JPWO2023068024A5 - - Google Patents
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- Publication number
- JPWO2023068024A5 JPWO2023068024A5 JP2023554407A JP2023554407A JPWO2023068024A5 JP WO2023068024 A5 JPWO2023068024 A5 JP WO2023068024A5 JP 2023554407 A JP2023554407 A JP 2023554407A JP 2023554407 A JP2023554407 A JP 2023554407A JP WO2023068024 A5 JPWO2023068024 A5 JP WO2023068024A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- thermosetting resin
- volume
- composition according
- boron nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 claims description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- 229910052582 BN Inorganic materials 0.000 claims 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 239000000945 filler Substances 0.000 claims 5
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 125000000524 functional group Chemical group 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 238000002360 preparation method Methods 0.000 claims 2
- 229910002601 GaN Inorganic materials 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 229920006243 acrylic copolymer Polymers 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims 1
- 239000000347 magnesium hydroxide Substances 0.000 claims 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 239000000454 talc Substances 0.000 claims 1
- 229910052623 talc Inorganic materials 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- STQYDSASXIHUJU-UHFFFAOYSA-N n-ethylethanamine;trifluoroborane Chemical compound FB(F)F.CCNCC STQYDSASXIHUJU-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021171904 | 2021-10-20 | ||
| PCT/JP2022/036896 WO2023068024A1 (ja) | 2021-10-20 | 2022-10-03 | 熱硬化性樹脂組成物、放熱シート、放熱板、放熱シートの製造方法、及び放熱板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023068024A1 JPWO2023068024A1 (https=) | 2023-04-27 |
| JPWO2023068024A5 true JPWO2023068024A5 (https=) | 2025-05-21 |
Family
ID=86058085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023554407A Pending JPWO2023068024A1 (https=) | 2021-10-20 | 2022-10-03 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023068024A1 (https=) |
| CN (1) | CN118103447A (https=) |
| TW (1) | TWI905461B (https=) |
| WO (1) | WO2023068024A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024045039A (ja) * | 2022-09-20 | 2024-04-02 | 住友ベークライト株式会社 | 樹脂シート |
| CN120731237A (zh) * | 2023-04-14 | 2025-09-30 | 株式会社有泽制作所 | 热固性树脂组合物、树脂片、散热板、树脂片的制造方法及散热板的制造方法 |
| WO2024257369A1 (ja) * | 2023-06-15 | 2024-12-19 | 住友ベークライト株式会社 | 樹脂シート |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5738652B2 (ja) * | 2011-03-30 | 2015-06-24 | 日東電工株式会社 | 熱伝導性シートの製造方法および熱伝導性シート |
| KR101958506B1 (ko) * | 2011-11-02 | 2019-03-14 | 히타치가세이가부시끼가이샤 | 수지 조성물, 및 그것을 이용한 수지 시트, 프리프레그, 적층판, 금속 기판, 프린트 배선판 및 파워 반도체 장치 |
| US11577957B2 (en) * | 2016-12-28 | 2023-02-14 | Showa Denko K.K. | Hexagonal boron nitride powder, method for producing same, resin composition and resin sheet |
| US20180230290A1 (en) * | 2017-02-10 | 2018-08-16 | E I Du Pont De Nemours And Company | Thermally conductive polymer composition |
| JP7028704B2 (ja) * | 2017-04-28 | 2022-03-02 | 積水化学工業株式会社 | 熱硬化性材料 |
| JP6936442B2 (ja) * | 2017-08-31 | 2021-09-15 | 株式会社豊田中央研究所 | 熱伝導性フィラー、熱伝導性複合材料、及び熱伝導性フィラーの製造方法 |
| WO2019150446A1 (ja) * | 2018-01-30 | 2019-08-08 | 日立化成株式会社 | 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法 |
| JP7215164B2 (ja) * | 2018-12-28 | 2023-01-31 | 東洋インキＳｃホールディングス株式会社 | 熱伝導性絶縁接着シート、及び該シートの製造方法 |
| JP2020105412A (ja) * | 2018-12-28 | 2020-07-09 | 東洋インキＳｃホールディングス株式会社 | 熱伝導性絶縁接着シート、及び該シートの製造方法 |
| JP7079378B2 (ja) * | 2019-03-28 | 2022-06-01 | デンカ株式会社 | 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材 |
| JP7582190B2 (ja) * | 2019-07-11 | 2024-11-13 | 株式会社レゾナック | シリカ被覆窒化ホウ素粒子の製造方法、シリカ被覆窒化ホウ素粒子 |
-
2022
- 2022-10-03 CN CN202280067517.5A patent/CN118103447A/zh active Pending
- 2022-10-03 JP JP2023554407A patent/JPWO2023068024A1/ja active Pending
- 2022-10-03 WO PCT/JP2022/036896 patent/WO2023068024A1/ja not_active Ceased
- 2022-10-12 TW TW111138672A patent/TWI905461B/zh active
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