JPWO2023189131A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023189131A5
JPWO2023189131A5 JP2024511520A JP2024511520A JPWO2023189131A5 JP WO2023189131 A5 JPWO2023189131 A5 JP WO2023189131A5 JP 2024511520 A JP2024511520 A JP 2024511520A JP 2024511520 A JP2024511520 A JP 2024511520A JP WO2023189131 A5 JPWO2023189131 A5 JP WO2023189131A5
Authority
JP
Japan
Prior art keywords
via electrodes
semiconductor light
emitting device
main surface
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511520A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023189131A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/007524 external-priority patent/WO2023189131A1/ja
Publication of JPWO2023189131A1 publication Critical patent/JPWO2023189131A1/ja
Publication of JPWO2023189131A5 publication Critical patent/JPWO2023189131A5/ja
Pending legal-status Critical Current

Links

JP2024511520A 2022-03-31 2023-03-01 Pending JPWO2023189131A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022061325 2022-03-31
PCT/JP2023/007524 WO2023189131A1 (ja) 2022-03-31 2023-03-01 半導体発光装置

Publications (2)

Publication Number Publication Date
JPWO2023189131A1 JPWO2023189131A1 (https=) 2023-10-05
JPWO2023189131A5 true JPWO2023189131A5 (https=) 2024-12-10

Family

ID=88201103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511520A Pending JPWO2023189131A1 (https=) 2022-03-31 2023-03-01

Country Status (2)

Country Link
JP (1) JPWO2023189131A1 (https=)
WO (1) WO2023189131A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026048696A1 (ja) * 2024-08-29 2026-03-05 ローム株式会社 発光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124408A (ja) * 2001-10-11 2003-04-25 Tokuyama Corp 放熱性基板
JP2003197835A (ja) * 2001-12-26 2003-07-11 Tdk Corp 電力増幅モジュール及び電力増幅モジュール用要素集合体
JP2004311916A (ja) * 2003-02-21 2004-11-04 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2011054736A (ja) * 2009-09-01 2011-03-17 Sharp Corp 発光装置、平面光源および液晶表示装置
JP2017017057A (ja) * 2015-06-26 2017-01-19 日立金属株式会社 多層基板及びそれを用いた通信モジュール
US10325828B2 (en) * 2016-03-30 2019-06-18 Qorvo Us, Inc. Electronics package with improved thermal performance
CN112586093A (zh) * 2018-06-15 2021-03-30 Lg伊诺特有限公司 印刷电路板和包括该印刷电路板的相机装置

Similar Documents

Publication Publication Date Title
EP2272105B1 (de) Leuchtdiodenchip
JP2011249807A5 (https=)
TWI557943B (zh) 發光元件的電極結構
JP2016082231A5 (https=)
TW201707233A (zh) 半導體發光結構
DE102014102571A1 (de) Halbleiterlichtemitterelement
JP2021508947A5 (https=)
US11740401B2 (en) Method of manufacturing light emitting module
CN115148778B (zh) 一种显示面板和显示装置
JPWO2020174949A5 (https=)
US9287461B2 (en) Light-emitting diode and method for manufacturing the same
JP6658677B2 (ja) 発光装置の製造方法
JP2015503821A (ja) 背面発光型ｏｌｅｄデバイス及び背面発光型ｏｌｅｄデバイスの輝度を均一化するための方法
JPWO2023189131A5 (https=)
JP2013055318A5 (https=)
CN100576587C (zh) 用于led的结构化衬底
JP2016082229A5 (https=)
JP2007103725A (ja) 半導体発光装置
KR20140118654A (ko) 발광 다이오드 칩
CN115413369A (zh) 显示基板及其制备方法、显示装置
US9905628B2 (en) Display panel with varying conductive pattern zone
CN112669706B (zh) 柔性显示面板及其制作方法和电子设备
TWI638469B (zh) 固態發光裝置及製造固態發光裝置的方法
JP7640897B2 (ja) 発光モジュールの製造方法
WO2023189131A1 (ja) 半導体発光装置