JPWO2025115552A5 - - Google Patents

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Publication number
JPWO2025115552A5
JPWO2025115552A5 JP2025526777A JP2025526777A JPWO2025115552A5 JP WO2025115552 A5 JPWO2025115552 A5 JP WO2025115552A5 JP 2025526777 A JP2025526777 A JP 2025526777A JP 2025526777 A JP2025526777 A JP 2025526777A JP WO2025115552 A5 JPWO2025115552 A5 JP WO2025115552A5
Authority
JP
Japan
Prior art keywords
composite material
layers
metallic material
thickness
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025526777A
Other languages
English (en)
Japanese (ja)
Other versions
JP7744553B1 (ja
JPWO2025115552A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/039629 external-priority patent/WO2025115552A1/ja
Publication of JPWO2025115552A1 publication Critical patent/JPWO2025115552A1/ja
Application granted granted Critical
Publication of JP7744553B1 publication Critical patent/JP7744553B1/ja
Publication of JPWO2025115552A5 publication Critical patent/JPWO2025115552A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2025526777A 2023-12-01 2024-11-07 複合材料、ヒートスプレッダ、および半導体パッケージ Active JP7744553B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023203978 2023-12-01
JP2023203978 2023-12-01
PCT/JP2024/039629 WO2025115552A1 (ja) 2023-12-01 2024-11-07 複合材料、ヒートスプレッダ、および半導体パッケージ

Publications (3)

Publication Number Publication Date
JPWO2025115552A1 JPWO2025115552A1 (https=) 2025-06-05
JP7744553B1 JP7744553B1 (ja) 2025-09-25
JPWO2025115552A5 true JPWO2025115552A5 (https=) 2025-10-24

Family

ID=95896788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025526777A Active JP7744553B1 (ja) 2023-12-01 2024-11-07 複合材料、ヒートスプレッダ、および半導体パッケージ

Country Status (2)

Country Link
JP (1) JP7744553B1 (https=)
WO (1) WO2025115552A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313331A (ja) * 1989-06-10 1991-01-22 Sumitomo Special Metals Co Ltd 熱膨張係数及び熱伝導率可変複合材料
JPH0780272B2 (ja) * 1989-12-12 1995-08-30 住友特殊金属株式会社 熱伝導複合材料
JPH09312364A (ja) * 1996-05-22 1997-12-02 Hitachi Metals Ltd 電子部品用複合材料およびその製造方法
JP6549502B2 (ja) * 2016-02-26 2019-07-24 京セラ株式会社 放熱基板およびそれを用いた半導体パッケージならびに半導体モジュール
JP6304670B1 (ja) * 2017-04-14 2018-04-04 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール
JP7279522B2 (ja) * 2019-05-31 2023-05-23 株式会社アイシン 熱伝導シート及び熱伝導シート製造方法
KR20230043122A (ko) * 2020-08-06 2023-03-30 스미토모덴키고교가부시키가이샤 복합 재료, 히트 스프레더 및 반도체 패키지

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