JPWO2023058598A5 - - Google Patents
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- Publication number
- JPWO2023058598A5 JPWO2023058598A5 JP2023552869A JP2023552869A JPWO2023058598A5 JP WO2023058598 A5 JPWO2023058598 A5 JP WO2023058598A5 JP 2023552869 A JP2023552869 A JP 2023552869A JP 2023552869 A JP2023552869 A JP 2023552869A JP WO2023058598 A5 JPWO2023058598 A5 JP WO2023058598A5
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation member
- less
- member according
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 29
- 238000007747 plating Methods 0.000 claims 5
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025153989A JP2025183379A (ja) | 2021-10-06 | 2025-09-17 | 放熱部材 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021164570 | 2021-10-06 | ||
| PCT/JP2022/036942 WO2023058598A1 (ja) | 2021-10-06 | 2022-10-03 | 放熱部材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025153989A Division JP2025183379A (ja) | 2021-10-06 | 2025-09-17 | 放熱部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023058598A1 JPWO2023058598A1 (https=) | 2023-04-13 |
| JPWO2023058598A5 true JPWO2023058598A5 (https=) | 2024-06-28 |
Family
ID=85804276
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023552869A Pending JPWO2023058598A1 (https=) | 2021-10-06 | 2022-10-03 | |
| JP2025153989A Pending JP2025183379A (ja) | 2021-10-06 | 2025-09-17 | 放熱部材 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025153989A Pending JP2025183379A (ja) | 2021-10-06 | 2025-09-17 | 放熱部材 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240404913A1 (https=) |
| EP (1) | EP4411810A4 (https=) |
| JP (2) | JPWO2023058598A1 (https=) |
| CN (1) | CN118056272A (https=) |
| WO (1) | WO2023058598A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4913605B2 (ja) * | 2005-01-20 | 2012-04-11 | 株式会社アライドマテリアル | 半導体装置用部材の製造方法 |
| JP4864593B2 (ja) * | 2006-08-08 | 2012-02-01 | 電気化学工業株式会社 | アルミニウム−炭化珪素質複合体の製造方法 |
| JP5028147B2 (ja) * | 2007-05-29 | 2012-09-19 | 株式会社アライドマテリアル | 半導体装置用ヒートスプレッダとその製造方法 |
| JP2011139000A (ja) * | 2010-01-04 | 2011-07-14 | Denki Kagaku Kogyo Kk | パワーモジュール構造体及びその製造方法 |
| US10233125B2 (en) * | 2014-03-18 | 2019-03-19 | Denka Company Limited | Aluminium-silicon carbide composite, and power-module base plate |
| EP3605601B1 (en) * | 2017-03-29 | 2023-09-13 | Mitsubishi Materials Corporation | Method for producing insulated circuit board with heat sink |
| JP7116689B2 (ja) * | 2019-01-30 | 2022-08-10 | デンカ株式会社 | 放熱部材およびその製造方法 |
| JP7116690B2 (ja) * | 2019-01-30 | 2022-08-10 | デンカ株式会社 | 放熱部材およびその製造方法 |
| JP2021164570A (ja) | 2020-04-07 | 2021-10-14 | 王子ホールディングス株式会社 | 吸収性物品の製造方法 |
| JP2020171196A (ja) | 2020-07-27 | 2020-10-15 | 株式会社日立製作所 | 鉄道車両の電力変換装置 |
-
2022
- 2022-10-03 WO PCT/JP2022/036942 patent/WO2023058598A1/ja not_active Ceased
- 2022-10-03 EP EP22878467.4A patent/EP4411810A4/en not_active Withdrawn
- 2022-10-03 JP JP2023552869A patent/JPWO2023058598A1/ja active Pending
- 2022-10-03 US US18/698,695 patent/US20240404913A1/en active Pending
- 2022-10-03 CN CN202280066945.6A patent/CN118056272A/zh active Pending
-
2025
- 2025-09-17 JP JP2025153989A patent/JP2025183379A/ja active Pending
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