TW200626862A - A wick structure for a heat pipe and method for making thereof - Google Patents

A wick structure for a heat pipe and method for making thereof

Info

Publication number
TW200626862A
TW200626862A TW094102615A TW94102615A TW200626862A TW 200626862 A TW200626862 A TW 200626862A TW 094102615 A TW094102615 A TW 094102615A TW 94102615 A TW94102615 A TW 94102615A TW 200626862 A TW200626862 A TW 200626862A
Authority
TW
Taiwan
Prior art keywords
heat pipe
mesh
meshes
wick structure
layers
Prior art date
Application number
TW094102615A
Other languages
Chinese (zh)
Other versions
TWI271502B (en
Inventor
Chu-Wan Hong
Ching-Tai Cheng
Chang-Ting Lo
Jung-Yuan Wu
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW094102615A priority Critical patent/TWI271502B/en
Priority to US11/164,094 priority patent/US20060169439A1/en
Publication of TW200626862A publication Critical patent/TW200626862A/en
Application granted granted Critical
Publication of TWI271502B publication Critical patent/TWI271502B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A wick structure for a heat pipe includes at least two layers of meshes stacked at an inner circumferential wall of a tube of the heat pipe. One of the two layers of meshes is made from a planar mesh and the other of the two layers of meshes is made from wave mesh. A flowing channel for coolant filled in the heat pipe is formed in the wave mesh. A method for manufacturing the wick structure includes the following steps: (1) providing at least one planar mesh and wave mesh; (2) rolling the meshes into cylindrical shape respectively; (3) inserting cylindrical-shaped meshes into the tube of the heat pipe sequentially. The wick structure of present invention adopts planar mesh and wave mesh to thereby improve capillary action and reduce flowing resistance to coolant thereof.
TW094102615A 2005-01-28 2005-01-28 Wick structure for heat pipe and method for making thereof TWI271502B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094102615A TWI271502B (en) 2005-01-28 2005-01-28 Wick structure for heat pipe and method for making thereof
US11/164,094 US20060169439A1 (en) 2005-01-28 2005-11-10 Heat pipe with wick structure of screen mesh

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094102615A TWI271502B (en) 2005-01-28 2005-01-28 Wick structure for heat pipe and method for making thereof

Publications (2)

Publication Number Publication Date
TW200626862A true TW200626862A (en) 2006-08-01
TWI271502B TWI271502B (en) 2007-01-21

Family

ID=36755271

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102615A TWI271502B (en) 2005-01-28 2005-01-28 Wick structure for heat pipe and method for making thereof

Country Status (2)

Country Link
US (1) US20060169439A1 (en)
TW (1) TWI271502B (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100561108C (en) * 2006-04-14 2009-11-18 富准精密工业(深圳)有限公司 Heat pipe
US20090166004A1 (en) * 2007-12-29 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat pipe
TW200946855A (en) * 2008-05-08 2009-11-16 Golden Sun News Tech Co Ltd Vapor chamber
JP4737285B2 (en) * 2008-12-24 2011-07-27 ソニー株式会社 Heat transport device and electronic equipment
US8587944B2 (en) 2009-04-01 2013-11-19 Harris Corporation Multi-layer mesh wicks for heat pipes
CN101957153B (en) * 2009-07-17 2013-03-13 富准精密工业(深圳)有限公司 Flat heat pipe
TWM394682U (en) * 2010-04-26 2010-12-11 Asia Vital Components Co Ltd Miniature heat spreader structure
TWI530654B (en) * 2011-12-26 2016-04-21 鴻準精密工業股份有限公司 Plate type heat pipe
US9845960B2 (en) 2012-03-07 2017-12-19 Aermist Llc Evaporative HVAC apparatus
US10343489B2 (en) 2012-03-07 2019-07-09 Nano Evaporative Technologies, Inc. Evaporative HVAC apparatus
US9599354B2 (en) * 2013-03-07 2017-03-21 Aermist Llc Evaporative HVAC apparatus
US9429346B2 (en) * 2012-03-07 2016-08-30 Aermist Llc Evaporative chiller
CN103629962A (en) * 2012-08-23 2014-03-12 富瑞精密组件（昆山）有限公司 Heat pipe and manufacturing method thereof
RU2572545C1 (en) * 2014-06-24 2016-01-20 Евгений Антонович Липухин Shell-and-tube continuous heat exchanger
CN106871675A (en) * 2017-03-22 2017-06-20 广东工业大学 A kind of MULTILAYER COMPOSITE liquid-sucking core flat-plate type micro heat pipe and preparation method thereof
CN108633160B (en) * 2018-07-28 2024-05-31 中国原子能科学研究院 Beam cooling device of proton accelerator
KR102168097B1 (en) * 2020-01-21 2020-10-20 에이블메탈 주식회사 Sintering hybrid wick based screen mesh and method for manufacturing thereof
JP2022142665A (en) * 2021-03-16 2022-09-30 富士通株式会社 Cooling device
FR3123114B1 (en) * 2021-05-20 2023-07-14 Euro Heat Pipes Improved performance heat pipe under various thermal load distributions
WO2024024167A1 (en) * 2022-07-29 2024-02-01 株式会社フジクラ Heat pipe

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3554183A (en) * 1968-10-04 1971-01-12 Acf Ind Inc Heat pipe heating system for a railway tank car or the like
US3525670A (en) * 1968-12-17 1970-08-25 Atomic Energy Commission Two-phase fluid control system
US3681843A (en) * 1970-03-06 1972-08-08 Westinghouse Electric Corp Heat pipe wick fabrication
US3834457A (en) * 1971-01-18 1974-09-10 Bendix Corp Laminated heat pipe and method of manufacture
US3786861A (en) * 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
DE2515753A1 (en) * 1975-04-10 1976-10-14 Siemens Ag WARM PIPE
US4163474A (en) * 1976-03-10 1979-08-07 E. I. Du Pont De Nemours And Company Internally finned tube
US6293333B1 (en) * 1999-09-02 2001-09-25 The United States Of America As Represented By The Secretary Of The Air Force Micro channel heat pipe having wire cloth wick and method of fabrication

Also Published As

Publication number Publication date
TWI271502B (en) 2007-01-21
US20060169439A1 (en) 2006-08-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees