JP7689194B2 - 放熱部材 - Google Patents

放熱部材 Download PDF

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Publication number
JP7689194B2
JP7689194B2 JP2023552868A JP2023552868A JP7689194B2 JP 7689194 B2 JP7689194 B2 JP 7689194B2 JP 2023552868 A JP2023552868 A JP 2023552868A JP 2023552868 A JP2023552868 A JP 2023552868A JP 7689194 B2 JP7689194 B2 JP 7689194B2
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JP
Japan
Prior art keywords
heat dissipation
dissipation member
metal
hole
silicon carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2023552868A
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English (en)
Japanese (ja)
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JPWO2023058597A5 (https=
JPWO2023058597A1 (https=
Inventor
大助 後藤
寛朗 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2023058597A1 publication Critical patent/JPWO2023058597A1/ja
Publication of JPWO2023058597A5 publication Critical patent/JPWO2023058597A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/253—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
JP2023552868A 2021-10-06 2022-10-03 放熱部材 Active JP7689194B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021164568 2021-10-06
JP2021164568 2021-10-06
PCT/JP2022/036939 WO2023058597A1 (ja) 2021-10-06 2022-10-03 放熱部材

Publications (3)

Publication Number Publication Date
JPWO2023058597A1 JPWO2023058597A1 (https=) 2023-04-13
JPWO2023058597A5 JPWO2023058597A5 (https=) 2024-06-24
JP7689194B2 true JP7689194B2 (ja) 2025-06-05

Family

ID=85804263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023552868A Active JP7689194B2 (ja) 2021-10-06 2022-10-03 放熱部材

Country Status (5)

Country Link
US (1) US20240413051A1 (https=)
EP (1) EP4411809A4 (https=)
JP (1) JP7689194B2 (https=)
CN (1) CN118056273A (https=)
WO (1) WO2023058597A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7733530B2 (ja) * 2021-10-06 2025-09-03 デンカ株式会社 放熱部材の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008240155A (ja) 2003-05-16 2008-10-09 Hitachi Metals Ltd 高熱伝導・低熱膨張複合材及び放熱基板
WO2017022012A1 (ja) 2015-07-31 2017-02-09 電気化学工業株式会社 アルミニウム‐炭化珪素質複合体及びその製造方法
WO2020013300A1 (ja) 2018-07-13 2020-01-16 デンカ株式会社 金属－炭化珪素質複合体、及び金属－炭化珪素質複合体の製造方法
JP2020012194A (ja) 2019-06-12 2020-01-23 デンカ株式会社 金属−炭化珪素質複合体及びその製造方法
WO2020110824A1 (ja) 2018-11-29 2020-06-04 デンカ株式会社 放熱部材

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161925A (ja) * 1993-12-09 1995-06-23 Mitsubishi Electric Corp パワーモジュール
JP2000082774A (ja) * 1998-06-30 2000-03-21 Sumitomo Electric Ind Ltd パワ―モジュ―ル用基板およびその基板を用いたパワ―モジュ―ル
US6188579B1 (en) * 1999-07-12 2001-02-13 Lucent Technologies Inc. Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage
US6222264B1 (en) * 1999-10-15 2001-04-24 Dell Usa, L.P. Cooling apparatus for an electronic package
US7019975B2 (en) * 2000-08-09 2006-03-28 Mitsubishi Materials Corporation Power module and power module with heat sink
JP2002299532A (ja) 2001-04-02 2002-10-11 Hitachi Metals Ltd Ａｌ−ＳｉＣ系複合体および放熱部品
WO2005088711A1 (ja) * 2004-03-16 2005-09-22 Matsushita Electric Industrial Co., Ltd. ドライバモジュール構造
JP4913605B2 (ja) * 2005-01-20 2012-04-11 株式会社アライドマテリアル 半導体装置用部材の製造方法
JP5144279B2 (ja) * 2006-01-13 2013-02-13 電気化学工業株式会社 アルミニウム−炭化珪素質複合体及びそれを用いた放熱部品
US8525214B2 (en) * 2008-03-25 2013-09-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with thermal via
US7837353B2 (en) * 2008-08-28 2010-11-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED assembly preventing electrostatic accumulation thereon
US7837354B2 (en) * 2008-09-01 2010-11-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Method for mounting an LED module on a support
US8237260B2 (en) * 2008-11-26 2012-08-07 Infineon Technologies Ag Power semiconductor module with segmented base plate
JP5739873B2 (ja) * 2010-04-02 2015-06-24 住友電気工業株式会社 マグネシウム基複合部材、放熱部材、および半導体装置
US8279608B2 (en) * 2010-08-31 2012-10-02 Chen chuan-fu Heatsink device directly contacting a heat source to achieve a quick dissipation effect
JP2012254891A (ja) * 2011-06-08 2012-12-27 Denki Kagaku Kogyo Kk アルミニウム−炭化珪素質複合体とその製造方法
JP6035015B2 (ja) * 2011-09-09 2016-11-30 ソニー株式会社 回路基板
CN104520977B (zh) * 2012-10-12 2018-05-18 新东工业株式会社 减压夹具以及使用减压夹具的被加压物的加压方法
WO2016002943A1 (ja) * 2014-07-04 2016-01-07 電気化学工業株式会社 放熱部品及びその製造方法
DE112014006796B4 (de) * 2014-07-09 2023-12-28 Mitsubishi Electric Corporation Halbleiteranordnung
CN106952875A (zh) * 2017-02-27 2017-07-14 扬州国扬电子有限公司 一种AlSiC底板及其安装孔防裂的方法
JP7430904B2 (ja) 2020-04-07 2024-02-14 国立大学法人 岡山大学 塞栓物質の作製方法、塞栓物質および塞栓物質作製用キット
CN116711072A (zh) * 2021-01-22 2023-09-05 三菱电机株式会社 半导体装置及半导体装置的制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008240155A (ja) 2003-05-16 2008-10-09 Hitachi Metals Ltd 高熱伝導・低熱膨張複合材及び放熱基板
WO2017022012A1 (ja) 2015-07-31 2017-02-09 電気化学工業株式会社 アルミニウム‐炭化珪素質複合体及びその製造方法
WO2020013300A1 (ja) 2018-07-13 2020-01-16 デンカ株式会社 金属－炭化珪素質複合体、及び金属－炭化珪素質複合体の製造方法
WO2020110824A1 (ja) 2018-11-29 2020-06-04 デンカ株式会社 放熱部材
JP2020012194A (ja) 2019-06-12 2020-01-23 デンカ株式会社 金属−炭化珪素質複合体及びその製造方法

Also Published As

Publication number Publication date
WO2023058597A1 (ja) 2023-04-13
EP4411809A1 (en) 2024-08-07
US20240413051A1 (en) 2024-12-12
EP4411809A4 (en) 2025-02-19
CN118056273A (zh) 2024-05-17
JPWO2023058597A1 (https=) 2023-04-13

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