JP7274246B1 - ポリアミドフィルム積層体 - Google Patents
ポリアミドフィルム積層体 Download PDFInfo
- Publication number
- JP7274246B1 JP7274246B1 JP2023512795A JP2023512795A JP7274246B1 JP 7274246 B1 JP7274246 B1 JP 7274246B1 JP 2023512795 A JP2023512795 A JP 2023512795A JP 2023512795 A JP2023512795 A JP 2023512795A JP 7274246 B1 JP7274246 B1 JP 7274246B1
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- polyamide film
- carbon atoms
- film
- film laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Polyamides (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021171033 | 2021-10-19 | ||
| JP2021171033 | 2021-10-19 | ||
| JP2021194789 | 2021-11-30 | ||
| JP2021194789 | 2021-11-30 | ||
| JP2022035425 | 2022-03-08 | ||
| JP2022035425 | 2022-03-08 | ||
| PCT/JP2022/037978 WO2023068121A1 (ja) | 2021-10-19 | 2022-10-12 | ポリアミドフィルム積層体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023068121A1 JPWO2023068121A1 (https=) | 2023-04-27 |
| JP7274246B1 true JP7274246B1 (ja) | 2023-05-16 |
| JPWO2023068121A5 JPWO2023068121A5 (https=) | 2023-09-21 |
Family
ID=86058187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023512795A Active JP7274246B1 (ja) | 2021-10-19 | 2022-10-12 | ポリアミドフィルム積層体 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7274246B1 (https=) |
| KR (1) | KR20240087700A (https=) |
| TW (1) | TW202333947A (https=) |
| WO (1) | WO2023068121A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6274641A (ja) * | 1985-09-30 | 1987-04-06 | 東レ株式会社 | ポリアミドエラストマ含有積層構造体 |
| JP2012234849A (ja) * | 2011-04-28 | 2012-11-29 | Unitika Ltd | フレキシブルプリント配線板用の銅張積層板およびフレキシブルプリント配線板 |
| WO2020085360A1 (ja) * | 2018-10-25 | 2020-04-30 | ユニチカ株式会社 | 柔軟性ポリアミド |
| JP2020514139A (ja) * | 2017-03-20 | 2020-05-21 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 金属及びポリアミド組成物を含有する積層体 |
| WO2021106541A1 (ja) * | 2019-11-27 | 2021-06-03 | ユニチカ株式会社 | 柔軟性ポリアミドフィルム |
| JP2021154650A (ja) * | 2020-03-27 | 2021-10-07 | 三井化学株式会社 | 金属/樹脂複合構造体、金属/樹脂複合構造体の製造方法およびエンジンマウント部材 |
| WO2022054944A1 (ja) * | 2020-09-14 | 2022-03-17 | ユニチカ株式会社 | ポリアミドおよびそれからなる成形体およびフィルムならびに該ポリアミドの製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000186141A (ja) | 1998-12-22 | 2000-07-04 | Kuraray Co Ltd | ポリアミドおよびそれからなるポリアミドフィルム |
| JP6000084B2 (ja) | 2011-11-17 | 2016-09-28 | ユニチカ株式会社 | 半芳香族ポリアミド樹脂組成物 |
| JP6585273B1 (ja) | 2018-12-28 | 2019-10-02 | 住友化学株式会社 | 発光素子用組成物及び発光素子の製造方法 |
-
2022
- 2022-10-12 WO PCT/JP2022/037978 patent/WO2023068121A1/ja not_active Ceased
- 2022-10-12 KR KR1020247009112A patent/KR20240087700A/ko active Pending
- 2022-10-12 JP JP2023512795A patent/JP7274246B1/ja active Active
- 2022-10-12 TW TW111138546A patent/TW202333947A/zh unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6274641A (ja) * | 1985-09-30 | 1987-04-06 | 東レ株式会社 | ポリアミドエラストマ含有積層構造体 |
| JP2012234849A (ja) * | 2011-04-28 | 2012-11-29 | Unitika Ltd | フレキシブルプリント配線板用の銅張積層板およびフレキシブルプリント配線板 |
| JP2020514139A (ja) * | 2017-03-20 | 2020-05-21 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 金属及びポリアミド組成物を含有する積層体 |
| WO2020085360A1 (ja) * | 2018-10-25 | 2020-04-30 | ユニチカ株式会社 | 柔軟性ポリアミド |
| WO2021106541A1 (ja) * | 2019-11-27 | 2021-06-03 | ユニチカ株式会社 | 柔軟性ポリアミドフィルム |
| JP2021154650A (ja) * | 2020-03-27 | 2021-10-07 | 三井化学株式会社 | 金属/樹脂複合構造体、金属/樹脂複合構造体の製造方法およびエンジンマウント部材 |
| WO2022054944A1 (ja) * | 2020-09-14 | 2022-03-17 | ユニチカ株式会社 | ポリアミドおよびそれからなる成形体およびフィルムならびに該ポリアミドの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202333947A (zh) | 2023-09-01 |
| JPWO2023068121A1 (https=) | 2023-04-27 |
| KR20240087700A (ko) | 2024-06-19 |
| WO2023068121A1 (ja) | 2023-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI856210B (zh) | 柔軟性聚醯胺膜 | |
| JP7398288B2 (ja) | 押出成形用組成物、そのフィルム、及び、フィルムの製造方法 | |
| CN104662094B (zh) | 半芳香族聚酰胺膜 | |
| CN107200856A (zh) | 半芳香族聚酰胺膜及其制造方法 | |
| JP6842792B1 (ja) | 半芳香族ポリアミドフィルムおよびその製造方法 | |
| WO2019031428A1 (ja) | 半芳香族ポリアミドフィルムおよびその製造方法 | |
| JP6358837B2 (ja) | 半芳香族ポリアミドフィルム | |
| EP3030604B1 (en) | Polyamide films and process for preparation | |
| JP7051181B1 (ja) | ポリアミドおよびそれからなる成形体およびフィルムならびに該ポリアミドの製造方法 | |
| JP7274246B1 (ja) | ポリアミドフィルム積層体 | |
| CN118076481A (zh) | 聚酰胺膜层叠体 | |
| JP7445356B2 (ja) | ポリアミドフィルムおよびその製造方法 | |
| JP2020132744A (ja) | 半芳香族ポリアミドフィルム | |
| JP2024009620A (ja) | 延伸ポリアミドフィルム | |
| KR102648548B1 (ko) | 반방향족 폴리아미드 필름 및 그것으로부터 얻어지는 적층체 | |
| KR20260047574A (ko) | 반방향족 폴리아미드 필름 및 그 제조 방법 | |
| JP2025041572A (ja) | 熱可塑性樹脂フィルム | |
| WO2026089042A1 (ja) | 半芳香族ポリアミド組成物、半芳香族ポリアミドフィルム及びその製造方法、電子材料、光学部品、並びに太陽光発電モジュール |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230221 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230221 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20230221 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230404 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230424 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7274246 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |