JPWO2023063357A5 - - Google Patents
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- Publication number
- JPWO2023063357A5 JPWO2023063357A5 JP2023530919A JP2023530919A JPWO2023063357A5 JP WO2023063357 A5 JPWO2023063357 A5 JP WO2023063357A5 JP 2023530919 A JP2023530919 A JP 2023530919A JP 2023530919 A JP2023530919 A JP 2023530919A JP WO2023063357 A5 JPWO2023063357 A5 JP WO2023063357A5
- Authority
- JP
- Japan
- Prior art keywords
- multilayer structure
- aromatic
- copper foil
- vinyl compound
- aromatic vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 10
- 239000011347 resin Substances 0.000 claims 10
- 229920002554 vinyl polymer Polymers 0.000 claims 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 7
- -1 aromatic vinyl compound Chemical class 0.000 claims 7
- 239000011889 copper foil Substances 0.000 claims 7
- 239000000178 monomer Substances 0.000 claims 7
- 150000001336 alkenes Chemical class 0.000 claims 4
- 229920001577 copolymer Polymers 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 239000003607 modifier Substances 0.000 claims 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 3
- 229920001955 polyphenylene ether Polymers 0.000 claims 3
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 2
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 claims 2
- 150000004291 polyenes Chemical class 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024025889A JP7638410B2 (ja) | 2021-10-14 | 2024-02-22 | 絶縁層を含む多層構造体 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021169042 | 2021-10-14 | ||
| JP2021169042 | 2021-10-14 | ||
| PCT/JP2022/038065 WO2023063357A1 (ja) | 2021-10-14 | 2022-10-12 | 絶縁層を含む多層構造体 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024025889A Division JP7638410B2 (ja) | 2021-10-14 | 2024-02-22 | 絶縁層を含む多層構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023063357A1 JPWO2023063357A1 (https=) | 2023-04-20 |
| JPWO2023063357A5 true JPWO2023063357A5 (https=) | 2023-10-03 |
| JP7445092B2 JP7445092B2 (ja) | 2024-03-06 |
Family
ID=85988635
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023530919A Active JP7445092B2 (ja) | 2021-10-14 | 2022-10-12 | 絶縁層を含む多層構造体 |
| JP2024025889A Active JP7638410B2 (ja) | 2021-10-14 | 2024-02-22 | 絶縁層を含む多層構造体 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024025889A Active JP7638410B2 (ja) | 2021-10-14 | 2024-02-22 | 絶縁層を含む多層構造体 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250010581A1 (https=) |
| EP (1) | EP4417413A4 (https=) |
| JP (2) | JP7445092B2 (https=) |
| KR (1) | KR20240051988A (https=) |
| CN (2) | CN117858798B (https=) |
| TW (2) | TW202446598A (https=) |
| WO (1) | WO2023063357A1 (https=) |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2716639B2 (ja) | 1992-12-24 | 1998-02-18 | 住友ベークライト株式会社 | 低誘電率熱硬化性樹脂組成物 |
| JPH0940709A (ja) | 1995-07-31 | 1997-02-10 | Denki Kagaku Kogyo Kk | エチレン−芳香族ビニル化合物共重合体の製造方法 |
