JPWO2024203737A5 - - Google Patents

Info

Publication number
JPWO2024203737A5
JPWO2024203737A5 JP2025510653A JP2025510653A JPWO2024203737A5 JP WO2024203737 A5 JPWO2024203737 A5 JP WO2024203737A5 JP 2025510653 A JP2025510653 A JP 2025510653A JP 2025510653 A JP2025510653 A JP 2025510653A JP WO2024203737 A5 JPWO2024203737 A5 JP WO2024203737A5
Authority
JP
Japan
Prior art keywords
substrate
mounting semiconductor
following features
semiconductor devices
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510653A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024203737A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/011070 external-priority patent/WO2024203737A1/ja
Publication of JPWO2024203737A1 publication Critical patent/JPWO2024203737A1/ja
Publication of JPWO2024203737A5 publication Critical patent/JPWO2024203737A5/ja
Pending legal-status Critical Current

Links

JP2025510653A 2023-03-30 2024-03-21 Pending JPWO2024203737A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023055862 2023-03-30
PCT/JP2024/011070 WO2024203737A1 (ja) 2023-03-30 2024-03-21 半導体素子搭載用基板

Publications (2)

Publication Number Publication Date
JPWO2024203737A1 JPWO2024203737A1 (https=) 2024-10-03
JPWO2024203737A5 true JPWO2024203737A5 (https=) 2026-04-08

Family

ID=92905022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510653A Pending JPWO2024203737A1 (https=) 2023-03-30 2024-03-21

Country Status (4)

Country Link
EP (1) EP4693392A1 (https=)
JP (1) JPWO2024203737A1 (https=)
CN (1) CN120917568A (https=)
WO (1) WO2024203737A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240570A (ja) 1994-02-28 1995-09-12 Mitsubishi Heavy Ind Ltd 薄膜構造体
JP2002334960A (ja) * 2001-05-07 2002-11-22 Leadmikk Ltd 印字良好な放熱材
JP2004356429A (ja) * 2003-05-29 2004-12-16 Sumitomo Electric Ind Ltd サブマウントおよびそれを用いた半導体装置
JP5857355B2 (ja) * 2010-09-16 2016-02-10 Ｓｈマテリアル株式会社 半導体発光素子搭載用基板、及びそれを用いた半導体発光装置
WO2017110808A1 (ja) * 2015-12-24 2017-06-29 大日本印刷株式会社 配線構造体とその製造方法および電子装置
US12559648B2 (en) * 2019-11-29 2026-02-24 Nichia Corporation Method of manufacturing metal structure for optical semiconductor device, package, and solution containing polyallylamine polymer

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