WO2023054193A1 - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
WO2023054193A1
WO2023054193A1 PCT/JP2022/035484 JP2022035484W WO2023054193A1 WO 2023054193 A1 WO2023054193 A1 WO 2023054193A1 JP 2022035484 W JP2022035484 W JP 2022035484W WO 2023054193 A1 WO2023054193 A1 WO 2023054193A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
conductor
support
fixing member
wiring conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/035484
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English (en)
French (fr)
Japanese (ja)
Inventor
敬三 櫻井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to EP22876060.9A priority Critical patent/EP4412408A1/en
Priority to JP2023551427A priority patent/JP7599038B2/ja
Priority to US18/693,299 priority patent/US20240397623A1/en
Publication of WO2023054193A1 publication Critical patent/WO2023054193A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors

Definitions

  • the present invention relates to wiring boards.
  • connection member metal column
  • the connection member is connected to terminals (pads) provided on the wiring board and pads provided on the electronic component so that both ends thereof are covered with metal such as solder.
  • high-frequency signals (20 GHz or higher) are easily transmitted on the surface of wiring conductors due to the skin effect. Therefore, in the case of a connection member connected to a signal wiring conductor, if the end of the connection member is covered with a metal such as solder, the difference in impedance between the signal wiring conductor and the metal such as solder will cause a high frequency signal. is easy to reflect. As a result, high frequency signals cannot be efficiently transmitted.
  • a wiring board includes a base, a wiring conductor positioned on the surface of the base, a support including a conductor on the surface, and a first fixing member connecting the wiring conductor and the support.
  • the wiring conductor has a first signal wiring conductor including a first region facing the support and a second region continuously extending from the first region.
  • the conductor of the support has a third region facing the first region of the first signal wiring conductor and a fourth region adjacent to the second region of the first signal wiring conductor.
  • the first fixing member is positioned outside the fourth region.
  • an electronic component mounting structure includes a wiring board and an electronic component.
  • FIG. 1 is an explanatory diagram for explaining a main part of an electronic component mounting structure including a wiring board according to an embodiment of the present disclosure
  • FIG. FIG. 2 is an enlarged explanatory view for explaining a case where a region X shown in FIG. 1 is viewed from the direction of an arrow A; 1. It is an enlarged explanatory view for explaining another embodiment when the region X shown in FIG. 1 is viewed from the direction of the arrow A.
  • FIG. It is an explanatory view for explaining a modification of a support. It is an explanatory view for explaining a modification of a support. It is an explanatory view for explaining a modification of a support. It is an explanatory view for explaining a modification of a support. It is an explanatory view for explaining a modification of a support.
  • FIG. 10 is an explanatory view showing a state in which the supporting body and the first signal wiring conductor shown in FIG. 9 are connected;
  • FIG. 10 is an explanatory view showing a state in which the supporting body and the first signal wiring conductor shown in FIG. 9 are separated;
  • 11 is a graph showing simulation results when the first signal wiring conductor and support shown in FIG. 10 are used.
  • the first fixing member is positioned on the surface of the support other than the fourth region. That is, the fourth region adjacent to the second region of the first signal wiring conductor is not covered with the first fixing member. Therefore, the wiring board according to the present disclosure can suppress reflection of high-frequency signals at the connection portion between the signal wiring conductor and the connection member, and can efficiently transmit high-frequency signals.
  • FIG. 1 is an explanatory diagram for explaining a main part of an electronic component mounting structure including a wiring board according to an embodiment of the present disclosure.
  • a wiring board 2 according to one embodiment includes a base 21 , wiring conductors 22 , a support 23 and a first fixing member 24 .
  • the substrate 21 has a structure in which insulating layers and conductor layers are alternately laminated.
  • the insulating layer included in the substrate 21 is made of resin such as epoxy resin, bismaleimide-triazine resin, polyimide resin, polyphenylene ether resin, and liquid crystal polymer. These resins may be used alone or in combination of two or more. Insulating particles may be dispersed in the insulating layer.
  • the insulating particles are not limited, and examples thereof include inorganic insulating fillers such as silica, alumina, barium sulfate, talc, clay, glass, calcium carbonate, and titanium oxide.
  • One of the multiple insulating layers is a core layer, and the remaining insulating layers are build-up insulating layers.
  • the core layer has a thickness of, for example, 0.05 mm or more and 2 mm or less.
  • the core layer generally has through-hole conductors for electrically connecting conductor layers on the upper and lower surfaces of the core layer. Through-hole conductors are located in through-holes penetrating through the upper and lower surfaces of the core layer.
  • a through-hole conductor is formed of, for example, a portion of a conductor layer. Through-hole conductors are connected to conductor layers 4 on both sides of the core layer.
  • the build-up insulating layer has a thickness of, for example, 5 ⁇ m or more and 50 ⁇ m or less.
  • the buildup insulating layers may be made of the same resin or different resins.
  • a conductor layer is located on the main surface of the insulating layer, that is, the main surface of the core layer and the main surface of the build-up insulating layer.
  • the conductor layer is made of a conductor such as copper, such as copper foil or copper plating.
  • the thickness of the conductor layer is not particularly limited, and is, for example, 3 ⁇ m or more and 45 ⁇ m or less. When multiple conductor layers are present, the conductor layers may be the same conductor or different conductors.
  • the buildup insulating layer has via-hole conductors for electrically connecting the conductor layers positioned above and below via the buildup insulating layer.
  • a via-hole conductor is obtained by depositing, for example, copper plating in a via-hole penetrating the upper and lower surfaces of the build-up insulating layer.
  • a via hole penetrating through the upper and lower surfaces of the buildup insulating layer is formed by laser processing such as CO 2 laser, UV-YAG laser, excimer laser, or the like.
  • a wiring conductor 22 is located on the surface of the substrate 21 .
  • the wiring conductors 22 are part of the conductor layers described above.
  • the wiring conductors 22 include a first signal wiring conductor 22a.
  • the first signal wiring conductor 22a includes a first region 22a1 and a second region 22a2 continuously extending from the first region 22a1.
  • FIG. 2 is an enlarged explanatory view for explaining the case where the region X shown in FIG. 1 is viewed from the direction of the arrow A.
  • the support 23 is not limited as long as it has a form containing a conductor on its surface. That is, the whole may be formed of a conductor such as metal, or may be in a form in which the conductor is positioned on the surface of an insulating member such as resin or ceramics.
  • the conductors positioned on the surface of the support 23 are, as shown in FIG. A fourth region 232 adjacent to the second region 22a2 is included.
  • the fourth region 232 adjacent to the second region 22a2 does not have to be in contact with the second region 22a2. That is, for example, as shown in FIG. 2, it may be a fourth region 232 that is in contact with and adjacent to the second region 22a2, and as shown in FIG. It may be a fourth region 232 adjacent to the second region 22a2.
  • the relationship between the sixth area 32a2 and the eighth area 234, which will be described later, is the same as the relationship between the second area 22a2 and the fourth area 232.
  • the support 23 is fixed to the wiring conductor 22 with a first fixing member 24 .
  • the first fixing member 24 is made of metal such as solder, gold, or silver.
  • the first fixing member 24 is located at a location other than the fourth region 232 included in the surface of the support 23 . That is, from the second region 22a2 of the first signal wiring conductor 22a to the fourth region 232 included in the surface of the support 23, the first fixing member 24 does not exist and is exposed. Thus, since the first fixing member 24 does not exist, the reflection of the high frequency signal is suppressed, and the high frequency signal can be efficiently transmitted.
  • the fourth area 232 where the first fixing member 24 as described above does not exist is formed, for example, as follows. First, a resist film is formed on a region corresponding to the fourth region 232 of the support 23 by applying or adhering a photosensitive ink or film to the support 23 and exposing and developing. Next, after connecting the support 23 with the resist film and the substrate 21 via the first fixing member 24, the resist film is removed with an aqueous solution (for example, aqueous sodium hydroxide solution) or solvent in which the resist film is soluble. A fourth region 232 is formed by removing.
