CN118103447A - 热固性树脂组合物、散热片、散热板、散热片的制造方法及散热板的制造方法 - Google Patents

热固性树脂组合物、散热片、散热板、散热片的制造方法及散热板的制造方法 Download PDF

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Publication number
CN118103447A
CN118103447A CN202280067517.5A CN202280067517A CN118103447A CN 118103447 A CN118103447 A CN 118103447A CN 202280067517 A CN202280067517 A CN 202280067517A CN 118103447 A CN118103447 A CN 118103447A
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CN
China
Prior art keywords
resin composition
thermosetting resin
heat sink
volume
boron nitride
Prior art date
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Pending
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CN202280067517.5A
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English (en)
Chinese (zh)
Inventor
加纳一敬
外山裕二
矢野雅枝
阿部佐纪
须藤启佑
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Arisawa Mfg Co Ltd
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Arisawa Mfg Co Ltd
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Publication date
Application filed by Arisawa Mfg Co Ltd filed Critical Arisawa Mfg Co Ltd
Publication of CN118103447A publication Critical patent/CN118103447A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202280067517.5A 2021-10-20 2022-10-03 热固性树脂组合物、散热片、散热板、散热片的制造方法及散热板的制造方法 Pending CN118103447A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-171904 2021-10-20
JP2021171904 2021-10-20
PCT/JP2022/036896 WO2023068024A1 (ja) 2021-10-20 2022-10-03 熱硬化性樹脂組成物、放熱シート、放熱板、放熱シートの製造方法、及び放熱板の製造方法

Publications (1)

Publication Number Publication Date
CN118103447A true CN118103447A (zh) 2024-05-28

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CN202280067517.5A Pending CN118103447A (zh) 2021-10-20 2022-10-03 热固性树脂组合物、散热片、散热板、散热片的制造方法及散热板的制造方法

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JP (1) JPWO2023068024A1 (https=)
CN (1) CN118103447A (https=)
TW (1) TWI905461B (https=)
WO (1) WO2023068024A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024045039A (ja) * 2022-09-20 2024-04-02 住友ベークライト株式会社 樹脂シート
CN120731237A (zh) * 2023-04-14 2025-09-30 株式会社有泽制作所 热固性树脂组合物、树脂片、散热板、树脂片的制造方法及散热板的制造方法
WO2024257369A1 (ja) * 2023-06-15 2024-12-19 住友ベークライト株式会社 樹脂シート

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5738652B2 (ja) * 2011-03-30 2015-06-24 日東電工株式会社 熱伝導性シートの製造方法および熱伝導性シート
KR101958506B1 (ko) * 2011-11-02 2019-03-14 히타치가세이가부시끼가이샤 수지 조성물, 및 그것을 이용한 수지 시트, 프리프레그, 적층판, 금속 기판, 프린트 배선판 및 파워 반도체 장치
US11577957B2 (en) * 2016-12-28 2023-02-14 Showa Denko K.K. Hexagonal boron nitride powder, method for producing same, resin composition and resin sheet
US20180230290A1 (en) * 2017-02-10 2018-08-16 E I Du Pont De Nemours And Company Thermally conductive polymer composition
JP7028704B2 (ja) * 2017-04-28 2022-03-02 積水化学工業株式会社 熱硬化性材料
JP6936442B2 (ja) * 2017-08-31 2021-09-15 株式会社豊田中央研究所 熱伝導性フィラー、熱伝導性複合材料、及び熱伝導性フィラーの製造方法
WO2019150446A1 (ja) * 2018-01-30 2019-08-08 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法
JP7215164B2 (ja) * 2018-12-28 2023-01-31 東洋インキＳｃホールディングス株式会社 熱伝導性絶縁接着シート、及び該シートの製造方法
JP2020105412A (ja) * 2018-12-28 2020-07-09 東洋インキＳｃホールディングス株式会社 熱伝導性絶縁接着シート、及び該シートの製造方法
JP7079378B2 (ja) * 2019-03-28 2022-06-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材
JP7582190B2 (ja) * 2019-07-11 2024-11-13 株式会社レゾナック シリカ被覆窒化ホウ素粒子の製造方法、シリカ被覆窒化ホウ素粒子

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TWI905461B (zh) 2025-11-21
JPWO2023068024A1 (https=) 2023-04-27
TW202319433A (zh) 2023-05-16
WO2023068024A1 (ja) 2023-04-27

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