JPWO2024029311A5 - - Google Patents

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Publication number
JPWO2024029311A5
JPWO2024029311A5 JP2023575654A JP2023575654A JPWO2024029311A5 JP WO2024029311 A5 JPWO2024029311 A5 JP WO2024029311A5 JP 2023575654 A JP2023575654 A JP 2023575654A JP 2023575654 A JP2023575654 A JP 2023575654A JP WO2024029311 A5 JPWO2024029311 A5 JP WO2024029311A5
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JP
Japan
Prior art keywords
composite material
less
layer
thickness direction
sectional
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JP2023575654A
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English (en)
Japanese (ja)
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JP7507988B1 (ja
JPWO2024029311A1 (https=
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Priority claimed from PCT/JP2023/025926 external-priority patent/WO2024029311A1/ja
Publication of JPWO2024029311A1 publication Critical patent/JPWO2024029311A1/ja
Application granted granted Critical
Publication of JP7507988B1 publication Critical patent/JP7507988B1/ja
Publication of JPWO2024029311A5 publication Critical patent/JPWO2024029311A5/ja
Active legal-status Critical Current
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JP2023575654A 2022-08-04 2023-07-13 複合材料、ヒートスプレッダ及び半導体パッケージ Active JP7507988B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022124936 2022-08-04
JP2022124936 2022-08-04
PCT/JP2023/025926 WO2024029311A1 (ja) 2022-08-04 2023-07-13 複合材料、ヒートスプレッダ及び半導体パッケージ

Publications (3)

Publication Number Publication Date
JPWO2024029311A1 JPWO2024029311A1 (https=) 2024-02-08
JP7507988B1 JP7507988B1 (ja) 2024-06-28
JPWO2024029311A5 true JPWO2024029311A5 (https=) 2024-07-09

Family

ID=89849270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023575654A Active JP7507988B1 (ja) 2022-08-04 2023-07-13 複合材料、ヒートスプレッダ及び半導体パッケージ

Country Status (5)

Country Link
JP (1) JP7507988B1 (https=)
KR (1) KR102945417B1 (https=)
CN (1) CN119547205A (https=)
DE (1) DE112023003343T5 (https=)
WO (1) WO2024029311A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313331A (ja) * 1989-06-10 1991-01-22 Sumitomo Special Metals Co Ltd 熱膨張係数及び熱伝導率可変複合材料
JP5292556B2 (ja) 2009-03-17 2013-09-18 株式会社Ｗｅｌｃｏｎ 熱伝導複合材及びその製造方法
JP6041117B1 (ja) 2016-07-28 2016-12-07 株式会社半導体熱研究所 放熱基板、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法
JP7640558B2 (ja) 2020-08-06 2025-03-05 住友電気工業株式会社 複合材料、ヒートスプレッダ及び半導体パッケージ

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