  • aqueous solution for example, aqueous sodium hydroxide solution
  • the first fixing member 24 is preferably present at symmetrical positions across the fourth region 232 when viewed from above. When the first fixing members 24 are positioned symmetrically across the fourth region 232, it is possible to prevent the support 23 from being pulled by the surface tension of the first fixing members 24 and tilting.
  • the width of the fourth region 232 may be, for example, 1/3 or more of the width of the second region 22a2. If the width of the fourth region 232 is 1 ⁇ 3 or more of the width of the second region 22a2, the reflection of the high frequency signal is sufficiently reduced, and the high frequency signal can be transmitted more efficiently. Furthermore, the width of the fourth region 232 is preferably equal to or greater than the width of the second region 22a2. The width of the fourth region 232 is, for example, the shortest length along the conductor surface that connects the first fixing members 24 sandwiching the conductor of the support 23 in the direction parallel to the upper surface of the first signal wiring conductor 22a. It can be defined as length (W shown in FIG. 2).
  • the first fixing member 24 may be positioned on the first fixing member pad 24a as shown in FIG.
  • the first fixing member pad 24a and the first region 22a1 of the first signal wiring conductor 22a are preferably positioned apart from each other.
  • the first fixing member pad 24a and the first region 22a1 are positioned apart from each other in this manner, it is possible to reduce the spread of metal such as solder on the support 23.
  • the first fixing member pad 24a and the first region 22a1 may be connected by a conductor having a width narrower than the width of the first fixing member pad 24a and the width of the first region 22a1.
  • the width narrower than the width of the first fixing member pad 24a and the width of the first region 22a1 is, for example, the width of the first fixing member pad 24a in the extending direction of the first signal wiring conductor 22a or in the direction perpendicular to the extending direction. Both the largest width and the largest width of the first region 22a1 can be defined as small widths.
  • a thin film layer 25 may be positioned between the first region 22a1 of the first signal wiring conductor 22a and the third region 231 of the support 23, as shown in FIG. If such a thin film layer 25 is, for example, an antirust coating, oxidation of conductors located in the first region 22a1 and the third region 231 can be reduced.
  • the thin film layer 25 is, for example, a conductive material, made of metal such as solder, gold, or silver, and has a thickness of 15 ⁇ m or less.
  • the support 23 in FIGS. 2 and 3 has a cylindrical shape.
  • the support 23 is not limited as long as it has a shape that can connect to and support the electronic component 3 when the electronic component 3 described later is mounted.
  • the support 23 may have a prismatic shape, a spherical body, a cylindrical body, an annular body, or the like as shown in FIGS.
  • the height of the support 23 is set to, for example, approximately 0.1 mm or more and 2 mm or less in consideration of the size of the wiring board 2 according to one embodiment, the size of the electronic component to be mounted, and the like.
  • the conductor when the support 23 is a sphere, the conductor should be located on at least part of the surface. Specifically, as shown in FIG. 4, the conductor may be located on the entire surface, or the sphere itself may be a conductor such as metal. Alternatively, as shown in FIG. 5, the conductor may be located on part of the surface of the sphere. If the support 23 is made spherical in this way, it is possible to apply solder ball mounting technology (using a mask) to a BGA (Ball Grid Array) substrate. As a result, productivity of the wiring board 2 can be improved.
  • BGA Ball Grid Array
  • the conductor When the conductor is positioned on a part of the surface of the sphere, the conductor is positioned so that the signal is transmitted from the first signal wiring conductor 22a to the mounted electronic component 3. Specifically, the conductor may be positioned so as to be in contact with the first signal wiring conductor 22a (that is, at the position of the fourth region 232). If the conductor is located on part of the surface of the sphere, less change in impedance can be achieved.
  • the width of the conductor is not limited.
  • the conductor preferably has a width of, for example, 70% or more and 130% or less of the width of the second region 22a2 of the first signal wiring conductor 22a. If the width of the conductor is within such a range, the change in impedance can be further reduced.
