住友化学株式会社 | 発光素子用組成物及び発光素子の製造方法 |
| EP4067408B1 (en) * | 2019-11-27 | 2025-07-30 | Unitika Ltd. | Flexible polyamide film |
| JP7587349B2 (ja) * | 2020-03-27 | 2024-11-20 | 三井化学株式会社 | 金属／樹脂複合構造体、金属／樹脂複合構造体の製造方法およびエンジンマウント部材 |
| CN115943177B (zh) * | 2020-09-14 | 2025-10-31 | 尤尼吉可株式会社 | 聚酰胺及由其构成的成型体和膜以及该聚酰胺的制造方法 |
-
2022
- 2022-10-12 WO PCT/JP2022/037978 patent/WO2023068121A1/ja not_active Ceased
- 2022-10-12 KR KR1020247009112A patent/KR20240087700A/ko active Pending
- 2022-10-12 JP JP2023512795A patent/JP7274246B1/ja active Active
- 2022-10-12 TW TW111138546A patent/TW202333947A/zh unknown
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