JPWO2023068024A1 - - Google Patents
Info
- Publication number
- JPWO2023068024A1 JPWO2023068024A1 JP2023554407A JP2023554407A JPWO2023068024A1 JP WO2023068024 A1 JPWO2023068024 A1 JP WO2023068024A1 JP 2023554407 A JP2023554407 A JP 2023554407A JP 2023554407 A JP2023554407 A JP 2023554407A JP WO2023068024 A1 JPWO2023068024 A1 JP WO2023068024A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021171904 | 2021-10-20 | ||
| PCT/JP2022/036896 WO2023068024A1 (ja) | 2021-10-20 | 2022-10-03 | 熱硬化性樹脂組成物、放熱シート、放熱板、放熱シートの製造方法、及び放熱板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023068024A1 true JPWO2023068024A1 (https=) | 2023-04-27 |
| JPWO2023068024A5 JPWO2023068024A5 (https=) | 2025-05-21 |
Family
ID=86058085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023554407A Pending JPWO2023068024A1 (https=) | 2021-10-20 | 2022-10-03 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023068024A1 (https=) |
| CN (1) | CN118103447A (https=) |
| TW (1) | TWI905461B (https=) |
| WO (1) | WO2023068024A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024045039A (ja) * | 2022-09-20 | 2024-04-02 | 住友ベークライト株式会社 | 樹脂シート |
| CN120731237A (zh) * | 2023-04-14 | 2025-09-30 | 株式会社有泽制作所 | 热固性树脂组合物、树脂片、散热板、树脂片的制造方法及散热板的制造方法 |
| WO2024257369A1 (ja) * | 2023-06-15 | 2024-12-19 | 住友ベークライト株式会社 | 樹脂シート |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5738652B2 (ja) * | 2011-03-30 | 2015-06-24 | 日東電工株式会社 | 熱伝導性シートの製造方法および熱伝導性シート |
| KR101958506B1 (ko) * | 2011-11-02 | 2019-03-14 | 히타치가세이가부시끼가이샤 | 수지 조성물, 및 그것을 이용한 수지 시트, 프리프레그, 적층판, 금속 기판, 프린트 배선판 및 파워 반도체 장치 |
| US11577957B2 (en) * | 2016-12-28 | 2023-02-14 | Showa Denko K.K. | Hexagonal boron nitride powder, method for producing same, resin composition and resin sheet |
| US20180230290A1 (en) * | 2017-02-10 | 2018-08-16 | E I Du Pont De Nemours And Company | Thermally conductive polymer composition |
| JP7028704B2 (ja) * | 2017-04-28 | 2022-03-02 | 積水化学工業株式会社 | 熱硬化性材料 |
| JP6936442B2 (ja) * | 2017-08-31 | 2021-09-15 | 株式会社豊田中央研究所 | 熱伝導性フィラー、熱伝導性複合材料、及び熱伝導性フィラーの製造方法 |
| WO2019150446A1 (ja) * | 2018-01-30 | 2019-08-08 | 日立化成株式会社 | 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法 |
| JP7215164B2 (ja) * | 2018-12-28 | 2023-01-31 | 東洋インキＳｃホールディングス株式会社 | 熱伝導性絶縁接着シート、及び該シートの製造方法 |
| JP2020105412A (ja) * | 2018-12-28 | 2020-07-09 | 東洋インキＳｃホールディングス株式会社 | 熱伝導性絶縁接着シート、及び該シートの製造方法 |
| JP7079378B2 (ja) * | 2019-03-28 | 2022-06-01 | デンカ株式会社 | 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材 |
| JP7582190B2 (ja) * | 2019-07-11 | 2024-11-13 | 株式会社レゾナック | シリカ被覆窒化ホウ素粒子の製造方法、シリカ被覆窒化ホウ素粒子 |
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2022
- 2022-10-03 CN CN202280067517.5A patent/CN118103447A/zh active Pending
- 2022-10-03 JP JP2023554407A patent/JPWO2023068024A1/ja active Pending
- 2022-10-03 WO PCT/JP2022/036896 patent/WO2023068024A1/ja not_active Ceased
- 2022-10-12 TW TW111138672A patent/TWI905461B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI905461B (zh) | 2025-11-21 |
| CN118103447A (zh) | 2024-05-28 |
| TW202319433A (zh) | 2023-05-16 |
| WO2023068024A1 (ja) | 2023-04-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250513 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250513 |