  • the first fixing member 24 when the support 23 is a cylindrical body, the first fixing member 24 can be positioned in at least part of the hollow portion of the support 23 . With such a configuration, the support 23 can be fixed without exposing the first fixing member 24 to the surface of the support 23 . As a result, changes in impedance can be reduced. Even in such an embodiment, the first fixing member 24 may be further positioned on the surface of the support 23 other than the fourth region 232 in order to fix the support 23 more firmly. .
  • the hole formed for venting the air inside the hollow portion during manufacturing may remain as it is.
  • Such an air vent hole is formed, for example, in a region opposite to the fourth region 232 .
  • the support body 23 is an annular body
  • the outer peripheral surface of the annular body and the first signal wiring conductor 22a are fixed by the first fixing member 24 .
  • the third region 231 positioned on the outer peripheral surface of the annular body is fixed by the first fixing member 24 so as to face the first region 22a1 of the first signal wiring conductor 22a.
  • the fourth region 232 is located on the outer peripheral surface of the support 23 (annular body).
  • the outer peripheral surface and the inner peripheral surface are the surfaces, and the signal path can be secured on the outer peripheral surface and the inner peripheral surface. As a result, high-frequency signals can be transmitted more efficiently.
  • the columnar body When the supporting body 23 is a columnar body, as shown in FIG. 8, the columnar body is arranged so that the height direction (longitudinal direction) of the columnar body is parallel to the extension direction of the first signal wiring conductor 22a. It may be fixed by the first fixing member 24 to the wiring conductor 22a. That is, it may be fixed to the first signal wiring conductor 22a in a state in which the pillar is laid down.
  • the wiring board 2 having such a structure the accuracy in the height direction can be improved, and furthermore, the support 23 is less likely to fall down, and the reliability can be further improved.
  • the wiring board 2 having such a structure is easy to manufacture, and productivity can be improved.
  • FIG. 9 is an explanatory diagram for explaining a modification of the first signal wiring conductor 22a.
  • the width of the hook-shaped portion 22a3 decreases toward the tip.
  • the width of the portion of the first signal wiring conductor 22a other than the hook-shaped portion 22a3 is W1.
  • the width W1 is usually equal to the width W2 of the root of the hook-shaped portion 22a3 or wider than the width W2 of the root of the hook-shaped portion 22a3.
  • the width W2 of the root is wider than the width W3 of the tip, and the width is narrowed from the root to the tip.
  • FIG. 10 shows a state in which the support 23 and the first signal wiring conductor 22a shown in FIG. 9 are connected
  • FIG. 11 shows a state in which the support and the first signal wiring conductor shown in FIG. 9 are separated. show.
  • FIG. 10 when the first signal wiring conductor 22a having the hook-shaped portion 22a3 and the support 23 are used, the first region 22a1 and the second region 22a2 of the first signal wiring conductor 22a and the support A third region 231 and a fourth region 232 of body 23 are shown in FIG.
  • the first region 22a1 of the first signal wiring conductor 22a is located on the inner peripheral side of the upper surface of the hook-shaped portion 22a3.
  • a third region 231 is a region near the contact portion with the inner peripheral side of the hook-shaped portion 22a3 when the support 23 is connected to the hook-shaped portion 22a3. That is, the first area 22a1 and the third area 231 face each other.
  • the first area 22a1 located on the upper surface and the second area 22a2 located on the inner surface are separated for convenience of explanation.
  • the first region 22a1 and the second region 22a2 are continuous in the hook-shaped portion 22a3. That is, the first region 22a1 is positioned on the upper surface of the hook-shaped portion 22a3, and the second region 22a2 is positioned continuously from the first region 22a1 on the inner side surface of the hook-shaped portion 22a3.
  • a fourth region 232 is a region of the support 23 adjacent to the second region 22a2.
  • the third region 231 and the fourth region 232 of the support 23 are merely indicated by white lines for convenience of explanation. Actually, the third area 231 and the fourth area 232 are areas having a width near the white line.
  • Electric current has the property of selecting a short circuit. Therefore, when the first signal wiring conductor 22a has the hook-shaped portion 22a3, the electric signal circulates on the inner surface of the hook-shaped portion 22a3. Furthermore, solder can be mounted on the upper surface of the hook-shaped portion 22a3, and there is no need to provide the first fixing member pad 24a.
  • the electrical signal can naturally select a path with a small impedance step. Specifically, the width of the hook-shaped portion 22a3 becomes smaller as it approaches the tip, so that the impedance increases from the root to the tip of the hook-shaped portion 22a3. Therefore, the electric signal moves to the support 23 from the portion where the impedance matches in the hook-shaped portion 22a3.
  • FIG. 12 is a graph showing simulation results when the first signal wiring conductor 22a and the support 23 shown in FIG. 10 are used.
  • two substrates with a measured wiring impedance of 54 ⁇ were connected with a copper support (a sphere with a diameter of 0.5 mm), and wiring was performed using the TDR method (Time Domain Reflectometry) from one substrate edge. It was done by measuring along.
  • TDR method Time Domain Reflectometry
  • the width W1 was 350 ⁇ m
  • the width W2 was 150 ⁇ m
  • the width W3 was 100 ⁇ m.
  • the values of the widths W1, W2, and W3 are not limited, and may be appropriately set according to the characteristics of the material.
  • the width of the hook-shaped portion 22a3 becomes smaller as it approaches the tip, so that the electric signal becomes equal to the impedance step. naturally selects a path with a small . Therefore, as shown in FIG. 12, it can be seen that the impedance step in the BGA connection is smaller and the impedance is maintained substantially constant.
  • the wiring board 2 according to one embodiment the fourth region 232 adjacent to the second region 22a2 of the first signal wiring conductor 22a is not covered with the first fixing member 24. Therefore, the wiring board 2 according to one embodiment can reduce reflection of high-frequency signals at the connecting portion between the first signal wiring conductor 22 a and the first fixing member 24 . As a result, the wiring board 2 according to one embodiment can efficiently transmit high-frequency signals.
  • an electronic component mounting structure 1 includes a wiring board 2 and an electronic component 3 according to the embodiment described above.
  • the electronic component mounting structure 1 has a structure in which a wiring board 2 and an electronic component 3 are connected via a support 23 provided on the wiring board 2 .
  • the electronic component 3 is not limited as long as it is an electronic component 3 that is generally mounted on a wiring board.
  • Examples of such electronic components 3 include semiconductor integrated circuit elements, optoelectronic elements, wireless transmission/reception elements, and photoelectric conversion elements.
  • the electronic component 3 may include a second signal wiring conductor 32a, as shown in FIG.
  • the second signal wiring conductor 32 a and the support 23 included in the wiring board 2 are fixed by a second fixing member 34 .
  • the second fixing member 34 is also made of metal such as solder, gold, or silver.
  • the second signal wiring conductor 32a includes a fifth area 32a1 and a sixth area 32a2 continuously extending from the fifth area 32a1.
  • the conductor located on the surface of support 23 further includes seventh region 233 and eighth region 234, as shown in FIG.
  • the seventh region 233 of the support 23 faces the fifth region 32a1 of the second signal wiring conductor 32a.
  • the eighth region 234 of the support 23 is positioned adjacent to the sixth region 32a2 of the second signal wiring conductor 32a.
  • the second fixing member 34 is located at a location other than the eighth region 234 included in the surface of the support 23. That is, from the sixth region 32a2 of the second signal wiring conductor 32a to the eighth region 234 included in the surface of the support 23, the second fixing member 34 does not exist and is exposed. Thus, since the second fixing member 34 does not exist, the reflection of the high frequency signal is reduced, and the high frequency signal can be efficiently transmitted to the electronic component 3 .
  • Such an eighth region 234 can be formed by the same method as the fourth region 232 described above.
  • the second fixing member 34 is preferably present at symmetrical positions across the eighth region 234 when viewed from above. When the second fixing members 34 are present at symmetrical positions with the eighth region 234 interposed therebetween, it is possible to prevent the support 23 from being pulled by the surface tension of the second fixing members 34 and tilting.
