US20060169439A1 - Heat pipe with wick structure of screen mesh - Google Patents
Heat pipe with wick structure of screen mesh Download PDFInfo
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- US20060169439A1 US20060169439A1 US11/164,094 US16409405A US2006169439A1 US 20060169439 A1 US20060169439 A1 US 20060169439A1 US 16409405 A US16409405 A US 16409405A US 2006169439 A1 US2006169439 A1 US 2006169439A1
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- layers
- heat pipe
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- pipe body
- screen mesh
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Definitions
- the present invention relates generally to heat pipes, and more particularly to a heat pipe with a wick structure of screen mesh.
- CPUs central processing units
- a cooling device is often used to be mounted on top of the CPU to dissipate heat generated thereby. It is well known that heat absorbed by fluid having a phase change is ten times more than that the fluid does not have a phase change; thus, the heat transfer efficiency by phase change of fluid is better than other mechanisms, such as heat conduction or heat convection. Accordingly, a heat pipe has been developed.
- the heat pipe has a hollow pipe body receiving a working fluid therein and a wick structure disposed on an inner wall of the pipe body.
- the heat pipe is divided into an evaporating section, an adiabatic section and a condensing section along a longitudinal direction thereof.
- the working fluid absorbs the heat generated by the CPU or other electronic device and evaporates into vapor.
- the vapor moves from the evaporating section to the condensing section to dissipate the heat, whereby the vapor cools and condenses at the condensing section.
- the condensed working fluid returns to the evaporating section via a capillary force generated by the wick structure. From the evaporating section, the fluid is evaporated again to thereby repeat the heat transfer from the evaporating section to the condensing section.
- the wick structure In general, movement of the working fluid depends on the capillary pressure (force) of the wick structure.
- the wick structure has following four configurations: sintered powders, grooves, fiber and screen mesh. Since the thickness and pore size of the screen mesh can be easily changed, the screen mesh is widely used in the heat pipe.
- a heat pipe comprises a hollow pipe body for receiving a working fluid therein and a screen mesh disposed in the pipe body.
- the screen mesh comprises at least two layers. One of the two layers is in the form of a planar layer and the other of the two layers is in the form of a wave layer.
- the wave layer forms a plurality of flowing channels for the working fluid to flow from a condensing section to an evaporating section of the heat pipe.
- the channels formed by the wave layer of the screen mesh is capable of reducing the flow resistance to the condensed fluid to flow back while pores in the screen mesh are capable of providing a relatively large capillary pressure for drawing the condensed fluid to flow back.
- FIG. 1 is a transverse cross-section view of a heat pipe in accordance with a preferred embodiment of the present invention
- FIG. 2 is an isometric, unfurled view of a planar layer of a mesh screen of the heat pipe of FIG. 1 ;
- FIG. 3 is an isometric, unfurled view of a wave layer of the mesh screen of the heat pipe of FIG. 1 ;
- FIG. 4 is a transverse cross-section view of the heat pipe in accordance with a second embodiment of the present invention.
- FIG. 5 is an isometric, unfurled view of the wave layer of the mesh screen of the heat pipe of FIG. 4 ;
- FIG. 6 is a transverse cross-section view of the heat pipe in accordance with a third embodiment of the present invention.
- FIG. 7 is an isometric, unfurled view of the wave layer of the mesh screen of the heat pipe of FIG. 6 ;
- FIG. 8 is a transverse cross-section view of the heat pipe in accordance with a fourth embodiment of the present invention.
- FIG. 9 is a transverse cross-section view of the heat pipe in accordance with a fifth embodiment of the present invention.
- FIG. 10 is a transverse cross-section view of the heat pipe in accordance with a sixth embodiment of the present invention.
- a heat pipe 10 according to a preferred embodiment of the present invention comprises a hollow pipe body 20 and a screen mesh 30 disposed on an inner wall 22 of the pipe body 20 .
- the heat pipe 10 comprises an evaporating section and a condensing section at respective opposite ends thereof, and an adiabatic section located between the evaporating section and the condensing section.
