JPWO2023058597A5 - - Google Patents
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- Publication number
- JPWO2023058597A5 JPWO2023058597A5 JP2023552868A JP2023552868A JPWO2023058597A5 JP WO2023058597 A5 JPWO2023058597 A5 JP WO2023058597A5 JP 2023552868 A JP2023552868 A JP 2023552868A JP 2023552868 A JP2023552868 A JP 2023552868A JP WO2023058597 A5 JPWO2023058597 A5 JP WO2023058597A5
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation member
- member according
- hole
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021164568 | 2021-10-06 | ||
| JP2021164568 | 2021-10-06 | ||
| PCT/JP2022/036939 WO2023058597A1 (ja) | 2021-10-06 | 2022-10-03 | 放熱部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023058597A1 JPWO2023058597A1 (https=) | 2023-04-13 |
| JPWO2023058597A5 true JPWO2023058597A5 (https=) | 2024-06-24 |
| JP7689194B2 JP7689194B2 (ja) | 2025-06-05 |
Family
ID=85804263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023552868A Active JP7689194B2 (ja) | 2021-10-06 | 2022-10-03 | 放熱部材 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240413051A1 (https=) |
| EP (1) | EP4411809A4 (https=) |
| JP (1) | JP7689194B2 (https=) |
| CN (1) | CN118056273A (https=) |
| WO (1) | WO2023058597A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7733530B2 (ja) * | 2021-10-06 | 2025-09-03 | デンカ株式会社 | 放熱部材の製造方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07161925A (ja) * | 1993-12-09 | 1995-06-23 | Mitsubishi Electric Corp | パワーモジュール |
| JP2000082774A (ja) * | 1998-06-30 | 2000-03-21 | Sumitomo Electric Ind Ltd | パワ―モジュ―ル用基板およびその基板を用いたパワ―モジュ―ル |
| US6188579B1 (en) * | 1999-07-12 | 2001-02-13 | Lucent Technologies Inc. | Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage |
| US6222264B1 (en) * | 1999-10-15 | 2001-04-24 | Dell Usa, L.P. | Cooling apparatus for an electronic package |
| US7019975B2 (en) * | 2000-08-09 | 2006-03-28 | Mitsubishi Materials Corporation | Power module and power module with heat sink |
| JP2002299532A (ja) | 2001-04-02 | 2002-10-11 | Hitachi Metals Ltd | Ａｌ−ＳｉＣ系複合体および放熱部品 |
| EP2179976A1 (en) | 2003-05-16 | 2010-04-28 | Hitachi Metals, Ltd. | Composite material having high thermal conductivity and low thermal expansion coefficient |
| WO2005088711A1 (ja) * | 2004-03-16 | 2005-09-22 | Matsushita Electric Industrial Co., Ltd. | ドライバモジュール構造 |
| JP4913605B2 (ja) * | 2005-01-20 | 2012-04-11 | 株式会社アライドマテリアル | 半導体装置用部材の製造方法 |
| JP5144279B2 (ja) * | 2006-01-13 | 2013-02-13 | 電気化学工業株式会社 | アルミニウム−炭化珪素質複合体及びそれを用いた放熱部品 |
| US8525214B2 (en) * | 2008-03-25 | 2013-09-03 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader with thermal via |
| US7837353B2 (en) * | 2008-08-28 | 2010-11-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED assembly preventing electrostatic accumulation thereon |
| US7837354B2 (en) * | 2008-09-01 | 2010-11-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Method for mounting an LED module on a support |
| US8237260B2 (en) * | 2008-11-26 | 2012-08-07 | Infineon Technologies Ag | Power semiconductor module with segmented base plate |
| JP5739873B2 (ja) * | 2010-04-02 | 2015-06-24 | 住友電気工業株式会社 | マグネシウム基複合部材、放熱部材、および半導体装置 |
| US8279608B2 (en) * | 2010-08-31 | 2012-10-02 | Chen chuan-fu | Heatsink device directly contacting a heat source to achieve a quick dissipation effect |
| JP2012254891A (ja) * | 2011-06-08 | 2012-12-27 | Denki Kagaku Kogyo Kk | アルミニウム−炭化珪素質複合体とその製造方法 |
| JP6035015B2 (ja) * | 2011-09-09 | 2016-11-30 | ソニー株式会社 | 回路基板 |
| CN104520977B (zh) * | 2012-10-12 | 2018-05-18 | 新东工业株式会社 | 减压夹具以及使用减压夹具的被加压物的加压方法 |
| WO2016002943A1 (ja) * | 2014-07-04 | 2016-01-07 | 電気化学工業株式会社 | 放熱部品及びその製造方法 |
| DE112014006796B4 (de) * | 2014-07-09 | 2023-12-28 | Mitsubishi Electric Corporation | Halbleiteranordnung |
| WO2017022012A1 (ja) | 2015-07-31 | 2017-02-09 | 電気化学工業株式会社 | アルミニウム‐炭化珪素質複合体及びその製造方法 |
| CN106952875A (zh) * | 2017-02-27 | 2017-07-14 | 扬州国扬电子有限公司 | 一种AlSiC底板及其安装孔防裂的方法 |
| US20210269697A1 (en) | 2018-07-13 | 2021-09-02 | Denka Company Limited | Metal-silicon carbide-based composite material, and method for producing metal-silicon carbide-based composite material |
| WO2020110824A1 (ja) | 2018-11-29 | 2020-06-04 | デンカ株式会社 | 放熱部材 |
| JP6595740B1 (ja) | 2019-06-12 | 2019-10-23 | デンカ株式会社 | 金属−炭化珪素質複合体及びその製造方法 |
| JP7430904B2 (ja) | 2020-04-07 | 2024-02-14 | 国立大学法人 岡山大学 | 塞栓物質の作製方法、塞栓物質および塞栓物質作製用キット |
| CN116711072A (zh) * | 2021-01-22 | 2023-09-05 | 三菱电机株式会社 | 半导体装置及半导体装置的制造方法 |
-
2022
- 2022-10-03 JP JP2023552868A patent/JP7689194B2/ja active Active
- 2022-10-03 CN CN202280066951.1A patent/CN118056273A/zh active Pending
- 2022-10-03 WO PCT/JP2022/036939 patent/WO2023058597A1/ja not_active Ceased
- 2022-10-03 US US18/698,607 patent/US20240413051A1/en active Pending
- 2022-10-03 EP EP22878466.6A patent/EP4411809A4/en not_active Withdrawn
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