JPWO2025115552A1 - - Google Patents
Info
- Publication number
- JPWO2025115552A1 JPWO2025115552A1 JP2025526777A JP2025526777A JPWO2025115552A1 JP WO2025115552 A1 JPWO2025115552 A1 JP WO2025115552A1 JP 2025526777 A JP2025526777 A JP 2025526777A JP 2025526777 A JP2025526777 A JP 2025526777A JP WO2025115552 A1 JPWO2025115552 A1 JP WO2025115552A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023203978 | 2023-12-01 | ||
| JP2023203978 | 2023-12-01 | ||
| PCT/JP2024/039629 WO2025115552A1 (ja) | 2023-12-01 | 2024-11-07 | 複合材料、ヒートスプレッダ、および半導体パッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025115552A1 true JPWO2025115552A1 (https=) | 2025-06-05 |
| JP7744553B1 JP7744553B1 (ja) | 2025-09-25 |
| JPWO2025115552A5 JPWO2025115552A5 (https=) | 2025-10-24 |
Family
ID=95896788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025526777A Active JP7744553B1 (ja) | 2023-12-01 | 2024-11-07 | 複合材料、ヒートスプレッダ、および半導体パッケージ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7744553B1 (https=) |
| WO (1) | WO2025115552A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313331A (ja) * | 1989-06-10 | 1991-01-22 | Sumitomo Special Metals Co Ltd | 熱膨張係数及び熱伝導率可変複合材料 |
| JPH0780272B2 (ja) * | 1989-12-12 | 1995-08-30 | 住友特殊金属株式会社 | 熱伝導複合材料 |
| JPH09312364A (ja) * | 1996-05-22 | 1997-12-02 | Hitachi Metals Ltd | 電子部品用複合材料およびその製造方法 |
| JP6549502B2 (ja) * | 2016-02-26 | 2019-07-24 | 京セラ株式会社 | 放熱基板およびそれを用いた半導体パッケージならびに半導体モジュール |
| JP6304670B1 (ja) * | 2017-04-14 | 2018-04-04 | 株式会社半導体熱研究所 | 放熱基板、放熱基板電極、半導体パッケージ、及び半導体モジュール |
| JP7279522B2 (ja) * | 2019-05-31 | 2023-05-23 | 株式会社アイシン | 熱伝導シート及び熱伝導シート製造方法 |
| KR20230043122A (ko) * | 2020-08-06 | 2023-03-30 | 스미토모덴키고교가부시키가이샤 | 복합 재료, 히트 스프레더 및 반도체 패키지 |
-
2024
- 2024-11-07 JP JP2025526777A patent/JP7744553B1/ja active Active
- 2024-11-07 WO PCT/JP2024/039629 patent/WO2025115552A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7744553B1 (ja) | 2025-09-25 |
| WO2025115552A1 (ja) | 2025-06-05 |
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