TWI858398B - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
TWI858398B
TWI858398B TW111136805A TW111136805A TWI858398B TW I858398 B TWI858398 B TW I858398B TW 111136805 A TW111136805 A TW 111136805A TW 111136805 A TW111136805 A TW 111136805A TW I858398 B TWI858398 B TW I858398B
Authority
TW
Taiwan
Prior art keywords
area
conductor
wiring conductor
fixing member
signal wiring
Prior art date
Application number
TW111136805A
Other languages
English (en)
Chinese (zh)
Other versions
TW202325109A (zh
Inventor
櫻井敬三
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202325109A publication Critical patent/TW202325109A/zh
Application granted granted Critical
Publication of TWI858398B publication Critical patent/TWI858398B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
TW111136805A 2021-09-29 2022-09-28 配線基板 TWI858398B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021159899 2021-09-29
JP2021-159899 2021-09-29

Publications (2)

Publication Number Publication Date
TW202325109A TW202325109A (zh) 2023-06-16
TWI858398B true TWI858398B (zh) 2024-10-11

Family

ID=85782597

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111136805A TWI858398B (zh) 2021-09-29 2022-09-28 配線基板

Country Status (5)

Country Link
US (1) US20240397623A1 (https=)
EP (1) EP4412408A1 (https=)
JP (1) JP7599038B2 (https=)
TW (1) TWI858398B (https=)
WO (1) WO2023054193A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070023902A1 (en) * 2005-08-01 2007-02-01 Eun-Seok Song Semiconductor package with ferrite shielding structure
JP2016048728A (ja) * 2014-08-27 2016-04-07 株式会社村田製作所 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法
TW201812939A (zh) * 2016-07-14 2018-04-01 日商住友電木股份有限公司 半導體裝置的製造方法
US20190319359A1 (en) * 2016-10-31 2019-10-17 Kyocera Corporation Antenna, module substrate, and module
TW202036827A (zh) * 2019-03-21 2020-10-01 創意電子股份有限公司 線路結構及晶片封裝件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3344295B2 (ja) 1997-09-25 2002-11-11 イビデン株式会社 半田部材及びプリント配線板
JPH1117309A (ja) 1997-06-19 1999-01-22 Hitachi Ltd 電子部品の接続機構、これを用いた電子回路基板、接続機構の製造方法
JP2005158360A (ja) * 2003-11-21 2005-06-16 Nec Saitama Ltd 三次元基板間接続部品および三次元基板間接続構造
WO2008001641A1 (en) * 2006-06-27 2008-01-03 Panasonic Corporation Interconnect substrate and electronic circuit mounted structure
JP2016021550A (ja) * 2014-06-17 2016-02-04 日本特殊陶業株式会社 配線基板及びその製造方法、配線基板用の柱状端子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070023902A1 (en) * 2005-08-01 2007-02-01 Eun-Seok Song Semiconductor package with ferrite shielding structure
JP2016048728A (ja) * 2014-08-27 2016-04-07 株式会社村田製作所 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法
TW201812939A (zh) * 2016-07-14 2018-04-01 日商住友電木股份有限公司 半導體裝置的製造方法
US20190319359A1 (en) * 2016-10-31 2019-10-17 Kyocera Corporation Antenna, module substrate, and module
TW202036827A (zh) * 2019-03-21 2020-10-01 創意電子股份有限公司 線路結構及晶片封裝件

Also Published As

Publication number Publication date
JP7599038B2 (ja) 2024-12-12
EP4412408A1 (en) 2024-08-07
US20240397623A1 (en) 2024-11-28
JPWO2023054193A1 (https=) 2023-04-06
WO2023054193A1 (ja) 2023-04-06
TW202325109A (zh) 2023-06-16

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