- the heat pipe 10 is vacuumed and two ends of the heat pipe 10 are sealed.
- the pipe body 20 is made of high heat conductivity material such as copper or copper alloys.
- the screen mesh 30 has a plurality of pores and is saturated with a working fluid (not shown).
- the working fluid may be water, alcohol or other material having a low boiling point; thus, the working fluid can easily evaporate to vapor during operation when the evaporating section receives heat from a heat-generating electronic device, such as a CPU.
- the screen mesh 30 comprises a wave layer 40 and a planar layer 50 arranged along circumferential and axial directions of the pipe body 20 .
- the wave layer 40 is staked on the inner wall 22 of the pipe body 20 while the planar layer 50 is stacked on the wave layer 40 along a radial direction of the heat pipe 10 from a center to a periphery thereof.
- the wave layer 40 is directly attached to the inner wall 22 of the pipe body 20 .
- the planar layer 50 is disposed on an inner side of the wave layer 40 .
- FIG. 2 which shows the planar layer 50 in an unfurled state
- outer surfaces of the planar layer 50 are flat.
- FIG. 3 shows the wave layer 40 in an unfurled state.
- the wave layer 40 is square-wave shaped and comprises alternate upper and lower horizontal sections 42 and vertical sections 46 between the horizontal sections 42 .
- the upper horizontal sections 42 abut against the inner wall 22 of the pipe body 20 .
- a flow channel 48 is formed between two adjacent vertical sections 46 of the wave layer 40 of the screen mesh 30 and the inner wall 22 .
- Each flow channel 48 extends along the longitudinal direction and entire length of the pipe body 20 , and has a trapezoid-shaped cross section (as shown in FIG. 1 ).
- the working fluid saturated in the screen mesh 30 at the evaporating section of the heat pipe 10 evaporates to vapor due to heat absorbed from the CPU
- the vapor moves toward the condensing section of the heat pipe 10 due to the difference of vapor pressure to perform heat transport.
- the vapor then cools and condenses at the condensing section to perform heat dissipation.
- the condensed working fluid is absorbed into the screen mesh 30 at the condensing section, and then returns to the evaporating section through the screen mesh 30 .
- the pores of the screen mesh 30 can provide a relatively large capillary pressure to the working fluid while the flow channels 48 can provide a relatively small flow resistance to the working fluid.
- the screen mesh 30 accordingly can increase the speed of the condensed working fluid in returning back to the evaporating section and therefore promotes the heat transfer performance of the heat pipe 10 . As a result, a dry-out problem of the heat pipe 10 can be avoided.
- the heat pipe 410 also comprises a pipe body 20 and a screen mesh 430 arranged in the pipe body 20 .
- the screen mesh 430 comprises a wave layer 440 directly attached to the pipe body 20 and a planar layer 50 disposed on an inside of the wave layer 440 .
- Flow channels 448 are formed by the wave layer 440 between it and the pipe body 20 and between it and the planar layer 50 .
- the wave layer 440 is consisted of a plurality of continuous serrations as viewed from the transverse cross-sectional view of the heat pipe 410 .
- each flow channel 448 has a triangle-shaped cross section.
- Upper tips of the serrations of the wave layer 440 abut against the inner wall of the pipe body 20
- lower tips thereof abut against the planar layer 50 .
- FIGS. 6-7 illustrate the heat pipe 610 in accordance with a third embodiment of the present invention. Except for the screen mesh 630 and flow channels 648 , 648 ′, other parts of the heat pipe 610 in accordance with the third embodiment are substantially the same as the heat pipe 410 of the previous embodiment.
- the screen mesh 630 also comprises a wave layer 640 .
- the wave layer 640 comprises a plurality of horizontal sections 642 and a plurality of serrate sections 646 each interconnecting two neighboring horizontal sections 642 .
- the serrate sections 646 are equally spaced from each other.
