CN120917568A - 半导体元件搭载用基板 - Google Patents

半导体元件搭载用基板

Info

Publication number
CN120917568A
CN120917568A CN202480021465.7A CN202480021465A CN120917568A CN 120917568 A CN120917568 A CN 120917568A CN 202480021465 A CN202480021465 A CN 202480021465A CN 120917568 A CN120917568 A CN 120917568A
Authority
CN
China
Prior art keywords
substrate
mounting
protective layer
semiconductor element
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480021465.7A
Other languages
English (en)
Chinese (zh)
Inventor
渡边幸裕
村濑达宣
宇佐美宪三
近藤洋右
西村充
佐野五十铃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Publication of CN120917568A publication Critical patent/CN120917568A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/8508—Package substrates, e.g. submounts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN202480021465.7A 2023-03-30 2024-03-21 半导体元件搭载用基板 Pending CN120917568A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-055862 2023-03-30
JP2023055862 2023-03-30
PCT/JP2024/011070 WO2024203737A1 (ja) 2023-03-30 2024-03-21 半導体素子搭載用基板

Publications (1)

Publication Number Publication Date
CN120917568A true CN120917568A (zh) 2025-11-07

Family

ID=92905022

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480021465.7A Pending CN120917568A (zh) 2023-03-30 2024-03-21 半导体元件搭载用基板

Country Status (4)

Country Link
EP (1) EP4693392A1 (https=)
JP (1) JPWO2024203737A1 (https=)
CN (1) CN120917568A (https=)
WO (1) WO2024203737A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240570A (ja) 1994-02-28 1995-09-12 Mitsubishi Heavy Ind Ltd 薄膜構造体
JP2002334960A (ja) * 2001-05-07 2002-11-22 Leadmikk Ltd 印字良好な放熱材
JP2004356429A (ja) * 2003-05-29 2004-12-16 Sumitomo Electric Ind Ltd サブマウントおよびそれを用いた半導体装置
JP5857355B2 (ja) * 2010-09-16 2016-02-10 Ｓｈマテリアル株式会社 半導体発光素子搭載用基板、及びそれを用いた半導体発光装置
WO2017110808A1 (ja) * 2015-12-24 2017-06-29 大日本印刷株式会社 配線構造体とその製造方法および電子装置
US12559648B2 (en) * 2019-11-29 2026-02-24 Nichia Corporation Method of manufacturing metal structure for optical semiconductor device, package, and solution containing polyallylamine polymer

Also Published As

Publication number Publication date
WO2024203737A1 (ja) 2024-10-03
JPWO2024203737A1 (https=) 2024-10-03
EP4693392A1 (en) 2026-02-11

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