KR102945417B1 - 복합 재료, 히트 스프레더 및 반도체 패키지 - Google Patents

복합 재료, 히트 스프레더 및 반도체 패키지

Info

Publication number
KR102945417B1
KR102945417B1 KR1020257002740A KR20257002740A KR102945417B1 KR 102945417 B1 KR102945417 B1 KR 102945417B1 KR 1020257002740 A KR1020257002740 A KR 1020257002740A KR 20257002740 A KR20257002740 A KR 20257002740A KR 102945417 B1 KR102945417 B1 KR 102945417B1
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KR
South Korea
Prior art keywords
composite material
layer
thickness direction
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openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020257002740A
Other languages
English (en)
Korean (ko)
Other versions
KR20250026339A (ko
Inventor
케이타 사사키
토루 마에다
다이스케 곤도
마사유키 이토
신이치 야마가타
Original Assignee
스미토모덴키고교가부시키가이샤
가부시끼가이샤 아라이도 마테리아루
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Application filed by 스미토모덴키고교가부시키가이샤, 가부시끼가이샤 아라이도 마테리아루 filed Critical 스미토모덴키고교가부시키가이샤
Publication of KR20250026339A publication Critical patent/KR20250026339A/ko
Application granted granted Critical
Publication of KR102945417B1 publication Critical patent/KR102945417B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
    • H10W20/4421—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H01L2924/01029—
    • H01L2924/01042—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
KR1020257002740A 2022-08-04 2023-07-13 복합 재료, 히트 스프레더 및 반도체 패키지 Active KR102945417B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022124936 2022-08-04
JPJP-P-2022-124936 2022-08-04
PCT/JP2023/025926 WO2024029311A1 (ja) 2022-08-04 2023-07-13 複合材料、ヒートスプレッダ及び半導体パッケージ

Publications (2)

Publication Number Publication Date
KR20250026339A KR20250026339A (ko) 2025-02-25
KR102945417B1 true KR102945417B1 (ko) 2026-03-27

Family

ID=89849270

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257002740A Active KR102945417B1 (ko) 2022-08-04 2023-07-13 복합 재료, 히트 스프레더 및 반도체 패키지

Country Status (5)

Country Link
JP (1) JP7507988B1 (https=)
KR (1) KR102945417B1 (https=)
CN (1) CN119547205A (https=)
DE (1) DE112023003343T5 (https=)
WO (1) WO2024029311A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010245496A (ja) 2009-03-17 2010-10-28 Welcon:Kk 熱伝導複合材及びその製造方法
WO2018020695A1 (ja) 2016-07-28 2018-02-01 株式会社半導体熱研究所 放熱基板、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313331A (ja) * 1989-06-10 1991-01-22 Sumitomo Special Metals Co Ltd 熱膨張係数及び熱伝導率可変複合材料
KR20230043122A (ko) 2020-08-06 2023-03-30 스미토모덴키고교가부시키가이샤 복합 재료, 히트 스프레더 및 반도체 패키지

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010245496A (ja) 2009-03-17 2010-10-28 Welcon:Kk 熱伝導複合材及びその製造方法
WO2018020695A1 (ja) 2016-07-28 2018-02-01 株式会社半導体熱研究所 放熱基板、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法

Also Published As

Publication number Publication date
KR20250026339A (ko) 2025-02-25
WO2024029311A1 (ja) 2024-02-08
DE112023003343T5 (de) 2025-05-22
JP7507988B1 (ja) 2024-06-28
CN119547205A (zh) 2025-02-28
JPWO2024029311A1 (https=) 2024-02-08

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