JP7744553B1 - 複合材料、ヒートスプレッダ、および半導体パッケージ - Google Patents

複合材料、ヒートスプレッダ、および半導体パッケージ

Info

Publication number
JP7744553B1
JP7744553B1 JP2025526777A JP2025526777A JP7744553B1 JP 7744553 B1 JP7744553 B1 JP 7744553B1 JP 2025526777 A JP2025526777 A JP 2025526777A JP 2025526777 A JP2025526777 A JP 2025526777A JP 7744553 B1 JP7744553 B1 JP 7744553B1
Authority
JP
Japan
Prior art keywords
composite material
layers
layer
holes
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025526777A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025115552A5 (https=
JPWO2025115552A1 (https=
Inventor
啓太 佐々木
徹 前田
大介 近藤
正幸 伊藤
伸一 山形
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALMT Corp
Sumitomo Electric Industries Ltd
Original Assignee
ALMT Corp
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ALMT Corp, Sumitomo Electric Industries Ltd filed Critical ALMT Corp
Publication of JPWO2025115552A1 publication Critical patent/JPWO2025115552A1/ja
Application granted granted Critical
Publication of JP7744553B1 publication Critical patent/JP7744553B1/ja
Publication of JPWO2025115552A5 publication Critical patent/JPWO2025115552A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2025526777A 2023-12-01 2024-11-07 複合材料、ヒートスプレッダ、および半導体パッケージ Active JP7744553B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023203978 2023-12-01
JP2023203978 2023-12-01
PCT/JP2024/039629 WO2025115552A1 (ja) 2023-12-01 2024-11-07 複合材料、ヒートスプレッダ、および半導体パッケージ

Publications (3)

Publication Number Publication Date
JPWO2025115552A1 JPWO2025115552A1 (https=) 2025-06-05
JP7744553B1 true JP7744553B1 (ja) 2025-09-25
JPWO2025115552A5 JPWO2025115552A5 (https=) 2025-10-24

Family

ID=95896788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025526777A Active JP7744553B1 (ja) 2023-12-01 2024-11-07 複合材料、ヒートスプレッダ、および半導体パッケージ

Country Status (2)

Country Link
JP (1) JP7744553B1 (https=)
WO (1) WO2025115552A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313331A (ja) * 1989-06-10 1991-01-22 Sumitomo Special Metals Co Ltd 熱膨張係数及び熱伝導率可変複合材料
JPH03227621A (ja) * 1989-12-12 1991-10-08 Sumitomo Special Metals Co Ltd 熱伝導複合材料
JPH09312364A (ja) * 1996-05-22 1997-12-02 Hitachi Metals Ltd 電子部品用複合材料およびその製造方法
JP2017152606A (ja) * 2016-02-26 2017-08-31 京セラ株式会社 放熱基板およびそれを用いた半導体パッケージならびに半導体モジュール
JP2018182088A (ja) * 2017-04-14 2018-11-15 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール
JP2020198333A (ja) * 2019-05-31 2020-12-10 アイシン精機株式会社 熱伝導シート及び熱伝導シート製造方法
WO2022030197A1 (ja) * 2020-08-06 2022-02-10 住友電気工業株式会社 複合材料、ヒートスプレッダ及び半導体パッケージ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313331A (ja) * 1989-06-10 1991-01-22 Sumitomo Special Metals Co Ltd 熱膨張係数及び熱伝導率可変複合材料
JPH03227621A (ja) * 1989-12-12 1991-10-08 Sumitomo Special Metals Co Ltd 熱伝導複合材料
JPH09312364A (ja) * 1996-05-22 1997-12-02 Hitachi Metals Ltd 電子部品用複合材料およびその製造方法
JP2017152606A (ja) * 2016-02-26 2017-08-31 京セラ株式会社 放熱基板およびそれを用いた半導体パッケージならびに半導体モジュール
JP2018182088A (ja) * 2017-04-14 2018-11-15 株式会社半導体熱研究所 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール
JP2020198333A (ja) * 2019-05-31 2020-12-10 アイシン精機株式会社 熱伝導シート及び熱伝導シート製造方法
WO2022030197A1 (ja) * 2020-08-06 2022-02-10 住友電気工業株式会社 複合材料、ヒートスプレッダ及び半導体パッケージ

Also Published As

Publication number Publication date
WO2025115552A1 (ja) 2025-06-05
JPWO2025115552A1 (https=) 2025-06-05

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