JP2018111883A5 - - Google Patents
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- Publication number
- JP2018111883A5 JP2018111883A5 JP2018020004A JP2018020004A JP2018111883A5 JP 2018111883 A5 JP2018111883 A5 JP 2018111883A5 JP 2018020004 A JP2018020004 A JP 2018020004A JP 2018020004 A JP2018020004 A JP 2018020004A JP 2018111883 A5 JP2018111883 A5 JP 2018111883A5
- Authority
- JP
- Japan
- Prior art keywords
- composite material
- diamond
- material according
- diamond composite
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014178434 | 2014-09-02 | ||
| JP2014178434 | 2014-09-02 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016546659A Division JP6292688B2 (ja) | 2014-09-02 | 2015-09-01 | ダイヤモンド複合材料、及び放熱部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018111883A JP2018111883A (ja) | 2018-07-19 |
| JP2018111883A5 true JP2018111883A5 (https=) | 2018-10-04 |
Family
ID=55439855
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016546659A Active JP6292688B2 (ja) | 2014-09-02 | 2015-09-01 | ダイヤモンド複合材料、及び放熱部材 |
| JP2018020004A Pending JP2018111883A (ja) | 2014-09-02 | 2018-02-07 | ダイヤモンド複合材料、及び放熱部材 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016546659A Active JP6292688B2 (ja) | 2014-09-02 | 2015-09-01 | ダイヤモンド複合材料、及び放熱部材 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12503633B2 (https=) |
| EP (1) | EP3190198B1 (https=) |
| JP (2) | JP6292688B2 (https=) |
| CN (3) | CN110656259A (https=) |
| WO (1) | WO2016035795A1 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5807935B1 (ja) | 2014-10-09 | 2015-11-10 | 株式会社半導体熱研究所 | 放熱基板と、それを使用した半導体用モジュール |
| JP2019071328A (ja) * | 2017-10-06 | 2019-05-09 | 株式会社豊田中央研究所 | 半導体実装基板、半導体モジュールおよび半導体実装基板の製造方法 |
| CN111727266B (zh) | 2018-02-14 | 2021-11-02 | 住友电气工业株式会社 | 复合部件以及复合部件的制造方法 |
| US12351753B2 (en) * | 2018-02-21 | 2025-07-08 | Sumitomo Electric Industries, Ltd. | Composite material and composite material manufacturing method |
| JP7189214B2 (ja) * | 2018-07-12 | 2022-12-13 | 住友電気工業株式会社 | 複合部材 |
| WO2020084903A1 (ja) | 2018-10-25 | 2020-04-30 | 住友電気工業株式会社 | 複合部材 |
| US12112993B2 (en) * | 2018-10-31 | 2024-10-08 | A.L.M.T. Corp. | Heat radiation member |
| WO2020203185A1 (ja) * | 2019-03-29 | 2020-10-08 | 住友電気工業株式会社 | 複合材料 |
| CN112625657B (zh) * | 2019-09-24 | 2022-01-14 | 华为技术有限公司 | 导热体、导热材料和半导体器件的封装结构 |
| EP4130309A1 (en) * | 2020-03-24 | 2023-02-08 | Sumitomo Electric Industries, Ltd. | Composite material and heat dissipation member |
| US12252766B2 (en) * | 2020-04-09 | 2025-03-18 | Sumitomo Electric Industries, Ltd. | Composite material, heat sink and semiconductor device |
| CN111421141B (zh) * | 2020-04-20 | 2022-05-24 | 浙江工业大学 | 一种定向高导热金刚石/金属基复合材料的制备方法 |
| US12187951B2 (en) | 2020-07-27 | 2025-01-07 | Google Llc | Thermal interface material and method for making the same |
| US12195666B2 (en) | 2020-07-27 | 2025-01-14 | Google Llc | Thermal interface material and method for making the same |
| WO2022109552A1 (en) * | 2020-11-18 | 2022-05-27 | Sharfi Benjamin K | Diamond-based thermal cooling devices methods and materials |
| KR102576792B1 (ko) | 2021-06-08 | 2023-09-11 | 주식회사 더굿시스템 | 복합재료 및 방열부품 |
| CN114086047B (zh) * | 2021-11-22 | 2022-05-31 | 合肥哈瑞克机电科技有限公司 | 一种高导热复合材料及其制备方法 |
| KR102685109B1 (ko) | 2021-12-13 | 2024-07-15 | 주식회사 더굿시스템 | 복합재료 및 이 복합재료를 포함하는 방열부품 |
