WO2022256332A1 - Electronic component bonding machines, and methods of measuring a distance on such machines - Google Patents

Electronic component bonding machines, and methods of measuring a distance on such machines Download PDF

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Publication number
WO2022256332A1
WO2022256332A1 PCT/US2022/031622 US2022031622W WO2022256332A1 WO 2022256332 A1 WO2022256332 A1 WO 2022256332A1 US 2022031622 W US2022031622 W US 2022031622W WO 2022256332 A1 WO2022256332 A1 WO 2022256332A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
bonding machine
target
component bonding
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2022/031622
Other languages
English (en)
French (fr)
Inventor
Matthew B. WASSERMAN
James E. Eder
Michael P. Schmidt-Lange
Matthew E. TARABULSKI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Industries Inc
Original Assignee
Kulicke and Soffa Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke and Soffa Industries Inc filed Critical Kulicke and Soffa Industries Inc
Priority to KR1020237042009A priority Critical patent/KR20240015650A/ko
Priority to JP2023573325A priority patent/JP2024523149A/ja
Priority to CN202280037236.5A priority patent/CN117355934A/zh
Publication of WO2022256332A1 publication Critical patent/WO2022256332A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • 9,136,243 (titled “5YSTEMS AND METH0D5 FOR DETERMINING AND ADJUSTING A LEVEL OF PARALLELISM RELATED TO BONDING OF SEMICONDUCTOR ELEMENTS") is an example reference disclosing systems and methods for determining and adjusting such a level of parallelism. It would be desirable to provide improved systems for, and methods of, determining and adjusting the parallelism related to bonding of electronic components on a bonding machine.
  • a method of measuring a distance on an electronic component bonding machine includes directing an optical signal toward at least one of an upper target of the electronic component bonding machine and a lower target of the electronic component bonding machine.
  • the upper target includes at least one of (i) a portion of a bond head assembly of the electronic component bonding machine and (ii) an electronic component carried by the bond head assembly.
  • the lower target includes at least one of (i) a portion of a support structure of the electronic component bonding machine and (ii) a substrate supported by the support structure.
  • the method also includes receiving, at an optical sensor, a reflected optical signal from at least one of the upper target and the lower target.
  • the method also includes analyzing the reflected optical signal to determine a distance between the upper target and the lower target.
  • a method of bonding includes the steps of: (a) providing an electronic component; (b) supporting a substrate with a support structure; (c) carrying the electronic component with a bond head assembly of an electronic component bonding machine; (d) directing an optical signal toward at least one of an upper target of the electronic component bonding machine and a lower target of the electronic component bonding machine, the upper target including at least one of (i) a portion of the bond head assembly of the electronic component bonding machine and (ii) the electronic component carried by the bond head assembly, the lower target including at least one of (i) a portion of the support structure of the electronic component bonding machine and (ii) the substrate supported by the support structure; (e) receiving, at an optical sensor, a reflected optical signal from at least one of the upper target and the lower target; (f) analyzing the reflected optical signal to determine a distance between the upper target and the lower target; and (g) commencing a bonding operation of bonding
  • the invention relates to a method of determining (e.g., measuring) a level of parallelism between the bonding tool and the support structure, for example, in order to verify that the calibration has been successful, so that bonding can proceed with confidence in achieving the desired bond height control. Further, the determination of the level of parallelism may be used to generate a desired correction motion/adjustment for the bonding tool (e.g., using an active/passive tilt control mechanism in the bonding tool) and/or the support structure.
  • a desired correction motion/adjustment for the bonding tool e.g., using an active/passive tilt control mechanism in the bonding tool
  • aspects of the invention relate to a measuring system for an electronic component bonding machine.
  • a bonding machine may be a die attach machine for performing a local reflow solder die attach process.
  • a bonding tool places and bonds a die or interposer to a substrate, chip, or wafer by melting and re-solidifying solder bumps on the die being placed.
  • the parallelism of the bonding tool to the substrate e.g., wafer
  • the invention relates to the use of an optical sensor (e.g., a non-contact optical sensor, a confocal chromatic sensor, an interferometric sensor, etc.) in a measuring system.
  • an optical sensor e.g., a non-contact optical sensor, a confocal chromatic sensor, an interferometric sensor, etc.
  • FIG. 1 is a perspective view of an electronic component bonding machine 100.
  • Electronic component bonding machine 100 includes a support structure 102 (e.g., carrying a substrate 104 (including lower target 104a)), a bond head assembly 106 (including a bonding tool 108, which may be a heated bonding tool, a nozzle, etc.) (where bonding tool 108 is illustrated carrying an electronic component 108a), and a measuring system 110.
  • FIG. 2 is a block diagram of a measuring system 210 (i.e., measuring system 110 of FIG. 1).
  • Measuring system 210 includes an optical assembly 210b, an optical source 210c, optical sensor 210d, and a computer 210e.
  • optical assembly 210b is configured to transmit optical signals to, and/or receive reflected optical signals from, an upper target 208a and/or a lower target 204a.
  • FIGS. 4-11 are a different exemplary configuration.
  • the upper target will include the electronic component
  • the lower target will include the substrate
  • an upper target material e.g., an electronic component
  • a lower target material e.g., a substrate
  • an array of distances between an upper target e.g., the electronic component
  • a lower target e.g., the substrate
  • an optical measuring system e.g., see measuring system 110 in FIG. 1, and measuring system 210 in FIG. 2
  • a profile related to parallelism between the upper target and the lower target is determined using the plurality of distances.
  • an angle between the upper target and the lower target is adjusted (e.g., using a tilt control mechanism) using the profile.
  • a bonding operation of bonding the electronic component to the substrate on the bonding machine is commenced.
  • FIG. 7 is a flow diagram illustrating a method of measuring a plurality of distances to generate a profile related to parallelism between the bond head assembly and the support structure on a bonding machine (e.g., bonding machine 100 in FIG. 1, bonding machine 200 in FIG.
  • an array of distances between an upper target (e.g., a portion of the bond head assembly) and a lower target (e.g., a portion of the support structure) is collected using an optical measuring system (e.g., see measuring system 110 in FIG. 1, and measuring system 210 in FIG. 2).
  • an optical measuring system e.g., see measuring system 110 in FIG. 1, and measuring system 210 in FIG. 2.
  • Step 704 using a computer on a bonding machine (or connected to the bonding machine), a profile related to parallelism between the upper target and the lower target is determined using the plurality of distances.
  • FIG. 8 is a flow diagram similar to FIG, 4.
  • an upper target material an electronic component
  • a lower target material a substrate
  • a bonding machine e.g., bonding machine 100 in FIG. 1, bonding machine 200 in FIG. 2.
  • an array of distances between an upper target and a lower target is collected using an optical measuring system
  • a profile related to parallelism between the upper target and the lower target is determined using the plurality of distances.
  • a determination is made as to whether the level of parallelism is acceptable.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/US2022/031622 2021-06-01 2022-05-31 Electronic component bonding machines, and methods of measuring a distance on such machines Ceased WO2022256332A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020237042009A KR20240015650A (ko) 2021-06-01 2022-05-31 전자 부품 본딩 머신, 및 이러한 머신 상의 거리를 측정하는 방법
JP2023573325A JP2024523149A (ja) 2021-06-01 2022-05-31 電子部品ボンディング装置およびそのような装置上の距離を測定する方法
CN202280037236.5A CN117355934A (zh) 2021-06-01 2022-05-31 电子部件接合机以及在这种接合机上测量距离的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163195705P 2021-06-01 2021-06-01
US63/195,705 2021-06-01

