TW202312859A - 電子元件接合機以及在該接合機上測量距離的方法 - Google Patents

電子元件接合機以及在該接合機上測量距離的方法 Download PDF

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Publication number
TW202312859A
TW202312859A TW111120469A TW111120469A TW202312859A TW 202312859 A TW202312859 A TW 202312859A TW 111120469 A TW111120469 A TW 111120469A TW 111120469 A TW111120469 A TW 111120469A TW 202312859 A TW202312859 A TW 202312859A
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TW
Taiwan
Prior art keywords
electronic component
bonding machine
target
bonding
substrate
Prior art date
Application number
TW111120469A
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English (en)
Chinese (zh)
Inventor
馬修 Ｂ 沃瑟曼
詹姆士 Ｅ 艾德
蘭格 麥克 Ｐ 史密特
馬修 Ｅ 塔拉布爾斯基
Original Assignee
美商庫利克和索夫工業公司
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Publication date
Application filed by 美商庫利克和索夫工業公司 filed Critical 美商庫利克和索夫工業公司
Publication of TW202312859A publication Critical patent/TW202312859A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW111120469A 2021-06-01 2022-06-01 電子元件接合機以及在該接合機上測量距離的方法 TW202312859A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163195705P 2021-06-01 2021-06-01
US63/195,705 2021-06-01

Publications (1)

Publication Number Publication Date
TW202312859A true TW202312859A (zh) 2023-03-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW111120469A TW202312859A (zh) 2021-06-01 2022-06-01 電子元件接合機以及在該接合機上測量距離的方法

Country Status (6)

Country Link
US (1) US12599020B2 (https=)
JP (1) JP2024523149A (https=)
KR (1) KR20240015650A (https=)
CN (1) CN117355934A (https=)
TW (1) TW202312859A (https=)
WO (1) WO2022256332A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023200659A1 (en) 2022-04-12 2023-10-19 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326633A (ja) 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
JPH05326638A (ja) * 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
DE4332236A1 (de) * 1992-11-26 1995-03-23 F E S Used Electronics Elektro Anlage zur automatischen Entstückung
US5461472A (en) * 1993-06-28 1995-10-24 At&T Ipm Corp. Method and apparatus for measuring the parallelism of two surfaces
JP2000012623A (ja) * 1998-06-25 2000-01-14 Sharp Corp ボンディング装置及びボンディング方法
JP2000164626A (ja) * 1998-09-25 2000-06-16 Fuji Photo Film Co Ltd 部品のボンディング方法および装置
JP3986196B2 (ja) * 1999-02-17 2007-10-03 株式会社ルネサステクノロジ 光半導体装置の製造方法
JP2001024400A (ja) * 1999-07-08 2001-01-26 Matsushita Electric Ind Co Ltd 電子部品の実装方法及びその装置
CH694931A5 (de) 2000-03-17 2005-09-15 Esec Trading Sa Einrichtung fuer die Montage von Halbleiterchips auf einem Substrat.
JP3608497B2 (ja) 2000-10-03 2005-01-12 三菱電機株式会社 ボンディング装置
US6705507B2 (en) 2001-07-24 2004-03-16 Kulicke & Soffa Investments, Inc. Die attach system and process using cornercube offset tool
JP5249073B2 (ja) 2009-02-12 2013-07-31 株式会社ニデック 光干渉式距離計測装置
JP5894745B2 (ja) 2011-05-31 2016-03-30 浜松ホトニクス株式会社 集積回路検査装置
US8875979B2 (en) * 2012-05-04 2014-11-04 Asm Technology Singapore Pte. Ltd. Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck
JP5914868B2 (ja) * 2013-05-22 2016-05-11 パナソニックＩｐマネジメント株式会社 部品の実装装置
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
US20150380379A1 (en) * 2014-06-26 2015-12-31 MRSI Systems, LLC System and method for thermo-compression bonding of high bump count semiconductors
JP6388338B2 (ja) * 2014-11-11 2018-09-12 ボンドテック株式会社 電子部品装着装置および電子部品装着方法
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
US11031367B2 (en) * 2016-10-25 2021-06-08 Kulicke and Soffa Industries, In. Bond head assemblies including reflective optical elements, related bonding machines, and related methods
WO2023200659A1 (en) * 2022-04-12 2023-10-19 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems

Also Published As

Publication number Publication date
KR20240015650A (ko) 2024-02-05
CN117355934A (zh) 2024-01-05
US12599020B2 (en) 2026-04-07
WO2022256332A1 (en) 2022-12-08
JP2024523149A (ja) 2024-06-28
US20220384384A1 (en) 2022-12-01

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