JPWO2022256332A5 - - Google Patents
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- Publication number
- JPWO2022256332A5 JPWO2022256332A5 JP2023573325A JP2023573325A JPWO2022256332A5 JP WO2022256332 A5 JPWO2022256332 A5 JP WO2022256332A5 JP 2023573325 A JP2023573325 A JP 2023573325A JP 2023573325 A JP2023573325 A JP 2023573325A JP WO2022256332 A5 JPWO2022256332 A5 JP WO2022256332A5
- Authority
- JP
- Japan
- Prior art keywords
- patent document
- application publication
- adjusting
- determining
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163195705P | 2021-06-01 | 2021-06-01 | |
| US63/195,705 | 2021-06-01 | ||
| PCT/US2022/031622 WO2022256332A1 (en) | 2021-06-01 | 2022-05-31 | Electronic component bonding machines, and methods of measuring a distance on such machines |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024523149A JP2024523149A (ja) | 2024-06-28 |
| JPWO2022256332A5 true JPWO2022256332A5 (https=) | 2025-06-04 |
| JP2024523149A5 JP2024523149A5 (https=) | 2025-06-04 |
Family
ID=84194313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023573325A Pending JP2024523149A (ja) | 2021-06-01 | 2022-05-31 | 電子部品ボンディング装置およびそのような装置上の距離を測定する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12599020B2 (https=) |
| JP (1) | JP2024523149A (https=) |
| KR (1) | KR20240015650A (https=) |
| CN (1) | CN117355934A (https=) |
| TW (1) | TW202312859A (https=) |
| WO (1) | WO2022256332A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023200659A1 (en) | 2022-04-12 | 2023-10-19 | Kulicke And Soffa Industries, Inc. | Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05326633A (ja) | 1992-05-15 | 1993-12-10 | Sumitomo Electric Ind Ltd | 半導体チップ実装方法および実装装置 |
| JPH05326638A (ja) * | 1992-05-15 | 1993-12-10 | Sumitomo Electric Ind Ltd | 半導体チップ実装方法および実装装置 |
| DE4332236A1 (de) * | 1992-11-26 | 1995-03-23 | F E S Used Electronics Elektro | Anlage zur automatischen Entstückung |
| US5461472A (en) * | 1993-06-28 | 1995-10-24 | At&T Ipm Corp. | Method and apparatus for measuring the parallelism of two surfaces |
| JP2000012623A (ja) * | 1998-06-25 | 2000-01-14 | Sharp Corp | ボンディング装置及びボンディング方法 |
| JP2000164626A (ja) * | 1998-09-25 | 2000-06-16 | Fuji Photo Film Co Ltd | 部品のボンディング方法および装置 |
| JP3986196B2 (ja) * | 1999-02-17 | 2007-10-03 | 株式会社ルネサステクノロジ | 光半導体装置の製造方法 |
| JP2001024400A (ja) * | 1999-07-08 | 2001-01-26 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法及びその装置 |
| CH694931A5 (de) | 2000-03-17 | 2005-09-15 | Esec Trading Sa | Einrichtung fuer die Montage von Halbleiterchips auf einem Substrat. |
| JP3608497B2 (ja) | 2000-10-03 | 2005-01-12 | 三菱電機株式会社 | ボンディング装置 |
| US6705507B2 (en) | 2001-07-24 | 2004-03-16 | Kulicke & Soffa Investments, Inc. | Die attach system and process using cornercube offset tool |
| JP5249073B2 (ja) | 2009-02-12 | 2013-07-31 | 株式会社ニデック | 光干渉式距離計測装置 |
| JP5894745B2 (ja) | 2011-05-31 | 2016-03-30 | 浜松ホトニクス株式会社 | 集積回路検査装置 |
| US8875979B2 (en) * | 2012-05-04 | 2014-11-04 | Asm Technology Singapore Pte. Ltd. | Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck |
| JP5914868B2 (ja) * | 2013-05-22 | 2016-05-11 | パナソニックＩｐマネジメント株式会社 | 部品の実装装置 |
| US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
| US20150380379A1 (en) * | 2014-06-26 | 2015-12-31 | MRSI Systems, LLC | System and method for thermo-compression bonding of high bump count semiconductors |
| JP6388338B2 (ja) * | 2014-11-11 | 2018-09-12 | ボンドテック株式会社 | 電子部品装着装置および電子部品装着方法 |
| KR102425309B1 (ko) * | 2016-10-12 | 2022-07-26 | 삼성전자주식회사 | 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더 |
| US11031367B2 (en) * | 2016-10-25 | 2021-06-08 | Kulicke and Soffa Industries, In. | Bond head assemblies including reflective optical elements, related bonding machines, and related methods |
| WO2023200659A1 (en) * | 2022-04-12 | 2023-10-19 | Kulicke And Soffa Industries, Inc. | Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems |
-
2022
- 2022-05-31 WO PCT/US2022/031622 patent/WO2022256332A1/en not_active Ceased
- 2022-05-31 KR KR1020237042009A patent/KR20240015650A/ko active Pending
- 2022-05-31 CN CN202280037236.5A patent/CN117355934A/zh active Pending
- 2022-05-31 JP JP2023573325A patent/JP2024523149A/ja active Pending
- 2022-05-31 US US17/828,966 patent/US12599020B2/en active Active
- 2022-06-01 TW TW111120469A patent/TW202312859A/zh unknown
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