JPWO2023054193A1 - - Google Patents
Info
- Publication number
- JPWO2023054193A1 JPWO2023054193A1 JP2023551427A JP2023551427A JPWO2023054193A1 JP WO2023054193 A1 JPWO2023054193 A1 JP WO2023054193A1 JP 2023551427 A JP2023551427 A JP 2023551427A JP 2023551427 A JP2023551427 A JP 2023551427A JP WO2023054193 A1 JPWO2023054193 A1 JP WO2023054193A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021159899 | 2021-09-29 | ||
| JP2021159899 | 2021-09-29 | ||
| PCT/JP2022/035484 WO2023054193A1 (ja) | 2021-09-29 | 2022-09-22 | 配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054193A1 true JPWO2023054193A1 (https=) | 2023-04-06 |
| JPWO2023054193A5 JPWO2023054193A5 (https=) | 2024-06-11 |
| JP7599038B2 JP7599038B2 (ja) | 2024-12-12 |
Family
ID=85782597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551427A Active JP7599038B2 (ja) | 2021-09-29 | 2022-09-22 | 配線基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240397623A1 (https=) |
| EP (1) | EP4412408A1 (https=) |
| JP (1) | JP7599038B2 (https=) |
| TW (1) | TWI858398B (https=) |
| WO (1) | WO2023054193A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3344295B2 (ja) | 1997-09-25 | 2002-11-11 | イビデン株式会社 | 半田部材及びプリント配線板 |
| JPH1117309A (ja) | 1997-06-19 | 1999-01-22 | Hitachi Ltd | 電子部品の接続機構、これを用いた電子回路基板、接続機構の製造方法 |
| JP2005158360A (ja) * | 2003-11-21 | 2005-06-16 | Nec Saitama Ltd | 三次元基板間接続部品および三次元基板間接続構造 |
| KR100606654B1 (ko) * | 2005-08-01 | 2006-08-01 | 삼성전자주식회사 | 전자파 장해 저감용 페라이트 차폐 구조를 구비하는 반도체패키지 및 그 제조 방법 |
| WO2008001641A1 (en) * | 2006-06-27 | 2008-01-03 | Panasonic Corporation | Interconnect substrate and electronic circuit mounted structure |
| JP2016021550A (ja) * | 2014-06-17 | 2016-02-04 | 日本特殊陶業株式会社 | 配線基板及びその製造方法、配線基板用の柱状端子 |
| JP2016048728A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社村田製作所 | 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法 |
| JP2018019071A (ja) * | 2016-07-14 | 2018-02-01 | 住友ベークライト株式会社 | 半導体装置の製造方法 |
| WO2018079521A1 (ja) * | 2016-10-31 | 2018-05-03 | 京セラ株式会社 | アンテナ、モジュール基板およびモジュール |
| TWI681527B (zh) * | 2019-03-21 | 2020-01-01 | 創意電子股份有限公司 | 線路結構及晶片封裝件 |
-
2022
- 2022-09-22 EP EP22876060.9A patent/EP4412408A1/en not_active Withdrawn
- 2022-09-22 WO PCT/JP2022/035484 patent/WO2023054193A1/ja not_active Ceased
- 2022-09-22 US US18/693,299 patent/US20240397623A1/en active Pending
- 2022-09-22 JP JP2023551427A patent/JP7599038B2/ja active Active
- 2022-09-28 TW TW111136805A patent/TWI858398B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7599038B2 (ja) | 2024-12-12 |
| EP4412408A1 (en) | 2024-08-07 |
| US20240397623A1 (en) | 2024-11-28 |
| WO2023054193A1 (ja) | 2023-04-06 |
| TW202325109A (zh) | 2023-06-16 |
| TWI858398B (zh) | 2024-10-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240322 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240322 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240910 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241021 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20241105 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20241202 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7599038 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |