DE112023003343T5 - Verbundwerkstoff, Wärmespreizer und Halbleitergehäuse - Google Patents

Verbundwerkstoff, Wärmespreizer und Halbleitergehäuse Download PDF

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Publication number
DE112023003343T5
DE112023003343T5 DE112023003343.9T DE112023003343T DE112023003343T5 DE 112023003343 T5 DE112023003343 T5 DE 112023003343T5 DE 112023003343 T DE112023003343 T DE 112023003343T DE 112023003343 T5 DE112023003343 T5 DE 112023003343T5
Authority
DE
Germany
Prior art keywords
composite material
openings
layer
thickness direction
molybdenum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023003343.9T
Other languages
German (de)
English (en)
Inventor
Keita Sasaki
Toru Maeda
Daisuke Kondo
Masayuki Ito
Shin-ichi Yamagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALMT Corp
Sumitomo Electric Industries Ltd
Original Assignee
ALMT Corp
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ALMT Corp, Sumitomo Electric Industries Ltd filed Critical ALMT Corp
Publication of DE112023003343T5 publication Critical patent/DE112023003343T5/de
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
    • H10W20/4421—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
DE112023003343.9T 2022-08-04 2023-07-13 Verbundwerkstoff, Wärmespreizer und Halbleitergehäuse Pending DE112023003343T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-124936 2022-08-04
JP2022124936 2022-08-04
PCT/JP2023/025926 WO2024029311A1 (ja) 2022-08-04 2023-07-13 複合材料、ヒートスプレッダ及び半導体パッケージ

Publications (1)

Publication Number Publication Date
DE112023003343T5 true DE112023003343T5 (de) 2025-05-22

Family

ID=89849270

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023003343.9T Pending DE112023003343T5 (de) 2022-08-04 2023-07-13 Verbundwerkstoff, Wärmespreizer und Halbleitergehäuse

Country Status (5)

Country Link
JP (1) JP7507988B1 (https=)
KR (1) KR102945417B1 (https=)
CN (1) CN119547205A (https=)
DE (1) DE112023003343T5 (https=)
WO (1) WO2024029311A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313331A (ja) * 1989-06-10 1991-01-22 Sumitomo Special Metals Co Ltd 熱膨張係数及び熱伝導率可変複合材料
JP5292556B2 (ja) 2009-03-17 2013-09-18 株式会社Ｗｅｌｃｏｎ 熱伝導複合材及びその製造方法
JP6041117B1 (ja) 2016-07-28 2016-12-07 株式会社半導体熱研究所 放熱基板、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法
KR20230043122A (ko) 2020-08-06 2023-03-30 스미토모덴키고교가부시키가이샤 복합 재료, 히트 스프레더 및 반도체 패키지

Also Published As

Publication number Publication date
KR20250026339A (ko) 2025-02-25
KR102945417B1 (ko) 2026-03-27
WO2024029311A1 (ja) 2024-02-08
JP7507988B1 (ja) 2024-06-28
CN119547205A (zh) 2025-02-28
JPWO2024029311A1 (https=) 2024-02-08

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Legal Events

Date Code Title Description
R012 Request for examination validly filed