JPWO2024203737A1 - - Google Patents
Info
- Publication number
- JPWO2024203737A1 JPWO2024203737A1 JP2025510653A JP2025510653A JPWO2024203737A1 JP WO2024203737 A1 JPWO2024203737 A1 JP WO2024203737A1 JP 2025510653 A JP2025510653 A JP 2025510653A JP 2025510653 A JP2025510653 A JP 2025510653A JP WO2024203737 A1 JPWO2024203737 A1 JP WO2024203737A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8581—Means for heat extraction or cooling characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/85—Packages
- H10H29/8508—Package substrates, e.g. submounts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
- H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023055862 | 2023-03-30 | ||
| PCT/JP2024/011070 WO2024203737A1 (ja) | 2023-03-30 | 2024-03-21 | 半導体素子搭載用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024203737A1 true JPWO2024203737A1 (https=) | 2024-10-03 |
| JPWO2024203737A5 JPWO2024203737A5 (https=) | 2026-04-08 |
Family
ID=92905022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025510653A Pending JPWO2024203737A1 (https=) | 2023-03-30 | 2024-03-21 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4693392A1 (https=) |
| JP (1) | JPWO2024203737A1 (https=) |
| CN (1) | CN120917568A (https=) |
| WO (1) | WO2024203737A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240570A (ja) | 1994-02-28 | 1995-09-12 | Mitsubishi Heavy Ind Ltd | 薄膜構造体 |
| JP2002334960A (ja) * | 2001-05-07 | 2002-11-22 | Leadmikk Ltd | 印字良好な放熱材 |
| JP2004356429A (ja) * | 2003-05-29 | 2004-12-16 | Sumitomo Electric Ind Ltd | サブマウントおよびそれを用いた半導体装置 |
| JP5857355B2 (ja) * | 2010-09-16 | 2016-02-10 | Ｓｈマテリアル株式会社 | 半導体発光素子搭載用基板、及びそれを用いた半導体発光装置 |
| WO2017110808A1 (ja) * | 2015-12-24 | 2017-06-29 | 大日本印刷株式会社 | 配線構造体とその製造方法および電子装置 |
| US12559648B2 (en) * | 2019-11-29 | 2026-02-24 | Nichia Corporation | Method of manufacturing metal structure for optical semiconductor device, package, and solution containing polyallylamine polymer |
-
2024
- 2024-03-21 WO PCT/JP2024/011070 patent/WO2024203737A1/ja not_active Ceased
- 2024-03-21 JP JP2025510653A patent/JPWO2024203737A1/ja active Pending
- 2024-03-21 EP EP24779857.2A patent/EP4693392A1/en active Pending
- 2024-03-21 CN CN202480021465.7A patent/CN120917568A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN120917568A (zh) | 2025-11-07 |
| WO2024203737A1 (ja) | 2024-10-03 |
| EP4693392A1 (en) | 2026-02-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AA64 | Notification of invalidation of claim of internal priority (with term) |
Free format text: JAPANESE INTERMEDIATE CODE: A241764 Effective date: 20251223 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251223 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260331 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260331 |