- the wave layer 640 defines triangle-shaped first flow channels 648 and trapezoid-shaped second flow channels 648 ′ alternately arranged along the circumferential direction of pipe body 20 . Tips of the serrate sections 646 abut against the inner wall of the pipe body 20 , and the horizontal sections 642 abut against planar layer 50 .
- the screen mesh 30 , 430 , 630 is used to provide capillary pressure to force the working fluid returning back to the evaporating section.
- the screen mesh 30 , 430 , 630 may be in the form of a multi-layer structure more than two layers.
- the screen mesh 830 has three layers stacked on each other along the radial direction of the pipe body 20 .
- the three layers comprise a wave layer 40 and two planar layers 50 sandwiching the wave layer 40 therebetween.
- FIG. 9 shows a screen mesh 930 also having three layers stacked on each other along the radial direction of the pipe body 20 . These three layers comprise a planar layer 50 and two wave layers 40 sandwiching the planar layer 50 therebetween.
- FIG. 10 also illustrates the heat pipe having a screen mesh 130 comprising three layers.
- the three layers comprise a planar layer 150 and two wave layers 140 , 140 ′ sandwiching the planar layer 150 therebetween.
- the planar layer 150 has a pore size different from that of the wave layers 140 , 140 ′.
- the wave layers 140 , 140 ′ have the same pore size.
- the embodiment of FIG. 10 can be further modified that the two wave layers 140 , 140 ′ have different pore sizes, whereby the heat pipe can be used in an environment with a broader range of parameters regarding heat-dissipation requirement.
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat pipe (10) includes a hollow pipe body (20) for receiving a working fluid therein and a screen mesh (30) disposed in the pipe body. The screen mesh includes at least two layers. One of the two layers is in the form of a planar layer (50) and the other is in the form of a wave layer (40). A plurality of flowing channels (48) is formed by the wave layer. The channels formed by the wave layer of the screen mesh are capable of reducing the flow resistance for the condensed fluid to flow back while pores in the screen mesh provide a relatively large capillary pressure for drawing the condensed fluid to flow back.
Description
- The present invention relates generally to heat pipes, and more particularly to a heat pipe with a wick structure of screen mesh.
- As electronic industry continues to advance, electronic components such as central processing units (CPUs), are made to provide faster operational speeds and greater functional capabilities. When a CPU operates at a high speed, its temperature frequently increases greatly. It is desirable to dissipate the heat generated by the CPU quickly.
- To solve this problem of heat generated by the CPU, a cooling device is often used to be mounted on top of the CPU to dissipate heat generated thereby. It is well known that heat absorbed by fluid having a phase change is ten times more than that the fluid does not have a phase change; thus, the heat transfer efficiency by phase change of fluid is better than other mechanisms, such as heat conduction or heat convection. Accordingly, a heat pipe has been developed.
- The heat pipe has a hollow pipe body receiving a working fluid therein and a wick structure disposed on an inner wall of the pipe body. Generally the heat pipe is divided into an evaporating section, an adiabatic section and a condensing section along a longitudinal direction thereof. During operation of the heat pipe, the working fluid absorbs the heat generated by the CPU or other electronic device and evaporates into vapor. The vapor moves from the evaporating section to the condensing section to dissipate the heat, whereby the vapor cools and condenses at the condensing section. The condensed working fluid returns to the evaporating section via a capillary force generated by the wick structure. From the evaporating section, the fluid is evaporated again to thereby repeat the heat transfer from the evaporating section to the condensing section.
- In general, movement of the working fluid depends on the capillary pressure (force) of the wick structure. Usually the wick structure has following four configurations: sintered powders, grooves, fiber and screen mesh. Since the thickness and pore size of the screen mesh can be easily changed, the screen mesh is widely used in the heat pipe.
- It is well recognized that the capillary pressure of a screen mesh increases due to a decrease in the pore size of the screen mesh. In order to obtain a relatively large capillary pressure, a mesh screen having a small-sized pore is usually adopted. However, it is not always the best way to choose a screen mesh having small-sized pores, because the flow resistance to the condensed working fluid also increases due to a decrease in the pore size of the screen mesh. The increased flow resistance reduces the speed of the condensed working fluid in returning back to the evaporating section and therefore limits the heat transfer performance of the heat pipe. As a result, a heat pipe with a screen mesh that has too large or too small a pore size often suffers dry-out problem at the evaporating section as the condensed working fluid cannot be timely sent back to the evaporating section of the heat pipe.
