CN110656259A - 金刚石复合材料和散热部件 - Google Patents
金刚石复合材料和散热部件 Download PDFInfo
- Publication number
- CN110656259A CN110656259A CN201910978537.8A CN201910978537A CN110656259A CN 110656259 A CN110656259 A CN 110656259A CN 201910978537 A CN201910978537 A CN 201910978537A CN 110656259 A CN110656259 A CN 110656259A
- Authority
- CN
- China
- Prior art keywords
- diamond
- composite material
- powder
- group
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0466—Alloys based on noble metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/254—Diamond
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F2007/066—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using impregnation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
- B22F2301/255—Silver or gold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
- B22F2302/05—Boride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
- B22F2302/20—Nitride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
- B22F2302/40—Carbon, graphite
- B22F2302/406—Diamond
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
- B22F2302/45—Others, including non-metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2304/00—Physical aspects of the powder
- B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
- C22C1/1073—Infiltration or casting under mechanical pressure, e.g. squeeze casting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C22C2026/005—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds being borides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C22C2026/006—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds being carbides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C22C2026/007—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds being nitrides
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C22C2026/008—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds other than carbides, borides or nitrides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Powder Metallurgy (AREA)
- Carbon And Carbon Compounds (AREA)
- Ceramic Engineering (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014178434 | 2014-09-02 | ||
| JP2014-178434 | 2014-09-02 | ||
| CN201580047186.9A CN106795596A (zh) | 2014-09-02 | 2015-09-01 | 金刚石复合材料和散热部件 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580047186.9A Division CN106795596A (zh) | 2014-09-02 | 2015-09-01 | 金刚石复合材料和散热部件 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110656259A true CN110656259A (zh) | 2020-01-07 |
Family
ID=55439855
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910978537.8A Pending CN110656259A (zh) | 2014-09-02 | 2015-09-01 | 金刚石复合材料和散热部件 |
| CN202111355188.8A Pending CN114032413A (zh) | 2014-09-02 | 2015-09-01 | 金刚石复合材料和散热部件 |
| CN201580047186.9A Pending CN106795596A (zh) | 2014-09-02 | 2015-09-01 | 金刚石复合材料和散热部件 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111355188.8A Pending CN114032413A (zh) | 2014-09-02 | 2015-09-01 | 金刚石复合材料和散热部件 |
| CN201580047186.9A Pending CN106795596A (zh) | 2014-09-02 | 2015-09-01 | 金刚石复合材料和散热部件 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12503633B2 (https=) |
| EP (1) | EP3190198B1 (https=) |
| JP (2) | JP6292688B2 (https=) |
| CN (3) | CN110656259A (https=) |
| WO (1) | WO2016035795A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111421141A (zh) * | 2020-04-20 | 2020-07-17 | 浙江工业大学 | 一种定向高导热金刚石/金属基复合材料的制备方法 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5807935B1 (ja) | 2014-10-09 | 2015-11-10 | 株式会社半導体熱研究所 | 放熱基板と、それを使用した半導体用モジュール |
| JP2019071328A (ja) * | 2017-10-06 | 2019-05-09 | 株式会社豊田中央研究所 | 半導体実装基板、半導体モジュールおよび半導体実装基板の製造方法 |
| CN111727266B (zh) | 2018-02-14 | 2021-11-02 | 住友电气工业株式会社 | 复合部件以及复合部件的制造方法 |
| US12351753B2 (en) * | 2018-02-21 | 2025-07-08 | Sumitomo Electric Industries, Ltd. | Composite material and composite material manufacturing method |
| JP7189214B2 (ja) * | 2018-07-12 | 2022-12-13 | 住友電気工業株式会社 | 複合部材 |
| WO2020084903A1 (ja) | 2018-10-25 | 2020-04-30 | 住友電気工業株式会社 | 複合部材 |
| US12112993B2 (en) * | 2018-10-31 | 2024-10-08 | A.L.M.T. Corp. | Heat radiation member |
| WO2020203185A1 (ja) * | 2019-03-29 | 2020-10-08 | 住友電気工業株式会社 | 複合材料 |
| CN112625657B (zh) * | 2019-09-24 | 2022-01-14 | 华为技术有限公司 | 导热体、导热材料和半导体器件的封装结构 |
| EP4130309A1 (en) * | 2020-03-24 | 2023-02-08 | Sumitomo Electric Industries, Ltd. | Composite material and heat dissipation member |
| US12252766B2 (en) * | 2020-04-09 | 2025-03-18 | Sumitomo Electric Industries, Ltd. | Composite material, heat sink and semiconductor device |
| US12187951B2 (en) | 2020-07-27 | 2025-01-07 | Google Llc | Thermal interface material and method for making the same |
| US12195666B2 (en) | 2020-07-27 | 2025-01-14 | Google Llc | Thermal interface material and method for making the same |
