JPWO2023058597A1 - - Google Patents

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Publication number
JPWO2023058597A1
JPWO2023058597A1 JP2023552868A JP2023552868A JPWO2023058597A1 JP WO2023058597 A1 JPWO2023058597 A1 JP WO2023058597A1 JP 2023552868 A JP2023552868 A JP 2023552868A JP 2023552868 A JP2023552868 A JP 2023552868A JP WO2023058597 A1 JPWO2023058597 A1 JP WO2023058597A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023552868A
Other languages
Japanese (ja)
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JPWO2023058597A5 (https=
JP7689194B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2023058597A1 publication Critical patent/JPWO2023058597A1/ja
Publication of JPWO2023058597A5 publication Critical patent/JPWO2023058597A5/ja
Application granted granted Critical
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Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/253—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
JP2023552868A 2021-10-06 2022-10-03 放熱部材 Active JP7689194B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021164568 2021-10-06
JP2021164568 2021-10-06
PCT/JP2022/036939 WO2023058597A1 (ja) 2021-10-06 2022-10-03 放熱部材

Publications (3)

Publication Number Publication Date
JPWO2023058597A1 true JPWO2023058597A1 (https=) 2023-04-13
JPWO2023058597A5 JPWO2023058597A5 (https=) 2024-06-24
JP7689194B2 JP7689194B2 (ja) 2025-06-05

Family

ID=85804263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023552868A Active JP7689194B2 (ja) 2021-10-06 2022-10-03 放熱部材

Country Status (5)

Country Link
US (1) US20240413051A1 (https=)
EP (1) EP4411809A4 (https=)
JP (1) JP7689194B2 (https=)
CN (1) CN118056273A (https=)
WO (1) WO2023058597A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7733530B2 (ja) * 2021-10-06 2025-09-03 デンカ株式会社 放熱部材の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008240155A (ja) * 2003-05-16 2008-10-09 Hitachi Metals Ltd 高熱伝導・低熱膨張複合材及び放熱基板
WO2017022012A1 (ja) * 2015-07-31 2017-02-09 電気化学工業株式会社 アルミニウム‐炭化珪素質複合体及びその製造方法
WO2020013300A1 (ja) * 2018-07-13 2020-01-16 デンカ株式会社 金属－炭化珪素質複合体、及び金属－炭化珪素質複合体の製造方法
JP2020012194A (ja) * 2019-06-12 2020-01-23 デンカ株式会社 金属−炭化珪素質複合体及びその製造方法
WO2020110824A1 (ja) * 2018-11-29 2020-06-04 デンカ株式会社 放熱部材

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JPH07161925A (ja) * 1993-12-09 1995-06-23 Mitsubishi Electric Corp パワーモジュール
JP2000082774A (ja) * 1998-06-30 2000-03-21 Sumitomo Electric Ind Ltd パワ―モジュ―ル用基板およびその基板を用いたパワ―モジュ―ル
US6188579B1 (en) * 1999-07-12 2001-02-13 Lucent Technologies Inc. Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage
US6222264B1 (en) * 1999-10-15 2001-04-24 Dell Usa, L.P. Cooling apparatus for an electronic package
US7019975B2 (en) * 2000-08-09 2006-03-28 Mitsubishi Materials Corporation Power module and power module with heat sink
JP2002299532A (ja) 2001-04-02 2002-10-11 Hitachi Metals Ltd Ａｌ−ＳｉＣ系複合体および放熱部品
WO2005088711A1 (ja) * 2004-03-16 2005-09-22 Matsushita Electric Industrial Co., Ltd. ドライバモジュール構造
JP4913605B2 (ja) * 2005-01-20 2012-04-11 株式会社アライドマテリアル 半導体装置用部材の製造方法
JP5144279B2 (ja) * 2006-01-13 2013-02-13 電気化学工業株式会社 アルミニウム−炭化珪素質複合体及びそれを用いた放熱部品
US8525214B2 (en) * 2008-03-25 2013-09-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with thermal via
US7837353B2 (en) * 2008-08-28 2010-11-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED assembly preventing electrostatic accumulation thereon
US7837354B2 (en) * 2008-09-01 2010-11-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Method for mounting an LED module on a support
US8237260B2 (en) * 2008-11-26 2012-08-07 Infineon Technologies Ag Power semiconductor module with segmented base plate
JP5739873B2 (ja) * 2010-04-02 2015-06-24 住友電気工業株式会社 マグネシウム基複合部材、放熱部材、および半導体装置
US8279608B2 (en) * 2010-08-31 2012-10-02 Chen chuan-fu Heatsink device directly contacting a heat source to achieve a quick dissipation effect
JP2012254891A (ja) * 2011-06-08 2012-12-27 Denki Kagaku Kogyo Kk アルミニウム−炭化珪素質複合体とその製造方法
JP6035015B2 (ja) * 2011-09-09 2016-11-30 ソニー株式会社 回路基板
CN104520977B (zh) * 2012-10-12 2018-05-18 新东工业株式会社 减压夹具以及使用减压夹具的被加压物的加压方法
WO2016002943A1 (ja) * 2014-07-04 2016-01-07 電気化学工業株式会社 放熱部品及びその製造方法
DE112014006796B4 (de) * 2014-07-09 2023-12-28 Mitsubishi Electric Corporation Halbleiteranordnung
CN106952875A (zh) * 2017-02-27 2017-07-14 扬州国扬电子有限公司 一种AlSiC底板及其安装孔防裂的方法
JP7430904B2 (ja) 2020-04-07 2024-02-14 国立大学法人 岡山大学 塞栓物質の作製方法、塞栓物質および塞栓物質作製用キット
CN116711072A (zh) * 2021-01-22 2023-09-05 三菱电机株式会社 半导体装置及半导体装置的制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008240155A (ja) * 2003-05-16 2008-10-09 Hitachi Metals Ltd 高熱伝導・低熱膨張複合材及び放熱基板
WO2017022012A1 (ja) * 2015-07-31 2017-02-09 電気化学工業株式会社 アルミニウム‐炭化珪素質複合体及びその製造方法
WO2020013300A1 (ja) * 2018-07-13 2020-01-16 デンカ株式会社 金属－炭化珪素質複合体、及び金属－炭化珪素質複合体の製造方法
WO2020110824A1 (ja) * 2018-11-29 2020-06-04 デンカ株式会社 放熱部材
JP2020012194A (ja) * 2019-06-12 2020-01-23 デンカ株式会社 金属−炭化珪素質複合体及びその製造方法

Also Published As

Publication number Publication date
WO2023058597A1 (ja) 2023-04-13
JP7689194B2 (ja) 2025-06-05
EP4411809A1 (en) 2024-08-07
US20240413051A1 (en) 2024-12-12
EP4411809A4 (en) 2025-02-19
CN118056273A (zh) 2024-05-17

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