JPWO2023068121A5 - - Google Patents

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JPWO2023068121A5
JPWO2023068121A5 JP2023512795A JP2023512795A JPWO2023068121A5 JP WO2023068121 A5 JPWO2023068121 A5 JP WO2023068121A5 JP 2023512795 A JP2023512795 A JP 2023512795A JP 2023512795 A JP2023512795 A JP 2023512795A JP WO2023068121 A5 JPWO2023068121 A5 JP WO2023068121A5
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polyamide film
film laminate
carbon atoms
polyamide
laminate according
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JP7274246B1 (en
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炭素数１８以上の脂肪族ジカルボン酸（Ａ）からなる単位と、炭素数１８以上の脂肪族ジアミン（Ｂ）からなる単位と、炭素数１２以下の芳香族ジカルボン酸（Ｃ）からなる単位と、炭素数１２以下の脂肪族ジアミン（Ｄ）からなる単位とを含むポリアミド（Ｅ）を含有し、融点が２４０℃以上、結晶融解エンタルピーが２３Ｊ／ｇ以上、ヒステリシス試験における伸長回復率が５０％以上、引張弾性率が２５００ＭＰａ以下であるポリアミドフィルム（Ｆ）上に、金属層を有する、ポリアミドフィルム積層体。 A unit consisting of an aliphatic dicarboxylic acid (A) having 18 or more carbon atoms, a unit consisting of an aliphatic diamine (B) having 18 or more carbon atoms, and a unit consisting of an aromatic dicarboxylic acid (C) having 12 or less carbon atoms, Contains a polyamide (E) containing a unit consisting of an aliphatic diamine (D) having 12 or less carbon atoms, has a melting point of 240°C or higher, a crystal melting enthalpy of 23 J/g or higher, and an elongation recovery rate of 50 % in a hysteresis test. The above is a polyamide film laminate having a metal layer on a polyamide film (F) having a tensile modulus of 2500 MPa or less. 前記引張弾性率が２０００ＭＰａ以下である、請求項１に記載のポリアミドフィルム積層体。 The polyamide film laminate according to claim 1, wherein the tensile modulus is 2000 MPa or less . 前記炭素数１８以上の脂肪族ジカルボン酸（Ａ）がダイマー酸、前記炭素数１８以上の脂肪族ジアミン（Ｂ）がダイマージアミン、前記炭素数１２以下の芳香族ジカルボン酸（Ｃ）がテレフタル酸、前記炭素数１２以下の脂肪族ジアミン（Ｄ）が１，１０－デカンジアミンである、請求項１に記載のポリアミドフィルム積層体。 The aliphatic dicarboxylic acid having 18 or more carbon atoms (A) is a dimer acid, the aliphatic diamine having 18 or more carbon atoms (B) is a dimer diamine, the aromatic dicarboxylic acid having 12 or less carbon atoms (C) is terephthalic acid, The polyamide film laminate according to claim 1, wherein the aliphatic diamine (D) having 12 or less carbon atoms is 1,10-decanediamine. 前記炭素数１８以上の脂肪族ジカルボン酸（Ａ）からなる単位と、前記炭素数１８以上の脂肪族ジアミン（Ｂ）からなる単位の合計の含有量が、前記ポリアミド（Ｅ）を構成する全モノマー成分に対して、１０～９０質量％である、請求項１に記載のポリアミドフィルム積層体。 The total content of the units consisting of the aliphatic dicarboxylic acid (A) having 18 or more carbon atoms and the unit consisting of the aliphatic diamine (B) having 18 or more carbon atoms is the total content of all the monomers constituting the polyamide (E). The polyamide film laminate according to claim 1, wherein the amount is 10 to 90% by mass based on the components. 前記ポリアミドフィルム（Ｆ）と前記金属層との剥離強度が０．１［Ｎ／ｍｍ］以上である、請求項１に記載のポリアミドフィルム積層体。 The polyamide film laminate according to claim 1, wherein the peel strength between the polyamide film (F) and the metal layer is 0.1 [N/mm] or more. 前記ポリアミドフィルム積層体から作製した、特性インピーダンスが５０Ωのマイクロストリップラインの伝送損失の絶対値が、５ＧＨｚで１．８０［ｄＢ／１００ｍｍ］以下である、請求項１に記載のポリアミドフィルム積層体。 The polyamide film laminate according to claim 1, wherein the absolute value of transmission loss of a microstrip line having a characteristic impedance of 50Ω, which is produced from the polyamide film laminate, is 1.80 [dB/100mm] or less at 5 GHz. 前記金属層が前記ポリアミドフィルム（Ｆ）と直接的に接している、請求項１に記載のポリアミドフィルム積層体。 The polyamide film laminate according to claim 1, wherein the metal layer is in direct contact with the polyamide film (F). 前記金属層が銅、アルミニウム、鉄、ニッケル、スズ、金、銀、合金鋼、合金メッキからなる群から選択される金属から構成されている、請求項１に記載のポリアミドフィルム積層体。 The polyamide film laminate according to claim 1, wherein the metal layer is composed of a metal selected from the group consisting of copper, aluminum, iron, nickel, tin, gold, silver, alloy steel, and alloy plating. 前記ポリアミドフィルム積層体は前記金属層を前記ポリアミドフィルム（Ｆ）の片面または両面に有しており、前記金属層の上に樹脂層をさらに有する、請求項１に記載のポリアミドフィルム積層体。 The polyamide film laminate according to claim 1, wherein the polyamide film laminate has the metal layer on one or both sides of the polyamide film (F), and further has a resin layer on the metal layer. 前記炭素数１８以上の脂肪族ジカルボン酸（Ａ）からなる単位の含有量が、前記ポリアミドを構成する全モノマー成分に対して、３～４５質量％であり、