| WO2022109552A1 (en) * | 2020-11-18 | 2022-05-27 | Sharfi Benjamin K | Diamond-based thermal cooling devices methods and materials |
| KR102576792B1 (ko) | 2021-06-08 | 2023-09-11 | 주식회사 더굿시스템 | 복합재료 및 방열부품 |
| CN114086047B (zh) * | 2021-11-22 | 2022-05-31 | 合肥哈瑞克机电科技有限公司 | 一种高导热复合材料及其制备方法 |
| KR102685109B1 (ko) | 2021-12-13 | 2024-07-15 | 주식회사 더굿시스템 | 복합재료 및 이 복합재료를 포함하는 방열부품 |
| KR102884605B1 (ko) | 2022-05-25 | 2025-11-13 | 주식회사 더굿시스템 | 복합재료 및 이 복합재료를 포함하는 방열부품 |
| JPWO2024157803A1 (https=) | 2023-01-23 | 2024-08-02 | ||
| EP4692414A1 (en) * | 2023-04-05 | 2026-02-11 | Sekisui Chemical Co., Ltd. | Diamond composite particle and resin composition |
| CN120843875B (zh) * | 2025-08-05 | 2026-03-13 | 宁波赛墨科技有限公司 | 一种金刚石金属复合材料及其制备方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004197153A (ja) * | 2002-12-18 | 2004-07-15 | Allied Material Corp | ダイヤモンド−金属複合材料およびその製造方法 |
| CN1529357A (zh) * | 2002-12-18 | 2004-09-15 | ס�ѵ�����ҵ��ʽ���� | 用于放置半导体芯片的封装件及其制造方法和半导体器件 |
| CN1944698A (zh) * | 2006-10-24 | 2007-04-11 | 北京科技大学 | 一种超高导热、低热膨胀系数的复合材料及其制备方法 |
| CN101035876A (zh) * | 2004-08-23 | 2007-09-12 | 莫门蒂夫性能材料股份有限公司 | 导热性组合物及其制备方法 |
| US20100319900A1 (en) * | 2009-10-21 | 2010-12-23 | Andrey Mikhailovich Abyzov | Composite material having high thermal conductivity nd process of fabricating same |
| CN101985702A (zh) * | 2010-06-29 | 2011-03-16 | 北京科技大学 | 一种超高导热、低热膨胀系数金刚石复合材料及制备方法 |
| JP2013115096A (ja) * | 2011-11-25 | 2013-06-10 | Tomei Diamond Co Ltd | ダイヤモンド含有ヒートシンク材及びその製法 |
| US20140001624A1 (en) * | 2012-06-29 | 2014-01-02 | Materion Corporation | Air cavity packages having high thermal conductivity base plates and methods of making |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3650714A (en) * | 1969-03-04 | 1972-03-21 | Permattach Diamond Tool Corp | A method of coating diamond particles with metal |
| US5834115A (en) * | 1995-05-02 | 1998-11-10 | Technical Research Associates, Inc. | Metal and carbonaceous materials composites |
| US5976205A (en) * | 1996-12-02 | 1999-11-02 | Norton Company | Abrasive tool |
| US6096414A (en) * | 1997-11-25 | 2000-08-01 | Parker-Hannifin Corporation | High dielectric strength thermal interface material |
| US6485831B1 (en) * | 1999-05-13 | 2002-11-26 | Shin-Etsu Chemical Co., Ltd. | Conductive powder and making process |
| KR100777148B1 (ko) * | 2000-06-30 | 2007-11-19 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 초연삭제에 금속으로 코팅하는 방법 |
| EP1452614B1 (en) | 2001-11-09 | 2017-12-27 | Sumitomo Electric Industries, Ltd. | Sintered diamond having high thermal conductivity |
| US6968990B2 (en) * | 2003-01-23 | 2005-11-29 | General Electric Company | Fabrication and utilization of metallic powder prepared without melting |
| JP3899068B2 (ja) | 2003-12-19 | 2007-03-28 | 株式会社アライドマテリアル | タングステン合金線ならびにフィラメントおよびハロゲンランプ |
| US20080187769A1 (en) * | 2006-04-13 | 2008-08-07 | 3M Innovative Properties | Metal-coated superabrasive material and methods of making the same |
| KR20100027146A (ko) * | 2007-05-22 | 2010-03-10 | 엘리먼트 씩스 리미티드 | 코팅된 다이아몬드 |
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2015
- 2015-09-01 CN CN201910978537.8A patent/CN110656259A/zh active Pending
- 2015-09-01 WO PCT/JP2015/074880 patent/WO2016035795A1/ja not_active Ceased
- 2015-09-01 CN CN202111355188.8A patent/CN114032413A/zh active Pending
- 2015-09-01 US US15/327,269 patent/US12503633B2/en active Active
- 2015-09-01 CN CN201580047186.9A patent/CN106795596A/zh active Pending
- 2015-09-01 EP EP15838762.1A patent/EP3190198B1/en active Active
- 2015-09-01 JP JP2016546659A patent/JP6292688B2/ja active Active
-
2018
- 2018-02-07 JP JP2018020004A patent/JP2018111883A/ja active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004197153A (ja) * | 2002-12-18 | 2004-07-15 | Allied Material Corp | ダイヤモンド−金属複合材料およびその製造方法 |
| CN1529357A (zh) * | 2002-12-18 | 2004-09-15 | ס�ѵ�����ҵ��ʽ���� | 用于放置半导体芯片的封装件及其制造方法和半导体器件 |
| CN101035876A (zh) * | 2004-08-23 | 2007-09-12 | 莫门蒂夫性能材料股份有限公司 | 导热性组合物及其制备方法 |
| CN1944698A (zh) * | 2006-10-24 | 2007-04-11 | 北京科技大学 | 一种超高导热、低热膨胀系数的复合材料及其制备方法 |
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| CN111421141B (zh) * | 2020-04-20 | 2022-05-24 | 浙江工业大学 | 一种定向高导热金刚石/金属基复合材料的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018111883A (ja) | 2018-07-19 |
| CN106795596A (zh) | 2017-05-31 |
| CN114032413A (zh) | 2022-02-11 |
| US20170145280A1 (en) | 2017-05-25 |
| WO2016035795A1 (ja) | 2016-03-10 |
| EP3190198B1 (en) | 2019-11-06 |
| EP3190198A1 (en) | 2017-07-12 |
| JPWO2016035795A1 (ja) | 2017-06-15 |
| EP3190198A4 (en) | 2017-10-25 |
| JP6292688B2 (ja) | 2018-03-14 |
| US12503633B2 (en) | 2025-12-23 |
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