JP7599038B2 - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
JP7599038B2
JP7599038B2 JP2023551427A JP2023551427A JP7599038B2 JP 7599038 B2 JP7599038 B2 JP 7599038B2 JP 2023551427 A JP2023551427 A JP 2023551427A JP 2023551427 A JP2023551427 A JP 2023551427A JP 7599038 B2 JP7599038 B2 JP 7599038B2
Authority
JP
Japan
Prior art keywords
region
conductor
support
fixing member
wiring conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023551427A
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English (en)
Japanese (ja)
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JPWO2023054193A1 (https=
JPWO2023054193A5 (https=
Inventor
敬三 櫻井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023054193A1 publication Critical patent/JPWO2023054193A1/ja
Publication of JPWO2023054193A5 publication Critical patent/JPWO2023054193A5/ja
Application granted granted Critical
Publication of JP7599038B2 publication Critical patent/JP7599038B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2023551427A 2021-09-29 2022-09-22 配線基板 Active JP7599038B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021159899 2021-09-29
JP2021159899 2021-09-29
PCT/JP2022/035484 WO2023054193A1 (ja) 2021-09-29 2022-09-22 配線基板

Publications (3)

Publication Number Publication Date
JPWO2023054193A1 JPWO2023054193A1 (https=) 2023-04-06
JPWO2023054193A5 JPWO2023054193A5 (https=) 2024-06-11
JP7599038B2 true JP7599038B2 (ja) 2024-12-12

Family

ID=85782597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551427A Active JP7599038B2 (ja) 2021-09-29 2022-09-22 配線基板

Country Status (5)

Country Link
US (1) US20240397623A1 (https=)
EP (1) EP4412408A1 (https=)
JP (1) JP7599038B2 (https=)
TW (1) TWI858398B (https=)
WO (1) WO2023054193A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3344295B2 (ja) 1997-09-25 2002-11-11 イビデン株式会社 半田部材及びプリント配線板
JPH1117309A (ja) 1997-06-19 1999-01-22 Hitachi Ltd 電子部品の接続機構、これを用いた電子回路基板、接続機構の製造方法
JP2005158360A (ja) * 2003-11-21 2005-06-16 Nec Saitama Ltd 三次元基板間接続部品および三次元基板間接続構造
KR100606654B1 (ko) * 2005-08-01 2006-08-01 삼성전자주식회사 전자파 장해 저감용 페라이트 차폐 구조를 구비하는 반도체패키지 및 그 제조 방법
WO2008001641A1 (en) * 2006-06-27 2008-01-03 Panasonic Corporation Interconnect substrate and electronic circuit mounted structure
JP2016021550A (ja) * 2014-06-17 2016-02-04 日本特殊陶業株式会社 配線基板及びその製造方法、配線基板用の柱状端子
JP2016048728A (ja) * 2014-08-27 2016-04-07 株式会社村田製作所 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法
JP2018019071A (ja) * 2016-07-14 2018-02-01 住友ベークライト株式会社 半導体装置の製造方法
WO2018079521A1 (ja) * 2016-10-31 2018-05-03 京セラ株式会社 アンテナ、モジュール基板およびモジュール
TWI681527B (zh) * 2019-03-21 2020-01-01 創意電子股份有限公司 線路結構及晶片封裝件

Also Published As

Publication number Publication date
EP4412408A1 (en) 2024-08-07
US20240397623A1 (en) 2024-11-28
JPWO2023054193A1 (https=) 2023-04-06
WO2023054193A1 (ja) 2023-04-06
TW202325109A (zh) 2023-06-16
TWI858398B (zh) 2024-10-11

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