| KR102884605B1 (ko) | 2022-05-25 | 2025-11-13 | 주식회사 더굿시스템 | 복합재료 및 이 복합재료를 포함하는 방열부품 |
| JPWO2024157803A1 (https=) | 2023-01-23 | 2024-08-02 | ||
| EP4692414A1 (en) * | 2023-04-05 | 2026-02-11 | Sekisui Chemical Co., Ltd. | Diamond composite particle and resin composition |
| CN120843875B (zh) * | 2025-08-05 | 2026-03-13 | 宁波赛墨科技有限公司 | 一种金刚石金属复合材料及其制备方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3650714A (en) * | 1969-03-04 | 1972-03-21 | Permattach Diamond Tool Corp | A method of coating diamond particles with metal |
| US5834115A (en) * | 1995-05-02 | 1998-11-10 | Technical Research Associates, Inc. | Metal and carbonaceous materials composites |
| US5976205A (en) * | 1996-12-02 | 1999-11-02 | Norton Company | Abrasive tool |
| US6096414A (en) * | 1997-11-25 | 2000-08-01 | Parker-Hannifin Corporation | High dielectric strength thermal interface material |
| US6485831B1 (en) * | 1999-05-13 | 2002-11-26 | Shin-Etsu Chemical Co., Ltd. | Conductive powder and making process |
| KR100777148B1 (ko) * | 2000-06-30 | 2007-11-19 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 초연삭제에 금속으로 코팅하는 방법 |
| EP1452614B1 (en) | 2001-11-09 | 2017-12-27 | Sumitomo Electric Industries, Ltd. | Sintered diamond having high thermal conductivity |
| JP2004197153A (ja) * | 2002-12-18 | 2004-07-15 | Allied Material Corp | ダイヤモンド−金属複合材料およびその製造方法 |
| JP2004200346A (ja) * | 2002-12-18 | 2004-07-15 | Sumitomo Electric Ind Ltd | 半導体素子収納用パッケージ、その製造方法及び半導体装置 |
| US6968990B2 (en) * | 2003-01-23 | 2005-11-29 | General Electric Company | Fabrication and utilization of metallic powder prepared without melting |
| JP3899068B2 (ja) | 2003-12-19 | 2007-03-28 | 株式会社アライドマテリアル | タングステン合金線ならびにフィラメントおよびハロゲンランプ |
| CN101035876A (zh) | 2004-08-23 | 2007-09-12 | 莫门蒂夫性能材料股份有限公司 | 导热性组合物及其制备方法 |
| US20080187769A1 (en) * | 2006-04-13 | 2008-08-07 | 3M Innovative Properties | Metal-coated superabrasive material and methods of making the same |
| CN1944698A (zh) * | 2006-10-24 | 2007-04-11 | 北京科技大学 | 一种超高导热、低热膨胀系数的复合材料及其制备方法 |
| KR20100027146A (ko) * | 2007-05-22 | 2010-03-10 | 엘리먼트 씩스 리미티드 | 코팅된 다이아몬드 |
| WO2011049479A1 (en) * | 2009-10-21 | 2011-04-28 | Andrey Mikhailovich Abyzov | Composite material having high thermal conductivity and process of fabricating same |
| CN101985702B (zh) * | 2010-06-29 | 2013-02-06 | 北京科技大学 | 一种超高导热、低热膨胀系数金刚石复合材料及制备方法 |
| JP5896400B2 (ja) * | 2011-11-25 | 2016-03-30 | トーメイダイヤ株式会社 | ダイヤモンド含有ヒートシンク材及びその製法 |
| US9117793B2 (en) * | 2012-06-29 | 2015-08-25 | Materion Corporation | Air cavity packages having high thermal conductivity base plates and methods of making |
-
2015
- 2015-09-01 CN CN201910978537.8A patent/CN110656259A/zh active Pending
- 2015-09-01 WO PCT/JP2015/074880 patent/WO2016035795A1/ja not_active Ceased
- 2015-09-01 CN CN202111355188.8A patent/CN114032413A/zh active Pending
- 2015-09-01 US US15/327,269 patent/US12503633B2/en active Active
- 2015-09-01 CN CN201580047186.9A patent/CN106795596A/zh active Pending
- 2015-09-01 EP EP15838762.1A patent/EP3190198B1/en active Active
- 2015-09-01 JP JP2016546659A patent/JP6292688B2/ja active Active
-
2018
- 2018-02-07 JP JP2018020004A patent/JP2018111883A/ja active Pending
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