前記炭素数１８以上の脂肪族ジアミン（Ｂ）からなる単位の含有量が、前記ポリアミドを構成する全モノマー成分に対して、３～４５質量％であり、
前記炭素数１２以下の芳香族ジカルボン酸（Ｃ）からなる単位の含有量が、前記ポリアミドを構成する全モノマー成分に対して、３～４５質量％であり、
前記炭素数１２以下の脂肪族ジアミン（Ｄ）からなる単位の含有量が、前記ポリアミドを構成する全モノマー成分に対して、３～５２質量％である、請求項１に記載のポリアミドフィルム積層体。 The content of the unit consisting of the aliphatic dicarboxylic acid (A) having 18 or more carbon atoms is 3 to 45% by mass based on the total monomer components constituting the polyamide,
The content of the unit consisting of the aliphatic diamine (B) having 18 or more carbon atoms is 3 to 45% by mass based on the total monomer components constituting the polyamide,
The content of the unit consisting of the aromatic dicarboxylic acid (C) having 12 or less carbon atoms is 3 to 45% by mass with respect to the total monomer components constituting the polyamide,
The polyamide film laminate according to claim 1, wherein the content of the unit consisting of the aliphatic diamine (D) having 12 or less carbon atoms is 3 to 52% by mass based on the total monomer components constituting the polyamide. . 前記ポリアミドフィルム（Ｆ）の結晶融解エンタルピーが２５Ｊ／ｇ以上である、請求項１に記載のポリアミドフィルム積層体。 The polyamide film laminate according to claim 1, wherein the polyamide film (F) has a crystal melting enthalpy of 25 J/g or more. 前記炭素数１２以下の芳香族ジカルボン酸（Ｃ）からなる単位の含有量が、前記ポリアミドを構成する全モノマー成分に対して、８～３５質量％である、請求項１に記載のポリアミドフィルム積層体。 The polyamide film laminate according to claim 1, wherein the content of the unit consisting of the aromatic dicarboxylic acid (C) having 12 or less carbon atoms is 8 to 35% by mass based on the total monomer components constituting the polyamide. body. 前記ポリアミドフィルム（Ｆ）は１μｍ～２ｍｍの厚みを有し、
前記金属層は１～５００μｍの厚みを有する、請求項１に記載のポリアミドフィルム積層体。 The polyamide film (F) has a thickness of 1 μm to 2 mm,
The polyamide film laminate according to claim 1, wherein the metal layer has a thickness of 1 to 500 μm. 請求項１～１３のいずれかに記載のポリアミドフィルム積層体を製造する方法であって、
前記ポリアミドフィルム（Ｆ）と前記金属層とを、加熱および加圧によって張り合わせる、ポリアミドフィルム積層体の製造方法。 A method for producing a polyamide film laminate according to any one of claims 1 to 13, comprising:
A method for producing a polyamide film laminate, comprising laminating the polyamide film (F) and the metal layer together by heating and pressurizing. 請求項１～１３のいずれかに記載のポリアミドフィルム積層体を含む基板であって、
前記基板はフレキシブルプリント回路基板またはフレキシブルアンテナ基板である、基板。 A substrate comprising the polyamide film laminate according to any one of claims 1 to 13,
The board is a flexible printed circuit board or a flexible antenna board.
JP2023512795A 2021-10-19 2022-10-12 Polyamide film laminate Active JP7274246B1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2021171033 2021-10-19
JP2021171033 2021-10-19
JP2021194789 2021-11-30
JP2021194789 2021-11-30
JP2022035425 2022-03-08
JP2022035425 2022-03-08
PCT/JP2022/037978 WO2023068121A1 (en) 2021-10-19 2022-10-12 Polyamide film laminate

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JPWO2023068121A1 JPWO2023068121A1 (en) 2023-04-27
JP7274246B1 JP7274246B1 (en) 2023-05-16
JPWO2023068121A5 true JPWO2023068121A5 (en) 2023-09-21

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Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6274641A (en) * 1985-09-30 1987-04-06 東レ株式会社 Laminated structure containing polyamide elastomer
JP2012234849A (en) * 2011-04-28 2012-11-29 Unitika Ltd Copper clad laminate for flexible printed wiring board and flexible printed wiring board
JP7143317B2 (en) * 2017-03-20 2022-09-28 ビーエーエスエフ ソシエタス・ヨーロピア Laminate containing metal and polyamide composition
US20220033584A1 (en) * 2018-10-25 2022-02-03 Unitika Ltd. Flexible polyamide
CN114729119A (en) * 2019-11-27 2022-07-08 尤尼吉可株式会社 Flexible polyamide film
JP2021154650A (en) * 2020-03-27 2021-10-07 三井化学株式会社 Metal/resin composite structure, method for manufacturing metal/resin composite structure, and engine mount member
EP4212573A4 (en) * 2020-09-14 2024-03-13 Unitika Ltd Polyamide, molded body and film formed of same, and method for producing said polyamide

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