| JP3659760B2 (ja) | 1996-03-19 | 2005-06-15 | 電気化学工業株式会社 | エチレン−芳香族ビニル化合物共重合体及びその製造方法 |
| US6559234B1 (en) | 1998-12-22 | 2003-05-06 | Denki Kagaku Kogyo Kabushiki Kaisha | Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof |
| JP2001287300A (ja) * | 2000-04-04 | 2001-10-16 | Shin Etsu Polymer Co Ltd | 銅張積層基板及びその製造方法 |
| JP2002353633A (ja) * | 2001-05-25 | 2002-12-06 | Shin Kobe Electric Mach Co Ltd | 多層プリント配線板の製造法及び多層プリント配線板 |
| JP3985633B2 (ja) | 2002-08-26 | 2007-10-03 | 株式会社日立製作所 | 低誘電正接絶縁材料を用いた高周波用電子部品 |
| KR100815319B1 (ko) * | 2006-08-30 | 2008-03-19 | 삼성전기주식회사 | 고밀도 인쇄회로기판 및 그 제조 방법 |
| JP5104507B2 (ja) | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| JP2009161743A (ja) | 2007-12-10 | 2009-07-23 | Denki Kagaku Kogyo Kk | 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料 |
| JP5315334B2 (ja) | 2008-03-04 | 2013-10-16 | 新日鉄住金化学株式会社 | 多官能ビニル芳香族共重合体、その製造方法及び樹脂組成物 |
| JP5481098B2 (ja) | 2009-06-03 | 2014-04-23 | 電気化学工業株式会社 | 後硬化性樹脂組成物及びそれを用いた電気絶縁材料 |
| JP2011074187A (ja) | 2009-09-30 | 2011-04-14 | Denki Kagaku Kogyo Kk | 易架橋性熱可塑性樹脂 |
| KR101832684B1 (ko) | 2015-01-13 | 2018-02-26 | 히타치가세이가부시끼가이샤 | 플렉시블 프린트 배선판용 수지 필름, 수지 부착 금속박, 커버 레이 필름, 본딩 시트 및 플렉시블 프린트 배선판 |
| JP6601675B2 (ja) * | 2016-01-14 | 2019-11-06 | パナソニックＩｐマネジメント株式会社 | 金属張積層板および樹脂付金属箔 |
| JP6738205B2 (ja) * | 2016-06-06 | 2020-08-12 | 昭和電工パッケージング株式会社 | ラミネート材 |
| JP6995534B2 (ja) | 2016-08-31 | 2022-01-14 | 日鉄ケミカル＆マテリアル株式会社 | 可溶性多官能ビニル芳香族共重合体、その製造方法、硬化性樹脂組成物及びその硬化物 |
| KR102537249B1 (ko) | 2017-03-30 | 2023-05-26 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 가용성 다관능 비닐 방향족 공중합체, 그 제조 방법, 경화성 수지 조성물 및 그 경화물 |
| CN109385018A (zh) * | 2017-08-04 | 2019-02-26 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及使用其制作的半固化片与覆金属箔层压板 |
| CN109385021A (zh) * | 2017-08-04 | 2019-02-26 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及使用其制作的半固化片与覆金属箔层压板 |
| JP7465894B2 (ja) | 2019-12-03 | 2024-04-11 | デンカ株式会社 | 硬化性組成物及びその硬化体 |
| CN118599040A (zh) * | 2020-07-15 | 2024-09-06 | 电化株式会社 | 组合物及固化体 |
| CN115667393A (zh) * | 2020-09-11 | 2023-01-31 | 电化株式会社 | 组合物及其固化体 |
| JP7570901B2 (ja) * | 2020-11-27 | 2024-10-22 | デンカ株式会社 | 組成物及びその硬化物 |
-
2022
- 2022-10-12 CN CN202280057657.4A patent/CN117858798B/zh active Active
- 2022-10-12 US US18/701,376 patent/US20250010581A1/en active Pending
- 2022-10-12 WO PCT/JP2022/038065 patent/WO2023063357A1/ja not_active Ceased
- 2022-10-12 EP EP22881052.9A patent/EP4417413A4/en active Pending
- 2022-10-12 KR KR1020247009283A patent/KR20240051988A/ko active Pending
- 2022-10-12 CN CN202411678747.2A patent/CN119239086A/zh active Pending
- 2022-10-12 JP JP2023530919A patent/JP7445092B2/ja active Active
- 2022-10-14 TW TW113128008A patent/TW202446598A/zh unknown
- 2022-10-14 TW TW111139074A patent/TWI864457B/zh active
-
2024
- 2024-02-22 JP JP2024025889A patent/JP7638410B2/ja active Active
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