- Therefore, there is a need for a heat pipe with a screen mesh which can provide simultaneously a relatively large capillary pressure and a relatively low flow resistance so as to effectively and timely bring the condensed working fluid back from the condensing section to the evaporating section of the heat pipe and thereby to avoid the undesirable dry-out problem at the evaporating section.
- According to a preferred embodiment of the present invention, a heat pipe comprises a hollow pipe body for receiving a working fluid therein and a screen mesh disposed in the pipe body. The screen mesh comprises at least two layers. One of the two layers is in the form of a planar layer and the other of the two layers is in the form of a wave layer. The wave layer forms a plurality of flowing channels for the working fluid to flow from a condensing section to an evaporating section of the heat pipe. The channels formed by the wave layer of the screen mesh is capable of reducing the flow resistance to the condensed fluid to flow back while pores in the screen mesh are capable of providing a relatively large capillary pressure for drawing the condensed fluid to flow back.
- Other advantages and novel features of the present invention will be drawn from the following detailed description of a preferred embodiment of the present invention with attached drawings, in which:
-
FIG. 1 is a transverse cross-section view of a heat pipe in accordance with a preferred embodiment of the present invention; -
FIG. 2 is an isometric, unfurled view of a planar layer of a mesh screen of the heat pipe ofFIG. 1 ; -
FIG. 3 is an isometric, unfurled view of a wave layer of the mesh screen of the heat pipe ofFIG. 1 ; -
FIG. 4 is a transverse cross-section view of the heat pipe in accordance with a second embodiment of the present invention; -
FIG. 5 is an isometric, unfurled view of the wave layer of the mesh screen of the heat pipe ofFIG. 4 ; -
FIG. 6 is a transverse cross-section view of the heat pipe in accordance with a third embodiment of the present invention; -
FIG. 7 is an isometric, unfurled view of the wave layer of the mesh screen of the heat pipe ofFIG. 6 ; -
FIG. 8 is a transverse cross-section view of the heat pipe in accordance with a fourth embodiment of the present invention; -
FIG. 9 is a transverse cross-section view of the heat pipe in accordance with a fifth embodiment of the present invention, and -
FIG. 10 is a transverse cross-section view of the heat pipe in accordance with a sixth embodiment of the present invention. - Referring to
FIG. 1 , aheat pipe 10 according to a preferred embodiment of the present invention comprises ahollow pipe body 20 and ascreen mesh 30 disposed on aninner wall 22 of thepipe body 20. Theheat pipe 10 comprises an evaporating section and a condensing section at respective opposite ends thereof, and an adiabatic section located between the evaporating section and the condensing section. Theheat pipe 10 is vacuumed and two ends of theheat pipe 10 are sealed. - The
pipe body 20 is made of high heat conductivity material such as copper or copper alloys. Thescreen mesh 30 has a plurality of pores and is saturated with a working fluid (not shown). The working fluid may be water, alcohol or other material having a low boiling point; thus, the working fluid can easily evaporate to vapor during operation when the evaporating section receives heat from a heat-generating electronic device, such as a CPU. - The
screen mesh 30 comprises awave layer 40 and aplanar layer 50 arranged along circumferential and axial directions of thepipe body 20. Thewave layer 40 is staked on theinner wall 22 of thepipe body 20 while theplanar layer 50 is stacked on thewave layer 40 along a radial direction of theheat pipe 10 from a center to a periphery thereof. Thewave layer 40 is directly attached to theinner wall 22 of thepipe body 20. Theplanar layer 50 is disposed on an inner side of thewave layer 40. - As best seen in
FIG. 2 , which shows theplanar layer 50 in an unfurled state, outer surfaces of theplanar layer 50 are flat. -
FIG. 3 shows thewave layer 40 in an unfurled state. Thewave layer 40 is square-wave shaped and comprises alternate upper and lowerhorizontal sections 42 andvertical sections 46 between thehorizontal sections 42. When thewave layer 40 is rolled and inserted into thepipe body 20, the upperhorizontal sections 42 abut against theinner wall 22 of thepipe body 20. Thus, aflow channel 48 is formed between two adjacentvertical sections 46 of thewave layer 40 of thescreen mesh 30 and theinner wall 22. Eachflow channel 48 extends along the longitudinal direction and entire length of thepipe body 20, and has a trapezoid-shaped cross section (as shown inFIG. 1 ). - During operation of the
