JP7507988B1 - 複合材料、ヒートスプレッダ及び半導体パッケージ - Google Patents

複合材料、ヒートスプレッダ及び半導体パッケージ Download PDF

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Publication number
JP7507988B1
JP7507988B1 JP2023575654A JP2023575654A JP7507988B1 JP 7507988 B1 JP7507988 B1 JP 7507988B1 JP 2023575654 A JP2023575654 A JP 2023575654A JP 2023575654 A JP2023575654 A JP 2023575654A JP 7507988 B1 JP7507988 B1 JP 7507988B1
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composite material
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openings
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JP2023575654A
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English (en)
Japanese (ja)
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JPWO2024029311A1 (https=
JPWO2024029311A5 (https=
Inventor
啓太 佐々木
徹 前田
大介 近藤
正幸 伊藤
伸一 山形
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALMT Corp
Sumitomo Electric Industries Ltd
Original Assignee
ALMT Corp
Sumitomo Electric Industries Ltd
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Publication of JPWO2024029311A5 publication Critical patent/JPWO2024029311A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
    • H10W20/4421—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
JP2023575654A 2022-08-04 2023-07-13 複合材料、ヒートスプレッダ及び半導体パッケージ Active JP7507988B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022124936 2022-08-04
JP2022124936 2022-08-04
PCT/JP2023/025926 WO2024029311A1 (ja) 2022-08-04 2023-07-13 複合材料、ヒートスプレッダ及び半導体パッケージ

Publications (3)

Publication Number Publication Date
JPWO2024029311A1 JPWO2024029311A1 (https=) 2024-02-08
JP7507988B1 true JP7507988B1 (ja) 2024-06-28
JPWO2024029311A5 JPWO2024029311A5 (https=) 2024-07-09

Family

ID=89849270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023575654A Active JP7507988B1 (ja) 2022-08-04 2023-07-13 複合材料、ヒートスプレッダ及び半導体パッケージ

Country Status (5)

Country Link
JP (1) JP7507988B1 (https=)
KR (1) KR102945417B1 (https=)
CN (1) CN119547205A (https=)
DE (1) DE112023003343T5 (https=)
WO (1) WO2024029311A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313331A (ja) * 1989-06-10 1991-01-22 Sumitomo Special Metals Co Ltd 熱膨張係数及び熱伝導率可変複合材料
JP2010245496A (ja) * 2009-03-17 2010-10-28 Welcon:Kk 熱伝導複合材及びその製造方法
WO2018020695A1 (ja) * 2016-07-28 2018-02-01 株式会社半導体熱研究所 放熱基板、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230043122A (ko) 2020-08-06 2023-03-30 스미토모덴키고교가부시키가이샤 복합 재료, 히트 스프레더 및 반도체 패키지

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313331A (ja) * 1989-06-10 1991-01-22 Sumitomo Special Metals Co Ltd 熱膨張係数及び熱伝導率可変複合材料
JP2010245496A (ja) * 2009-03-17 2010-10-28 Welcon:Kk 熱伝導複合材及びその製造方法
WO2018020695A1 (ja) * 2016-07-28 2018-02-01 株式会社半導体熱研究所 放熱基板、半導体パッケージ、及び半導体モジュール、並びに放熱基板の製造方法

Also Published As

Publication number Publication date
KR20250026339A (ko) 2025-02-25
KR102945417B1 (ko) 2026-03-27
WO2024029311A1 (ja) 2024-02-08
DE112023003343T5 (de) 2025-05-22
CN119547205A (zh) 2025-02-28
JPWO2024029311A1 (https=) 2024-02-08

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