JP7445092B2 - 絶縁層を含む多層構造体 - Google Patents

絶縁層を含む多層構造体 Download PDF

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Publication number
JP7445092B2
JP7445092B2 JP2023530919A JP2023530919A JP7445092B2 JP 7445092 B2 JP7445092 B2 JP 7445092B2 JP 2023530919 A JP2023530919 A JP 2023530919A JP 2023530919 A JP2023530919 A JP 2023530919A JP 7445092 B2 JP7445092 B2 JP 7445092B2
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Prior art keywords
copper foil
aromatic
olefin
multilayer structure
copolymer
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Japanese (ja)
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JPWO2023063357A5 (https=
JPWO2023063357A1 (https=
Inventor
亨 荒井
諒介 菅藤
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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Publication of JPWO2023063357A1 publication Critical patent/JPWO2023063357A1/ja
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Priority to JP2024025889A priority Critical patent/JP7638410B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Insulated Conductors (AREA)
JP2023530919A 2021-10-14 2022-10-12 絶縁層を含む多層構造体 Active JP7445092B2 (ja)

Priority Applications (1)

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JP2024025889A JP7638410B2 (ja) 2021-10-14 2024-02-22 絶縁層を含む多層構造体

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JP2021169042 2021-10-14
JP2021169042 2021-10-14
PCT/JP2022/038065 WO2023063357A1 (ja) 2021-10-14 2022-10-12 絶縁層を含む多層構造体

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JPWO2023063357A1 JPWO2023063357A1 (https=) 2023-04-20
JPWO2023063357A5 JPWO2023063357A5 (https=) 2023-10-03
JP7445092B2 true JP7445092B2 (ja) 2024-03-06

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US (1) US20250010581A1 (https=)
EP (1) EP4417413A4 (https=)
JP (2) JP7445092B2 (https=)
KR (1) KR20240051988A (https=)
CN (2) CN117858798B (https=)
TW (2) TW202446598A (https=)
WO (1) WO2023063357A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009161743A (ja) 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP2010280771A (ja) 2009-06-03 2010-12-16 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた電気絶縁材料
JP2011074187A (ja) 2009-09-30 2011-04-14 Denki Kagaku Kogyo Kk 易架橋性熱可塑性樹脂
JP2018039995A (ja) 2016-08-31 2018-03-15 新日鉄住金化学株式会社 可溶性多官能ビニル芳香族共重合体、その製造方法、硬化性樹脂組成物及びその硬化物

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JP2716639B2 (ja) 1992-12-24 1998-02-18 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
JPH0940709A (ja) 1995-07-31 1997-02-10 Denki Kagaku Kogyo Kk エチレン−芳香族ビニル化合物共重合体の製造方法
JP3659760B2 (ja) 1996-03-19 2005-06-15 電気化学工業株式会社 エチレン−芳香族ビニル化合物共重合体及びその製造方法
US6559234B1 (en) 1998-12-22 2003-05-06 Denki Kagaku Kogyo Kabushiki Kaisha Cross-copolymerized olefin/styrene/diene copolymer, process for the production of the same and uses thereof
JP2001287300A (ja) * 2000-04-04 2001-10-16 Shin Etsu Polymer Co Ltd 銅張積層基板及びその製造方法
JP2002353633A (ja) * 2001-05-25 2002-12-06 Shin Kobe Electric Mach Co Ltd 多層プリント配線板の製造法及び多層プリント配線板
JP3985633B2 (ja) 2002-08-26 2007-10-03 株式会社日立製作所 低誘電正接絶縁材料を用いた高周波用電子部品
KR100815319B1 (ko) * 2006-08-30 2008-03-19 삼성전기주식회사 고밀도 인쇄회로기판 및 그 제조 방법
JP5104507B2 (ja) 2007-04-26 2012-12-19 日立化成工業株式会社 セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
JP5315334B2 (ja) 2008-03-04 2013-10-16 新日鉄住金化学株式会社 多官能ビニル芳香族共重合体、その製造方法及び樹脂組成物
KR101832684B1 (ko) 2015-01-13 2018-02-26 히타치가세이가부시끼가이샤 플렉시블 프린트 배선판용 수지 필름, 수지 부착 금속박, 커버 레이 필름, 본딩 시트 및 플렉시블 프린트 배선판
JP6601675B2 (ja) * 2016-01-14 2019-11-06 パナソニックＩｐマネジメント株式会社 金属張積層板および樹脂付金属箔
JP6738205B2 (ja) * 2016-06-06 2020-08-12 昭和電工パッケージング株式会社 ラミネート材
KR102537249B1 (ko) 2017-03-30 2023-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 가용성 다관능 비닐 방향족 공중합체, 그 제조 방법, 경화성 수지 조성물 및 그 경화물
CN109385018A (zh) * 2017-08-04 2019-02-26 广东生益科技股份有限公司 一种热固性树脂组合物及使用其制作的半固化片与覆金属箔层压板
CN109385021A (zh) * 2017-08-04 2019-02-26 广东生益科技股份有限公司 一种热固性树脂组合物及使用其制作的半固化片与覆金属箔层压板
JP7465894B2 (ja) 2019-12-03 2024-04-11 デンカ株式会社 硬化性組成物及びその硬化体
CN118599040A (zh) * 2020-07-15 2024-09-06 电化株式会社 组合物及固化体
CN115667393A (zh) * 2020-09-11 2023-01-31 电化株式会社 组合物及其固化体
JP7570901B2 (ja) * 2020-11-27 2024-10-22 デンカ株式会社 組成物及びその硬化物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009161743A (ja) 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP2010280771A (ja) 2009-06-03 2010-12-16 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた電気絶縁材料
JP2011074187A (ja) 2009-09-30 2011-04-14 Denki Kagaku Kogyo Kk 易架橋性熱可塑性樹脂
JP2018039995A (ja) 2016-08-31 2018-03-15 新日鉄住金化学株式会社 可溶性多官能ビニル芳香族共重合体、その製造方法、硬化性樹脂組成物及びその硬化物

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JP7638410B2 (ja) 2025-03-03
US20250010581A1 (en) 2025-01-09
CN119239086A (zh) 2025-01-03
CN117858798B (zh) 2024-12-17
EP4417413A4 (en) 2025-10-22
KR20240051988A (ko) 2024-04-22
TW202446598A (zh) 2024-12-01
WO2023063357A1 (ja) 2023-04-20
EP4417413A1 (en) 2024-08-21
TWI864457B (zh) 2024-12-01
JP2024063067A (ja) 2024-05-10
TW202327873A (zh) 2023-07-16
JPWO2023063357A1 (https=) 2023-04-20
CN117858798A (zh) 2024-04-09

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