JPWO2023148848A1 - - Google Patents

Info

Publication number
JPWO2023148848A1
JPWO2023148848A1 JP2023578245A JP2023578245A JPWO2023148848A1 JP WO2023148848 A1 JPWO2023148848 A1 JP WO2023148848A1 JP 2023578245 A JP2023578245 A JP 2023578245A JP 2023578245 A JP2023578245 A JP 2023578245A JP WO2023148848 A1 JPWO2023148848 A1 JP WO2023148848A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023578245A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023148848A1 publication Critical patent/JPWO2023148848A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/794—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between a chip and a stacked insulating package substrate, interposer or RDL
JP2023578245A 2022-02-02 2022-02-02 Pending JPWO2023148848A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/004086 WO2023148848A1 (ja) 2022-02-02 2022-02-02 半導体装置及びその製造方法、並びに半導体装置用熱伝導シート

Publications (1)

Publication Number Publication Date
JPWO2023148848A1 true JPWO2023148848A1 (https=) 2023-08-10

Family

ID=87553381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023578245A Pending JPWO2023148848A1 (https=) 2022-02-02 2022-02-02

Country Status (3)

Country Link
US (1) US20250132219A1 (https=)
JP (1) JPWO2023148848A1 (https=)
WO (1) WO2023148848A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026063984A (ja) * 2024-10-01 2026-04-13 デクセリアルズ株式会社 熱伝導シート、及び熱伝導シートの製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259671A (ja) * 1992-01-07 1993-10-08 Toshiba Corp 放熱シートおよびその製造方法
JPH10513611A (ja) * 1995-09-27 1998-12-22 テキサス インスツルメンツ インコーポレイテッド Ｚ軸電導フィルムを含むマイクロ電子組立体
JP2000345040A (ja) * 1999-06-02 2000-12-12 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体の製造方法
JP2003110069A (ja) * 2001-09-28 2003-04-11 Kyocera Chemical Corp 熱伝導シートおよびそれを用いた複合部材
JP2004172286A (ja) * 2002-11-19 2004-06-17 Kyocera Chemical Corp 熱伝導シート
JP2006054221A (ja) * 2004-08-09 2006-02-23 Nitto Denko Corp 熱伝導シート
JP2006237058A (ja) * 2005-02-22 2006-09-07 Mitsubishi Materials Corp 絶縁回路基板およびパワーモジュール
JP2020194863A (ja) * 2019-05-28 2020-12-03 矢崎総業株式会社 放熱構造
JP2020198333A (ja) * 2019-05-31 2020-12-10 アイシン精機株式会社 熱伝導シート及び熱伝導シート製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259671A (ja) * 1992-01-07 1993-10-08 Toshiba Corp 放熱シートおよびその製造方法
JPH10513611A (ja) * 1995-09-27 1998-12-22 テキサス インスツルメンツ インコーポレイテッド Ｚ軸電導フィルムを含むマイクロ電子組立体
JP2000345040A (ja) * 1999-06-02 2000-12-12 Denki Kagaku Kogyo Kk 熱伝導性シリコーン成形体の製造方法
JP2003110069A (ja) * 2001-09-28 2003-04-11 Kyocera Chemical Corp 熱伝導シートおよびそれを用いた複合部材
JP2004172286A (ja) * 2002-11-19 2004-06-17 Kyocera Chemical Corp 熱伝導シート
JP2006054221A (ja) * 2004-08-09 2006-02-23 Nitto Denko Corp 熱伝導シート
JP2006237058A (ja) * 2005-02-22 2006-09-07 Mitsubishi Materials Corp 絶縁回路基板およびパワーモジュール
JP2020194863A (ja) * 2019-05-28 2020-12-03 矢崎総業株式会社 放熱構造
JP2020198333A (ja) * 2019-05-31 2020-12-10 アイシン精機株式会社 熱伝導シート及び熱伝導シート製造方法

Also Published As

Publication number Publication date
WO2023148848A1 (ja) 2023-08-10
US20250132219A1 (en) 2025-04-24

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