JPWO2023058598A1 - - Google Patents
Info
- Publication number
- JPWO2023058598A1 JPWO2023058598A1 JP2023552869A JP2023552869A JPWO2023058598A1 JP WO2023058598 A1 JPWO2023058598 A1 JP WO2023058598A1 JP 2023552869 A JP2023552869 A JP 2023552869A JP 2023552869 A JP2023552869 A JP 2023552869A JP WO2023058598 A1 JPWO2023058598 A1 JP WO2023058598A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025153989A JP2025183379A (ja) | 2021-10-06 | 2025-09-17 | 放熱部材 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021164570 | 2021-10-06 | ||
| PCT/JP2022/036942 WO2023058598A1 (ja) | 2021-10-06 | 2022-10-03 | 放熱部材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025153989A Division JP2025183379A (ja) | 2021-10-06 | 2025-09-17 | 放熱部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023058598A1 true JPWO2023058598A1 (https=) | 2023-04-13 |
| JPWO2023058598A5 JPWO2023058598A5 (https=) | 2024-06-28 |
Family
ID=85804276
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023552869A Pending JPWO2023058598A1 (https=) | 2021-10-06 | 2022-10-03 | |
| JP2025153989A Pending JP2025183379A (ja) | 2021-10-06 | 2025-09-17 | 放熱部材 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025153989A Pending JP2025183379A (ja) | 2021-10-06 | 2025-09-17 | 放熱部材 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240404913A1 (https=) |
| EP (1) | EP4411810A4 (https=) |
| JP (2) | JPWO2023058598A1 (https=) |
| CN (1) | CN118056272A (https=) |
| WO (1) | WO2023058598A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006077755A1 (ja) * | 2005-01-20 | 2006-07-27 | A.L.M.T.Corp. | 半導体装置用部材とその製造方法 |
| JP2008042011A (ja) * | 2006-08-08 | 2008-02-21 | Denki Kagaku Kogyo Kk | アルミニウム−炭化珪素質複合体及びその製造方法 |
| JP2008300450A (ja) * | 2007-05-29 | 2008-12-11 | Allied Material Corp | 半導体装置用ヒートスプレッダとその製造方法 |
| JP2018170504A (ja) * | 2017-03-29 | 2018-11-01 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板の製造方法 |
| JP2020123638A (ja) * | 2019-01-30 | 2020-08-13 | デンカ株式会社 | 放熱部材およびその製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011139000A (ja) * | 2010-01-04 | 2011-07-14 | Denki Kagaku Kogyo Kk | パワーモジュール構造体及びその製造方法 |
| US10233125B2 (en) * | 2014-03-18 | 2019-03-19 | Denka Company Limited | Aluminium-silicon carbide composite, and power-module base plate |
| JP7116690B2 (ja) * | 2019-01-30 | 2022-08-10 | デンカ株式会社 | 放熱部材およびその製造方法 |
| JP2021164570A (ja) | 2020-04-07 | 2021-10-14 | 王子ホールディングス株式会社 | 吸収性物品の製造方法 |
| JP2020171196A (ja) | 2020-07-27 | 2020-10-15 | 株式会社日立製作所 | 鉄道車両の電力変換装置 |
-
2022
- 2022-10-03 WO PCT/JP2022/036942 patent/WO2023058598A1/ja not_active Ceased
- 2022-10-03 EP EP22878467.4A patent/EP4411810A4/en not_active Withdrawn
- 2022-10-03 JP JP2023552869A patent/JPWO2023058598A1/ja active Pending
- 2022-10-03 US US18/698,695 patent/US20240404913A1/en active Pending
- 2022-10-03 CN CN202280066945.6A patent/CN118056272A/zh active Pending
-
2025
- 2025-09-17 JP JP2025153989A patent/JP2025183379A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006077755A1 (ja) * | 2005-01-20 | 2006-07-27 | A.L.M.T.Corp. | 半導体装置用部材とその製造方法 |
| JP2008042011A (ja) * | 2006-08-08 | 2008-02-21 | Denki Kagaku Kogyo Kk | アルミニウム−炭化珪素質複合体及びその製造方法 |
| JP2008300450A (ja) * | 2007-05-29 | 2008-12-11 | Allied Material Corp | 半導体装置用ヒートスプレッダとその製造方法 |
| JP2018170504A (ja) * | 2017-03-29 | 2018-11-01 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板の製造方法 |
| JP2020123638A (ja) * | 2019-01-30 | 2020-08-13 | デンカ株式会社 | 放熱部材およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118056272A (zh) | 2024-05-17 |
| EP4411810A4 (en) | 2025-02-12 |
| EP4411810A1 (en) | 2024-08-07 |
| US20240404913A1 (en) | 2024-12-05 |
| WO2023058598A1 (ja) | 2023-04-13 |
| JP2025183379A (ja) | 2025-12-16 |
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