JPWO2023171521A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023171521A5 JPWO2023171521A5 JP2023577252A JP2023577252A JPWO2023171521A5 JP WO2023171521 A5 JPWO2023171521 A5 JP WO2023171521A5 JP 2023577252 A JP2023577252 A JP 2023577252A JP 2023577252 A JP2023577252 A JP 2023577252A JP WO2023171521 A5 JPWO2023171521 A5 JP WO2023171521A5
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- carbon atoms
- polyamide film
- unit consisting
- dicarboxylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004952 Polyamide Substances 0.000 claims 37
- 229920002647 polyamide Polymers 0.000 claims 37
- 125000004432 carbon atom Chemical group C* 0.000 claims 23
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 12
- -1 aliphatic diamine Chemical class 0.000 claims 11
- 125000001931 aliphatic group Chemical group 0.000 claims 6
- 125000003118 aryl group Chemical group 0.000 claims 6
- 239000000178 monomer Substances 0.000 claims 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims 2
- 239000000539 dimer Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 claims 1
- 150000004985 diamines Chemical class 0.000 claims 1
- 230000004927 fusion Effects 0.000 claims 1
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- 239000011147 inorganic material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000011084 recovery Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022037438 | 2022-03-10 | ||
| JP2022037438 | 2022-03-10 | ||
| PCT/JP2023/007760 WO2023171521A1 (ja) | 2022-03-10 | 2023-03-02 | ポリアミドフィルムおよびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023171521A1 JPWO2023171521A1 (https=) | 2023-09-14 |
| JP7445356B2 JP7445356B2 (ja) | 2024-03-07 |
| JPWO2023171521A5 true JPWO2023171521A5 (https=) | 2024-03-12 |
Family
ID=87935312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023577252A Active JP7445356B2 (ja) | 2022-03-10 | 2023-03-02 | ポリアミドフィルムおよびその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7445356B2 (https=) |
| TW (1) | TW202346417A (https=) |
| WO (1) | WO2023171521A1 (https=) |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2579601B1 (fr) * | 1985-03-28 | 1987-12-11 | Rhone Poulenc Spec Chim | Copolyetheramides techniques souples a basse temperature |
| JPS6274641A (ja) * | 1985-09-30 | 1987-04-06 | 東レ株式会社 | ポリアミドエラストマ含有積層構造体 |
| JPH0641514B2 (ja) * | 1988-08-17 | 1994-06-01 | 三菱化成株式会社 | ブロックコポリアミドの製造法 |
| US4946933A (en) * | 1989-02-27 | 1990-08-07 | Texaco Chemical Company | Elastomeric polyamide hot melt adhesive from low molecular weight polyoxyethylene diamine |
| US5191060A (en) * | 1992-01-08 | 1993-03-02 | Allied Signal | Preparation of dodecane terephthalamide polymers |
| ATE445660T1 (de) * | 2007-05-03 | 2009-10-15 | Ems Patent Ag | Teilaromatische polyamidformmassen und deren verwendungen |
| US20140316062A1 (en) | 2011-02-15 | 2014-10-23 | Dsm Ip Assets B.V. | Polyamide containing monomer units of 1,4-butylene diamine |
| JP2012234849A (ja) | 2011-04-28 | 2012-11-29 | Unitika Ltd | フレキシブルプリント配線板用の銅張積層板およびフレキシブルプリント配線板 |
| CN102532530B (zh) | 2012-01-05 | 2014-04-02 | 南京工业大学 | 一种二聚酸型共聚尼龙的制备方法 |
| CN106661222A (zh) * | 2014-07-02 | 2017-05-10 | 东洋油墨Sc控股株式会社 | 热硬化性树脂组合物、聚酰胺、接着性片、硬化物及印刷配线板 |
| WO2016050910A1 (en) | 2014-10-03 | 2016-04-07 | Dsm Ip Assets B.V. | Copolyamides with alternating repeat units |
| EP3600880B1 (de) | 2017-03-20 | 2021-01-27 | Basf Se | Laminate enthaltend ein metall und eine polyamidzusammensetzung |
| US12180339B2 (en) | 2018-10-25 | 2024-12-31 | Unitika Ltd. | Flexible polyamide |
| JP6986761B2 (ja) | 2019-02-21 | 2021-12-22 | ユニチカ株式会社 | 積層フィルムおよびその製造方法 |
| EP4067408B1 (en) | 2019-11-27 | 2025-07-30 | Unitika Ltd. | Flexible polyamide film |
| JP7587349B2 (ja) | 2020-03-27 | 2024-11-20 | 三井化学株式会社 | 金属／樹脂複合構造体、金属／樹脂複合構造体の製造方法およびエンジンマウント部材 |
| WO2022036189A1 (en) | 2020-08-13 | 2022-02-17 | Ascend Performance Materials Operations Llc | Aliphatic and semi-aromatic polyamides with dimer acids and dimer amines |
-
2023
- 2023-03-02 JP JP2023577252A patent/JP7445356B2/ja active Active
- 2023-03-02 TW TW112107464A patent/TW202346417A/zh unknown
- 2023-03-02 WO PCT/JP2023/007760 patent/WO2023171521A1/ja not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008524396A5 (https=) | ||
| JP2005530908A5 (https=) | ||
| TWI500501B (zh) | Second layer double sided flexible metal laminated board and manufacturing method thereof | |
| JP5355957B2 (ja) | 積層体及びその製造方法並びに回路基板用部材 | |
| TW200407365A (en) | Polyimide film and manufacturing method thereof, and polyimide/metal lamination using polyimide film | |
| CN108117654B (zh) | 尺寸稳定型聚酰亚胺薄膜及其制备方法 | |
| KR20090038879A (ko) | 열경화성 폴리이미드 수지 조성물 | |
| US20120088109A1 (en) | Linear polyimide precursor, linear polyimide and heat-cured product thereof, and method for producing them | |
| JP2004149769A (ja) | ポリアミドおよび樹脂組成物 | |
| JPWO2023171521A5 (https=) | ||
| JP2000186141A (ja) | ポリアミドおよびそれからなるポリアミドフィルム | |
| EP1864796A4 (en) | MULTILAYER STRUCTURE | |
| TW201215257A (en) | Method for manufacturing multilayer printed wiring board | |
| TW567211B (en) | Polyimide composition having improved peel strength when clad | |
| JP2004358677A (ja) | 積層体の製造方法 | |
| JP3395158B2 (ja) | フレキシブル金属箔張り積層板の製造方法 | |
| JP4947976B2 (ja) | フレキシブルプリント配線板用基板及びその製造方法 | |
| JP3063929B2 (ja) | 耐熱性の接着剤 | |
| JPWO2023068121A5 (https=) | ||
| JP2006286912A (ja) | 高屈曲性を示すフレキシブル銅張り積層板 | |
| JPWO2023276880A5 (https=) | ||
| JP2006013419A (ja) | フレキシブルプリント基板およびその製造方法 | |
| JP2020122165A5 (https=) | ||
| CN120282653A (zh) | 一种支撑件、显示模组以及显示装置 | |
| KR20210057011A (ko) | 공중합 폴리에스테르 필름 |