  • the width of the eighth region 234 may be, for example, 1/3 or more of the width of the sixth region 32a2. If the width of the eighth region 234 is 1/3 or more of the width of the sixth region 32a2, the reflection of the high frequency signal is sufficiently reduced, and the electronic component 3 can transmit the high frequency signal more efficiently. Furthermore, the width of the eighth region 234 is preferably equal to or greater than the width of the sixth region 32a2.
  • the second fixing member 34 may be positioned on a second fixing member pad on the surface of the electronic component 3 (the surface on which the second signal wiring conductor 32a is positioned).
  • the second fixing member pad and the fifth region 32a1 of the second signal wiring conductor 32a are preferably positioned apart from each other.
  • the second fixing member pad and the fifth region 32 a 1 are positioned apart from each other in this way, it is possible to reduce the spread of metal such as solder on the support 23 .
  • the second fixing member pad and the fifth region 32a1 may be connected by a conductor having a width narrower than the width of the second fixing member pad and the width of the fifth region 32a1.
  • a thin film layer (not shown) may be positioned between the fifth region 32a1 of the second signal wiring conductor 32a and the seventh region 233 of the support 23.
  • the thin film layer is the same as the thin film layer 25 described above, and detailed description thereof will be omitted. The presence of such a thin film layer can reduce oxidation of the conductors located in the fifth region 32a1 and the seventh region 233. FIG.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2022/035484 2021-09-29 2022-09-22 配線基板 Ceased WO2023054193A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP22876060.9A EP4412408A1 (en) 2021-09-29 2022-09-22 Wiring board
JP2023551427A JP7599038B2 (ja) 2021-09-29 2022-09-22 配線基板
US18/693,299 US20240397623A1 (en) 2021-09-29 2022-09-22 Wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021159899 2021-09-29
JP2021-159899 2021-09-29

Publications (1)

Publication Number Publication Date
WO2023054193A1 true WO2023054193A1 (ja) 2023-04-06

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PCT/JP2022/035484 Ceased WO2023054193A1 (ja) 2021-09-29 2022-09-22 配線基板

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US (1) US20240397623A1 (https=)
EP (1) EP4412408A1 (https=)
JP (1) JP7599038B2 (https=)
TW (1) TWI858398B (https=)
WO (1) WO2023054193A1 (https=)

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JP3344295B2 (ja) 1997-09-25 2002-11-11 イビデン株式会社 半田部材及びプリント配線板
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WO2008001641A1 (en) * 2006-06-27 2008-01-03 Panasonic Corporation Interconnect substrate and electronic circuit mounted structure
JP2016021550A (ja) * 2014-06-17 2016-02-04 日本特殊陶業株式会社 配線基板及びその製造方法、配線基板用の柱状端子
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JP2018019071A (ja) * 2016-07-14 2018-02-01 住友ベークライト株式会社 半導体装置の製造方法
WO2018079521A1 (ja) * 2016-10-31 2018-05-03 京セラ株式会社 アンテナ、モジュール基板およびモジュール
TWI681527B (zh) * 2019-03-21 2020-01-01 創意電子股份有限公司 線路結構及晶片封裝件

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Publication number Priority date Publication date Assignee Title
JPH1117309A (ja) 1997-06-19 1999-01-22 Hitachi Ltd 電子部品の接続機構、これを用いた電子回路基板、接続機構の製造方法
JP3344295B2 (ja) 1997-09-25 2002-11-11 イビデン株式会社 半田部材及びプリント配線板
JP2005158360A (ja) * 2003-11-21 2005-06-16 Nec Saitama Ltd 三次元基板間接続部品および三次元基板間接続構造
WO2008001641A1 (en) * 2006-06-27 2008-01-03 Panasonic Corporation Interconnect substrate and electronic circuit mounted structure
JP2016021550A (ja) * 2014-06-17 2016-02-04 日本特殊陶業株式会社 配線基板及びその製造方法、配線基板用の柱状端子
JP2016048728A (ja) * 2014-08-27 2016-04-07 株式会社村田製作所 導電性ポスト、及び、導電性ポストを用いた積層基板の製造方法

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