heat pipe 10, when the working fluid saturated in thescreen mesh 30 at the evaporating section of theheat pipe 10 evaporates to vapor due to heat absorbed from the CPU, the vapor moves toward the condensing section of theheat pipe 10 due to the difference of vapor pressure to perform heat transport. The vapor then cools and condenses at the condensing section to perform heat dissipation. In this case, the condensed working fluid is absorbed into thescreen mesh 30 at the condensing section, and then returns to the evaporating section through thescreen mesh 30. The pores of thescreen mesh 30 can provide a relatively large capillary pressure to the working fluid while theflow channels 48 can provide a relatively small flow resistance to the working fluid. The screen mesh 30 accordingly can increase the speed of the condensed working fluid in returning back to the evaporating section and therefore promotes the heat transfer performance of theheat pipe 10. As a result, a dry-out problem of theheat pipe 10 can be avoided. - Referring to
FIGS. 4-5 , they illustrate theheat pipe 410 in accordance with a second embodiment of the present invention. Similar to the first embodiment, theheat pipe 410 also comprises apipe body 20 and ascreen mesh 430 arranged in thepipe body 20. Thescreen mesh 430 comprises awave layer 440 directly attached to thepipe body 20 and aplanar layer 50 disposed on an inside of thewave layer 440.Flow channels 448 are formed by thewave layer 440 between it and thepipe body 20 and between it and theplanar layer 50. The difference of the second embodiment over the first embodiment is that thewave layer 440 is consisted of a plurality of continuous serrations as viewed from the transverse cross-sectional view of theheat pipe 410. Thus, eachflow channel 448 has a triangle-shaped cross section. Upper tips of the serrations of thewave layer 440 abut against the inner wall of thepipe body 20, while lower tips thereof abut against theplanar layer 50. -
FIGS. 6-7 illustrate theheat pipe 610 in accordance with a third embodiment of the present invention. Except for the screen mesh 630 and flowchannels heat pipe 610 in accordance with the third embodiment are substantially the same as theheat pipe 410 of the previous embodiment. The screen mesh 630 also comprises awave layer 640. Thewave layer 640 comprises a plurality ofhorizontal sections 642 and a plurality ofserrate sections 646 each interconnecting two neighboringhorizontal sections 642. Theserrate sections 646 are equally spaced from each other. When the screen mesh 630 is rolled and installed in thepipe body 20, thewave layer 640 defines triangle-shapedfirst flow channels 648 and trapezoid-shapedsecond flow channels 648′ alternately arranged along the circumferential direction ofpipe body 20. Tips of theserrate sections 646 abut against the inner wall of thepipe body 20, and thehorizontal sections 642 abut againstplanar layer 50. - It is to be understood that the
screen mesh screen mesh FIG. 8 , thescreen mesh 830 has three layers stacked on each other along the radial direction of thepipe body 20. The three layers comprise awave layer 40 and twoplanar layers 50 sandwiching thewave layer 40 therebetween.FIG. 9 shows ascreen mesh 930 also having three layers stacked on each other along the radial direction of thepipe body 20. These three layers comprise aplanar layer 50 and twowave layers 40 sandwiching theplanar layer 50 therebetween. -
FIG. 10 also illustrates the heat pipe having ascreen mesh 130 comprising three layers. The three layers comprise aplanar layer 150 and twowave layers planar layer 150 therebetween. The difference of this embodiment over that ofFIG. 9 is that theplanar layer 150 has a pore size different from that of the wave layers 140, 140′. In this embodiment, the wave layers 140, 140′ have the same pore size. Although it is not shown in the drawings, it is apparent to those skilled in the art that the embodiment ofFIG. 10 can be further modified that the twowave layers - It is understood that the invention may be embodied in other forms without departing from the spirit thereof. Thus, the present example and embodiment is to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.