Publications (1)

Publication Number Publication Date
WO2022256332A1 true WO2022256332A1 (en) 2022-12-08

Family

ID=84194313

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2022/031622 Ceased WO2022256332A1 (en) 2021-06-01 2022-05-31 Electronic component bonding machines, and methods of measuring a distance on such machines

Country Status (6)

Country Link
US (1) US12599020B2 (https=)
JP (1) JP2024523149A (https=)
KR (1) KR20240015650A (https=)
CN (1) CN117355934A (https=)
TW (1) TW202312859A (https=)
WO (1) WO2022256332A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023200659A1 (en) 2022-04-12 2023-10-19 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems

Citations (5)

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Publication number Priority date Publication date Assignee Title
US20010035450A1 (en) * 2000-03-17 2001-11-01 Eugen Mannhart Apparatus for mounting semiconductor chips on a substrate
US20030019909A1 (en) * 2001-07-24 2003-01-30 Beatson David T. Die attach system and process using cornercube offset tool
KR20140033368A (ko) * 2011-05-31 2014-03-18 하마마츠 포토닉스 가부시키가이샤 집적 회로 검사 장치
US20150380379A1 (en) * 2014-06-26 2015-12-31 MRSI Systems, LLC System and method for thermo-compression bonding of high bump count semiconductors
US20150380380A1 (en) * 2013-12-03 2015-12-31 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements

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JPH05326638A (ja) * 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
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JP2000012623A (ja) * 1998-06-25 2000-01-14 Sharp Corp ボンディング装置及びボンディング方法
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JP5249073B2 (ja) 2009-02-12 2013-07-31 株式会社ニデック 光干渉式距離計測装置
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WO2023200659A1 (en) * 2022-04-12 2023-10-19 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010035450A1 (en) * 2000-03-17 2001-11-01 Eugen Mannhart Apparatus for mounting semiconductor chips on a substrate
US20030019909A1 (en) * 2001-07-24 2003-01-30 Beatson David T. Die attach system and process using cornercube offset tool
KR20140033368A (ko) * 2011-05-31 2014-03-18 하마마츠 포토닉스 가부시키가이샤 집적 회로 검사 장치
US20150380380A1 (en) * 2013-12-03 2015-12-31 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
US20150380379A1 (en) * 2014-06-26 2015-12-31 MRSI Systems, LLC System and method for thermo-compression bonding of high bump count semiconductors

Also Published As

Publication number Publication date
KR20240015650A (ko) 2024-02-05
CN117355934A (zh) 2024-01-05
US12599020B2 (en) 2026-04-07
TW202312859A (zh) 2023-03-16
JP2024523149A (ja) 2024-06-28
US20220384384A1 (en) 2022-12-01

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