CN118056272A - 散热构件 - Google Patents

散热构件 Download PDF

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Publication number
CN118056272A
CN118056272A CN202280066945.6A CN202280066945A CN118056272A CN 118056272 A CN118056272 A CN 118056272A CN 202280066945 A CN202280066945 A CN 202280066945A CN 118056272 A CN118056272 A CN 118056272A
Authority
CN
China
Prior art keywords
heat dissipation
dissipation member
silicon carbide
metal
member according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280066945.6A
Other languages
English (en)
Chinese (zh)
Inventor
后藤大助
太田宽朗
小柳和则
船津信宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN118056272A publication Critical patent/CN118056272A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202280066945.6A 2021-10-06 2022-10-03 散热构件 Pending CN118056272A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-164570 2021-10-06
JP2021164570 2021-10-06
PCT/JP2022/036942 WO2023058598A1 (ja) 2021-10-06 2022-10-03 放熱部材

Publications (1)

Publication Number Publication Date
CN118056272A true CN118056272A (zh) 2024-05-17

Family

ID=85804276

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280066945.6A Pending CN118056272A (zh) 2021-10-06 2022-10-03 散热构件

Country Status (5)

Country Link
US (1) US20240404913A1 (https=)
EP (1) EP4411810A4 (https=)
JP (2) JPWO2023058598A1 (https=)
CN (1) CN118056272A (https=)
WO (1) WO2023058598A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4913605B2 (ja) * 2005-01-20 2012-04-11 株式会社アライドマテリアル 半導体装置用部材の製造方法
JP4864593B2 (ja) * 2006-08-08 2012-02-01 電気化学工業株式会社 アルミニウム−炭化珪素質複合体の製造方法
JP5028147B2 (ja) * 2007-05-29 2012-09-19 株式会社アライドマテリアル 半導体装置用ヒートスプレッダとその製造方法
JP2011139000A (ja) * 2010-01-04 2011-07-14 Denki Kagaku Kogyo Kk パワーモジュール構造体及びその製造方法
US10233125B2 (en) * 2014-03-18 2019-03-19 Denka Company Limited Aluminium-silicon carbide composite, and power-module base plate
EP3605601B1 (en) * 2017-03-29 2023-09-13 Mitsubishi Materials Corporation Method for producing insulated circuit board with heat sink
JP7116689B2 (ja) * 2019-01-30 2022-08-10 デンカ株式会社 放熱部材およびその製造方法
JP7116690B2 (ja) * 2019-01-30 2022-08-10 デンカ株式会社 放熱部材およびその製造方法
JP2021164570A (ja) 2020-04-07 2021-10-14 王子ホールディングス株式会社 吸収性物品の製造方法
JP2020171196A (ja) 2020-07-27 2020-10-15 株式会社日立製作所 鉄道車両の電力変換装置

Also Published As

Publication number Publication date
EP4411810A4 (en) 2025-02-12
EP4411810A1 (en) 2024-08-07
US20240404913A1 (en) 2024-12-05
WO2023058598A1 (ja) 2023-04-13
JP2025183379A (ja) 2025-12-16
JPWO2023058598A1 (https=) 2023-04-13

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