Claims (20)
1. A heat pipe comprising:
a hollow pipe body for receiving a working fluid therein;
a screen mesh furled and disposed in the pipe body, the screen mesh comprising at least two layers, one of the at least two layers is in the form of a planar layer and another of the at least two layers in the form of a wave layer; and
a plurality of flowing channels being formed by the wave layer for the working fluid received in the heat pipe to flow.
2. The heat pipe as claimed in claim 1 , wherein the wave layer comprises a horizontal section and a vertical section alternately arranged along a circumferential direction of pipe body, and each flowing channel has a trapezoid-shaped cross section.
3. The heat pipe as claimed in claim 1 , wherein the wave layer comprises a plurality of continuous serrations, and each flowing channel has a triangle-shaped cross section.
4. The heat pipe as claimed in claim 1 , wherein the wave layer comprises a plurality of horizontal sections and a plurality of serrations each interconnecting two horizontal sections, and the flowing channels comprises a triangle-shaped first flow channel and a trapezoid-shaped second flow channel alternately arranged along a circumferential direction of pipe body.
5. The heat pipe as claimed in claim 1 , wherein the wave layer of the at least two layers is directly attached to the pipe body.
6. The heat pipe as claimed in claim 1 , wherein the screen mesh comprises three layers stacked on each other along a radial direction of the pipe body.
7. The heat pipe as claimed in claim 6 , wherein the three layers comprise two planar layers and a wave layer sandwiched between the two planar layers.
8. The heat pipe as claimed in claim 6 , wherein the three layers comprise two wave layers and a planar layer sandwiched between the two wave layers.
9. The heat pipe as claimed in claim 8 , wherein the wave layers have a pore size different from that of the planar layer.
10. The heat pipe as claimed in claim 8 , wherein each layer of the screen mesh has a pore size different from that of the other layers.
11. A heat pipe comprising:
a pipe body having an inner wall;
working fluid received in the pipe body;
a screen mesh rolled and installed in the pipe body and abutting against the inner wall thereof, the screen mesh having a plurality of pores therein for drawing the working fluid from a first section to a second section the pipe body, the screen mesh forming circumferentially distributed flowing channels in pipe body, the flowing channels being larger than the pores in the screen mesh, the flowing channels extending along a longitudinal direction of the pipe body.
12. The heat pipe of claim 11 , wherein the screen mesh comprises a wave layer and a planar layer, the wave layer abutting against the inner wall of the pipe body.
13. The heat pipe of claim 12 , wherein the wave layer is square-wave shaped, and comprises alternate upper and lower horizontal sections and vertical sections between the horizontal sections, the upper horizontal sections abutting against the inner wall of the pipe body, and the vertical sections together with the inner wall forming the channels.
14. The heat pipe of claim 12 , where the wave layer comprises of a plurality of continuous serrations.
15. The heat pipe of claim 12 , wherein the wave layer includes a plurality of horizontal sections and a plurality of serrations each interconnecting two horizontal sections, the serrations being equally spaced from each other and tips thereof abutting the inner wall of the pipe body, the wave layer forming a plurality of trapezoid-shaped flowing channels with the inner wall of the pipe body, and a plurality of triangle-shaped flowing channels with the planar layer.
16. The heat pipe of claim 11 , wherein the screen mesh comprises two planar layers and a wave layers sandwiched between the two planar layers, one of the two planar layers abutting against the inner wall of the pipe body.
17. The heat pipe of claim 11 , wherein the screen mesh comprises two wave layers and a planar layer sandwiched between the two wave layers, one of the two wave layers abutting against the inner wall of the pipe body.
