JPWO2023054193A5 - - Google Patents
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- Publication number
- JPWO2023054193A5 JPWO2023054193A5 JP2023551427A JP2023551427A JPWO2023054193A5 JP WO2023054193 A5 JPWO2023054193 A5 JP WO2023054193A5 JP 2023551427 A JP2023551427 A JP 2023551427A JP 2023551427 A JP2023551427 A JP 2023551427A JP WO2023054193 A5 JPWO2023054193 A5 JP WO2023054193A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- conductor
- fixing member
- wiring board
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021159899 | 2021-09-29 | ||
| JP2021159899 | 2021-09-29 | ||
| PCT/JP2022/035484 WO2023054193A1 (ja) | 2021-09-29 | 2022-09-22 | 配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054193A1 JPWO2023054193A1 (https=) | 2023-04-06 |
| JPWO2023054193A5 true JPWO2023054193A5 (https=) | 2024-06-11 |
| JP7599038B2 JP7599038B2 (ja) | 2024-12-12 |
Family
ID=85782597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551427A Active JP7599038B2 (ja) | 2021-09-29 | 2022-09-22 | 配線基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240397623A1 (https=) |
| EP (1) | EP4412408A1 (https=) |
| JP (1) | JP7599038B2 (https=) |
| TW (1) | TWI858398B (https=) |
| WO (1) | WO2023054193A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3344295B2 (ja) | 1997-09-25 | 2002-11-11 | イビデン株式会社 | 半田部材及びプリント配線板 |
| JPH1117309A (ja) | 1997-06-19 | 1999-01-22 | Hitachi Ltd | 電子部品の接続機構、これを用いた電子回路基板、接続機構の製造方法 |
| JP2005158360A (ja) * | 2003-11-21 | 2005-06-16 | Nec Saitama Ltd | 三次元基板間接続部品および三次元基板間接続構造 |
| KR100606654B1 (ko) * | 2005-08-01 | 2006-08-01 | 삼성전자주식회사 | 전자파 장해 저감용 페라이트 차폐 구조를 구비하는 반도체패키지 및 그 제조 방법 |
| WO2008001641A1 (en) * | 2006-06-27 | 2008-01-03 | Panasonic Corporation | Interconnect substrate and electronic circuit mounted structure |
| JP2016021550A (ja) * | 2014-06-17 | 2016-02-04 | 日本特殊陶業株式会社 | 配線基板及びその製造方法、配線基板用の柱状端子 |
| JP2016048728A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社村田製作所 | 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法 |
| JP2018019071A (ja) * | 2016-07-14 | 2018-02-01 | 住友ベークライト株式会社 | 半導体装置の製造方法 |
| WO2018079521A1 (ja) * | 2016-10-31 | 2018-05-03 | 京セラ株式会社 | アンテナ、モジュール基板およびモジュール |
| TWI681527B (zh) * | 2019-03-21 | 2020-01-01 | 創意電子股份有限公司 | 線路結構及晶片封裝件 |
-
2022
- 2022-09-22 EP EP22876060.9A patent/EP4412408A1/en not_active Withdrawn
- 2022-09-22 WO PCT/JP2022/035484 patent/WO2023054193A1/ja not_active Ceased
- 2022-09-22 US US18/693,299 patent/US20240397623A1/en active Pending
- 2022-09-22 JP JP2023551427A patent/JP7599038B2/ja active Active
- 2022-09-28 TW TW111136805A patent/TWI858398B/zh active
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