18. The heat pipe of claim 17 , wherein the two wave layers have a pore size which is different from that of the planar layer.
19. The heat pipe of claim 17 , wherein the two wave layers have different pore sizes which are different from that of the planar layer.
20. A heat pipe comprising:
a pipe body having an inner wall;
a screen mesh disposed in the pipe body and abutting against the inner wall of the pipe body, the screen mesh comprising a plurality of layers stacked on each other along a radial direction of the pipe body, wherein two neighboring layers have different configurations with one of which having a wave-like configuration.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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TW094102615A TWI271502B (en) | 2005-01-28 | 2005-01-28 | Wick structure for heat pipe and method for making thereof |
TW094102615 | 2005-01-28 |
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US20060169439A1 true US20060169439A1 (en) | 2006-08-03 |
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US11/164,094 Abandoned US20060169439A1 (en) | 2005-01-28 | 2005-11-10 | Heat pipe with wick structure of screen mesh |
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Cited By (19)
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US20070240855A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
US20090166004A1 (en) * | 2007-12-29 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat pipe |
US20090294104A1 (en) * | 2008-05-08 | 2009-12-03 | Kuo-Len Lin | Vapor chamber |
US20100157533A1 (en) * | 2008-12-24 | 2010-06-24 | Sony Corporation | Heat-transporting device, electronic apparatus, and method of producing a heat-transporting device |
US20100254090A1 (en) * | 2009-04-01 | 2010-10-07 | Harris Corporation | Multi-layer mesh wicks for heat pipes |
US20110011565A1 (en) * | 2009-07-17 | 2011-01-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Plate-type heat pipe |
US20110259555A1 (en) * | 2010-04-26 | 2011-10-27 | Asia Vital Components Co., Ltd. | Micro vapor chamber |
US20130160977A1 (en) * | 2011-12-26 | 2013-06-27 | Foxconn Technology Co., Ltd. | Plate type heat pipe with mesh wick structure having opening |
US20140208796A1 (en) * | 2012-03-07 | 2014-07-31 | Jonathan S. Harms | Evaporative chiller |
US20150123294A1 (en) * | 2013-03-07 | 2015-05-07 | Nano Evaporative Technologies, Inc. | Evaporative HVAC Apparatus |
RU2572545C1 (en) * | 2014-06-24 | 2016-01-20 | Евгений Антонович Липухин | Shell-and-tube continuous heat exchanger |
TWI585358B (en) * | 2012-08-23 | 2017-06-01 | 鴻準精密工業股份有限公司 | Heat pipe and method for manufacturing the same |
CN106871675A (en) * | 2017-03-22 | 2017-06-20 | 广东工业大学 | A kind of MULTILAYER COMPOSITE liquid-sucking core flat-plate type micro heat pipe and preparation method thereof |
US9845960B2 (en) | 2012-03-07 | 2017-12-19 | Aermist Llc | Evaporative HVAC apparatus |
CN108633160A (en) * | 2018-07-28 | 2018-10-09 | 中国原子能科学研究院 | A kind of proton precessional magnetometer beam cooling device |
US10343489B2 (en) | 2012-03-07 | 2019-07-09 | Nano Evaporative Technologies, Inc. | Evaporative HVAC apparatus |
KR102168097B1 (en) * | 2020-01-21 | 2020-10-20 | 에이블메탈 주식회사 | Sintering hybrid wick based screen mesh and method for manufacturing thereof |
US20220299273A1 (en) * | 2021-03-16 | 2022-09-22 | Fujitsu Limited | Cooling device |
WO2024024167A1 (en) * | 2022-07-29 | 2024-02-01 | 株式会社フジクラ | Heat pipe |
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2005
- 2005-01-28 TW TW094102615A patent/TWI271502B/en not_active IP Right Cessation
- 2005-11-10 US US11/164,094 patent/US20060169439A1/en not_active Abandoned
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US20070240855A1 (en) * | 2006-04-14 | 2007-10-18 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick structure |
US20090166004A1 (en) * | 2007-12-29 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat pipe |
US7913748B2 (en) * | 2008-05-08 | 2011-03-29 | Golden Sun News Techniques Co., Ltd. | Vapor chamber |
US20090294104A1 (en) * | 2008-05-08 | 2009-12-03 | Kuo-Len Lin | Vapor chamber |
US20100157533A1 (en) * | 2008-12-24 | 2010-06-24 | Sony Corporation | Heat-transporting device, electronic apparatus, and method of producing a heat-transporting device |
US20100254090A1 (en) * | 2009-04-01 | 2010-10-07 | Harris Corporation | Multi-layer mesh wicks for heat pipes |
US8587944B2 (en) * | 2009-04-01 | 2013-11-19 | Harris Corporation | Multi-layer mesh wicks for heat pipes |
US9175912B2 (en) | 2009-04-01 | 2015-11-03 | Harris Corporation | Multi-layer mesh wicks for heat pipes |
US20110011565A1 (en) * | 2009-07-17 | 2011-01-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Plate-type heat pipe |
US20110259555A1 (en) * | 2010-04-26 | 2011-10-27 | Asia Vital Components Co., Ltd. | Micro vapor chamber |
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US20130160977A1 (en) * | 2011-12-26 | 2013-06-27 | Foxconn Technology Co., Ltd. | Plate type heat pipe with mesh wick structure having opening |
US9423187B2 (en) * | 2011-12-26 | 2016-08-23 | Foxconn Technology Co., Ltd. | Plate type heat pipe with mesh wick structure having opening |
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US20140208796A1 (en) * | 2012-03-07 | 2014-07-31 | Jonathan S. Harms | Evaporative chiller |
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US20170146250A1 (en) * | 2012-03-07 | 2017-05-25 | Aermist Llc | Evaporative HVAC Apparatus |
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US20190011138A1 (en) * | 2012-03-07 | 2019-01-10 | Aermist Llc | Evaporative HVAC Apparatus |
US9845960B2 (en) | 2012-03-07 | 2017-12-19 | Aermist Llc | Evaporative HVAC apparatus |
TWI585358B (en) * | 2012-08-23 | 2017-06-01 | 鴻準精密工業股份有限公司 | Heat pipe and method for manufacturing the same |
US9599354B2 (en) * | 2013-03-07 | 2017-03-21 | Aermist Llc | Evaporative HVAC apparatus |
US20150123294A1 (en) * | 2013-03-07 | 2015-05-07 | Nano Evaporative Technologies, Inc. | Evaporative HVAC Apparatus |
RU2572545C1 (en) * | 2014-06-24 | 2016-01-20 | Евгений Антонович Липухин | Shell-and-tube continuous heat exchanger |
WO2016014093A1 (en) * | 2014-07-21 | 2016-01-28 | Nano Evaporative Technologies, Inc. | Evaporative hvac apparatus |
CN106871675A (en) * | 2017-03-22 | 2017-06-20 | 广东工业大学 | A kind of MULTILAYER COMPOSITE liquid-sucking core flat-plate type micro heat pipe and preparation method thereof |
CN108633160A (en) * | 2018-07-28 | 2018-10-09 | 中国原子能科学研究院 | A kind of proton precessional magnetometer beam cooling device |
KR102168097B1 (en) * | 2020-01-21 | 2020-10-20 | 에이블메탈 주식회사 | Sintering hybrid wick based screen mesh and method for manufacturing thereof |
US20220299273A1 (en) * | 2021-03-16 | 2022-09-22 | Fujitsu Limited | Cooling device |
US11892246B2 (en) * | 2021-03-16 | 2024-02-06 | Fujitsu Limited | Cooling device |
WO2024024167A1 (en) * | 2022-07-29 | 2024-02-01 | 株式会社フジクラ | Heat pipe |
Also Published As
Publication number | Publication date |
---|---|
TW200626862A (en) | 2006-08-01 |
TWI271502B (en) | 2007-01-21 |
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Legal Events
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